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81.
Through‐silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as threedimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo‐ and heterogeneous device integration. In TSV, a destructive cross‐sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer‐to‐wafer variation in volume manufacturing. 相似文献
82.
针对距离扩展目标的检测问题,提出一种自适应归一化匹配滤波(ANMF)、非线性映射和高阶互相关积累(HOCC)相结合的目标检测方法。首先将距离像按慢时间进行脉冲维划分,得到若干脉冲子区间,再对每个脉冲子区间进行自适应归一化匹配滤波,然后利用非线性函数对滤波的输出进行非线性映射处理,最后将非线性映射的输出进行高阶互相关积累,从而获得检测统计量。仿真实验结果表明,在检测概率为80%时,所述方法比传统 ANMF 方法所需的信杂比低1 dB 左右,性能较为优越。 相似文献
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讨论了铜柱凸块生产工艺中籽晶层厚度和电镀电流密度等关键制程因素对铜柱凸块共面性、晶圆应力、凸块剖面结构和电镀效率等方面的影响.研究结果表明增加电镀籽晶层厚度可以提高凸块共面性;在相同电镀电流密度下,籽晶层越厚,晶圆应力越大;相同的籽晶层厚度下,随着电镀电流密度增加,晶圆应力增加,但增加速率逐渐变慢;低电流密度下铜柱凸块顶部形成盘碟形状的剖面结构,而高电流密度容易使铜柱顶部形成圆拱剖面结构;采用阶梯电镀速率电镀方法与均一慢电镀速率电镀出的铜柱凸块共面性一致,而采用阶梯电镀法既能够提高电镀效率又可以得到较好的铜柱顶部盘碟形剖面结构. 相似文献
85.
86.
The mixing roughness information depth model is frequently used for the quantification of sputter depth profiles. In general, the solution of the convolution integral for any kind of in‐depth distributions is achieved by numerical methods. For a thin delta layer, an analytical depth resolution function is presented, which enables a simple and user‐friendly quantification of measured delta layer profiles in AES, XPS and SIMS. Copyright © 2013 John Wiley & Sons, Ltd. 相似文献
87.
Marta Zalewska Agnieszka Gawin Milena Ściskalska Marcin Moczulski Halina Milnerowicz 《International journal of environmental analytical chemistry》2013,93(14-15):1422-1434
Metallurgy processes are associated with many hazardous and toxic factors, including heavy metals. Exposure to heavy metals can cause damage to different organs, which can be observed through variation in the concentration of proteins in serum. The aim of this study was to evaluate the changes in a serum protein profile of copper smelters exposed to As, Cd and Pb ions, and xenobiotics present in tobacco smoke. A 2.3-fold higher Pb concentration in the blood and a 2.8-fold greater As concentration have been observed in the urine of non-smoking smelters compared to a control group. In the blood of smoking smelters, Cd concentration was 2-fold higher than in non-smoking ones. Serum proteins were separated by capillary electrophoresis, and in the group of non-smoking smelters, a higher amount of α1-globulins was observed. In the group of smoking smelters, fewer α1-globulins were noted. Furthermore, a greater amount of α2-globulins in the serum of smoking and non-smoking workers in relation to the control group was revealed. A positive correlation between the concentration of Cd in the blood and the content of a fraction containing α1- and α2-globulins was revealed. Urine Cd concentration was found to be negatively associated with the α1- and α2-globulins fraction. Observed abnormalities in the proteins profiles of smelters can be important markers when assessing exposure to heavy metals and in the early diagnosis of diseases caused by them. 相似文献
88.
We consider sequences of random variables whose probability generating functions have only roots on the unit circle, which has only been sporadically studied in the literature. We show that the random variables are asymptotically normally distributed if and only if the fourth central and normalized (by the standard deviation) moment tends to 3, in contrast to the common scenario for polynomials with only real roots for which a central limit theorem holds if and only if the variance is unbounded. We also derive a representation theorem for all possible limit laws and apply our results to many concrete examples in the literature, ranging from combinatorial structures to numerical analysis, and from probability to analysis of algorithms. © 2013 Wiley Periodicals, Inc. Random Struct. Alg., 46,707–738, 2015 相似文献
89.
90.
T. Terlier R. Tiron A. Gharbi X. Chevalier M. Veillerot E. Martinez J.‐P. Barnes 《Surface and interface analysis : SIA》2014,46(2):83-91
Directed self‐assembly of block copolymers (BCPs) is a promising candidate for next generation nanolithography. In order to validate a given pattern, the lateral and in‐depth distributions of the blocks should be well characterized; for the latter, time‐of‐flight (ToF) SIMS is a particularly well‐adapted technique. Here, we use an ION‐TOF ToF‐SIMS V in negative mode to provide qualitative information on the in‐depth organization of polystyrene‐b‐polymethylmethacrylate (PS‐b‐PMMA) BCP thin films. Using low‐energy Cs+ sputtering and Bi3+ as the analysis ions, PS and PMMA homopolymer films are first analyzed in order to identify the characteristic secondary ions for each block. PS‐b‐PMMA BCPs are then characterized showing that self‐assembled nanodomains are clearly observed after annealing. We also demonstrate that the ToF‐SIMS technique is able to distinguish between the different morphologies of BCP investigated in this work (lamellae, spheres or cylinders). ToF‐SIMS characterization on BCP is in good agreement with XPS analysis performed on the same samples. Copyright © 2013 John Wiley & Sons, Ltd. 相似文献