Determination of lead in environmental reference materials (plant materials) by slurry-ETA-AAS

Slurry-ETA-AAS is used to determine lead in plant materials. The stability of the slurry was studied and it was shown that, when NH₄H₂PO₄ modifier is added, the shape of the time resolved absorbance signal for the sample and the standards is similar and the calibration line obtained using aqueous standards is parallel to the standard addition line. Results obtained for several reference materials (lead contents between 6.1 and 64.4 g/g) were in good agreement with the certified value, the relative standard deviation being 3–9%.     

不同压力下螯合剂浓度在碱性Cu CMP中的影响

We propose the action mechanism of Cu chemical mechanical planarization(CMP) in an alkaline solution.Meanwhile,the effect of abrasive mass fraction on the copper removal rate and within wafer non-uniformity(WIWNU) have been researched.In addition,we have also investigated the synergistic effect between the applied pressure and the FA/O chelating agent on the copper removal rate and WIWNU in the CMP process.Based on the experimental results,we chose several concentrations of the FA/O chelating agent,which added in the slurry can obtain a relatively high removal rate and a low WIWNU after polishing,to investigate the planarization performance of the copper slurry under different applied pressure conditions.The results demonstrate that the copper removal rate can reach 6125 °/min when the abrasive concentration is 3 wt.%.From the planarization experimental results,we can see that the residual step height is 562 ° after excessive copper of the wafer surface is eliminated.It denotes that a good polishing result is acquired when the FA/O chelating agent concentration and applied pressure are fixed at 3 vol% and 1 psi,respectively.All the results set forth here are very valuable for the research and development of alkaline slurry.     

铜互连制程中酸碱性抛光液的平坦化效果评估

We observed and analyzed the acid and HEBUT alkaline of Cu chemical mechanical polishing(CMP)slurry to evaluate their effects. Material analysis has shown that the planarity surfaces and the removal rate of alkaline slurry are better than the acid slurry during metal CMP processes. The global surface roughness and the small-scale surface roughness by 1010 m2 of copper film polished by the SVTC slurry are 1.127 nm and2.49 nm. However, it is found that the surface roughnesses of copper films polished by the HEBUT slurry are 0.728 nm and 0.215 nm. All other things being equal, the remaining step heights of copper films polished by the SVTC slurry and HEBUT slurry are respectively 150 nm and 50 nm. At the end of the polishing process, the dishing heights of the HEBUT slurry and the SVTC slurry are approximately both 30 nm, the erosion heights of the HEBUT slurry and the SVTC slurry are approximately both 20 nm. The surface states of the copper film after CMP are tested,and the AFM results of two samples are obviously seen. The surface polished by SVTC slurry shows many spikes.This indicates that the HEBUT alkaline slurry is promising for inter-level dielectric(ILD) applications in ultra large-scale integrated circuits(ULSI) technology.     

中国不同变质程度煤制备水煤浆的性质研究

在相同的制浆条件下,以中国煤种资源数据库为依据,考察了24种不同地区、不同变质程度煤制备成水煤浆的成浆性、流变性及静态稳定性。结果表明,山西阳泉、山东淄博石谷、河北下花园等煤种适宜制浆,这些煤的浆体质量分数均可达到66%以上,浆体呈假塑性流体,且煤浆产生软沉淀的静态稳定性均在15 d以上;山西潞安石圪节、安徽淮南、淮北石台等煤成浆性较好,稳定性在7 d左右,浆体呈胀塑性流体;山东枣庄八一、甘肃靖远红会、河南鹤壁等煤可达到较高的煤浆质量分数,浆体流变性及稳定性均较差,其他的煤则不适宜用于制备水煤浆。     

焙烧温度对铁基催化剂催化浆态床F-T合成反应性能的影响

 采用连续共沉淀与喷雾干燥成型技术相结合的方法制备了微球形Fe-Cu-K-SiO2催化剂,并考察了焙烧温度对催化剂的结构和织构性质的影响. 结果表明,催化剂具有较好的织构和结构热稳定性,粘结剂SiO2起到了分散和稳定α-Fe2O3晶相的作用. 随着焙烧温度的升高,催化剂的比表面积逐渐减小,α-Fe2O3晶粒逐渐增大,催化剂体相中的Cu和K原子向表面富集,且Cu向表面的迁移更明显; 同时,催化剂中的α-Fe2O3和CuO相发生了一定程度的离析,Cu的助剂作用减弱,使催化剂在合成气气氛下难于还原碳化. 催化剂在n(H2)/n(CO)=0.67,GHSV=2.0 L/(g·h),p=1.5 MPa和θ=250 ℃下的浆态床F-T合成反应评价结果表明,升高焙烧温度,催化剂的初活性和最高活性下降,但运行稳定性提高,而且有效地抑制了CH4的生成,明显促进了烃产物向高碳数方向移动. 反应600 h后卸载下的催化剂的形貌观测表明,催化剂的磨损主要是由化学磨损引起的,提高焙烧温度可明显改善其抗磨损性能,焙烧温度高于400 ℃时,催化剂具有较好的抗磨损性能.