VcNa树脂法转化制备Vc的研究

树脂法取代维生素C生产中硫酸酸化及后处理工艺,可以降低生产成本,简化工艺,得到优质的Vc成品。用HD－8大孔阳离子交换树脂酸化,回收率在99％以上;D315大孔阴离子交换树脂用以除去SO42-、Cl-,回收率在98．5％以上,得到的严品达到优质品指标。     

Comparison of polyelectrolytes applied in drinking water treatment

The applicability of an inorganic, polyaluminium-type flocculent was tested comparing to polyacrylamides — an organic-type flocculent — used in the drinking water treatment process. The efficiency of this inorganic flocculent in the removal of suspended solids and also in minimizing the residual concentrations of the dissolved organic and inorganic micro-pollutants was checked in the case of purifying filter backwash water. Experimental data showed the advantage of the inorganic flocculent applying procedure as a part of recent water treatment technology. The applied polyaluminium-salt was economically competitive, improved the process stability and also ensured good water quality parameters.     

基于完全波形的反射和吸收特征的非线性光谱相似性度量与检索——非线性光谱角制图

提出了一种新的光谱相似性度量方法,即非线性光谱角制图。该方法一方面利用核主成分分析(PCA)方法实现非线性变换和去除波段间的强相关性;另一方面,在变换空间中合并光谱的反射特征和吸收特征。最后,用光谱角制图方法对合并后的反射和吸收特征向量进行相似性度量。实验表明该方法在光谱相似性度量和检索中是有效的。     

液体喷射抛光时各工艺参数对材料去除量的影响

以实验为基础,研究了液体喷射抛光技术的各工艺参数,包括喷射角、工作压力、工作距离和作用时间等参量对工件材料去除的影响。获得了它们之间的关系曲线;得出了工件材料去除的规律;确定了液体喷射抛光时的最佳参数组合。为进一步研究液体喷射抛光时各工艺参数对工件表面粗糙度的影响奠定了基础。     

Influence of slurry components on uniformity in copper chemical mechanical planarization

Many researchers studying copper chemical mechanical planarization (CMP) have been focused on mechanisms of copper removal using various chemicals. On the basis of these previous works, we studied the effect of slurry components on uniformity. Chemical mechanical planarization of copper was performed using citric acid (C₆H₈O₇), hydrogen peroxide (H₂O₂), colloidal silica, and benzotriazole (BTA, C₆H₄N₃H) as a complexing agent, an oxidizer, an abrasive, and a corrosion inhibitor, respectively. As citric acid was added to copper CMP slurry (pH 4) containing 3 vol% hydrogen peroxide and 3 wt% colloidal silica, the material removal (MRR) at the wafer center was higher than its edge. Hydrogen peroxide could not induce a remarkable change in the profile of MRR. Colloidal silica, used as an abrasive in copper CMP slurry containing 0.01 M of citric acid and 3 vol% of hydrogen peroxide, controlled the profile of MRR by abrading the wafer edge. BTA as a corrosion inhibitor decreased the MRR and seems to control the material removal around the wafer center. All the results of in this study showed that the MRR profile of copper CMP could be controlled by the contents of slurry components.     

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

In this work, surface analysis technology is employed to investigate the removal mechanism and the selection of abrasive during fused silica chemical mechanical polishing (CMP). Morphology of abrasives is inspected by scanning electron microscope (SEM). The atomic force microscope (AFM) is used to determine the surface roughness (Rq) and undulating (PV) of the polished fused silica surface. The results show that abrasive morphology has a tremendous influence on removal rate (MRR) and PV but has little effect on the Rq. The AFM and infrared spectroscopy (IR) analysis show that a soft layer, called “silica gel membrane (SGM),” existed on the polished surface is the critical reason for the differences of MRR, Rq, and PV during CMP. For three kinds of micro-ceria abrasives, the abrasive with a rougher surface gets more opportunities to contact the surface of fused silica, yielding higher MRR. Regarding different kinds of nano-abrasives, there are more SGM induced by nano-ceria abrasive resulting from higher chemical reaction rate. The element contaminations on the polished fused silica have been assessed using X-ray photoelectron spectroscopy (XPS), and the results suggest that there are depths of 3.6 and 5.4-nm element contaminations on the polished surface of fused silica with nano-ceria and nano-alumina abrasives, respectively. While the surface polished by nano-silica is free of heterogeneous element contaminations. Based on study results, a novel polishing slurry is designed by modifying the chemical composition of nano-silica. Comparing with ceria-based slurry, the silica-based slurry has better removal efficiency, and surface quality in fused silica precision machining.     

Hydrazine hydrate: A new reagent for Fmoc group removal in solid phase peptide synthesis

In solid-phase peptide synthesis using the Fmoc/tBu strategy (SPPS-Fmoc/tBu), an orthogonal protection scheme of amino acids is used; specifically, the alpha-amine group is protected by the 9-fluorenylmethyloxycarbonyl (Fmoc) group, which is removed by weak bases, while side chains are protected by groups that are acid labile. We demonstrated that hydrazine hydrate is an efficient reagent for eliminating the Fmoc group in SPPS-Fmoc/tBu. First, experimental conditions were established for Fmoc group removal from Fmoc-Val-OH in solution. It was determined that the Fmoc group was completely removed with 16% hydrazine hydrate in DMF after 60?min at rt. Second, SPPS-Fmoc/tBu using hydrazine hydrate for Fmoc group removal was standardized. The Fmoc group removal was completed using 16% hydrazine hydrate in DMF for 10?min at rt (twice). When the reaction of Fmoc group removal was microwave-assisted, the reaction only required 30?s to efficiently remove the Fmoc group in SPPS-Fmoc/tBu. The method reported here can be routinely used, and it is equivalent to conventional SPPS-Fmoc/tBu methodologies where 4-methylpiperidine or piperidine is used.     

Role of Ceria in the Design of Composite Materials for Elemental Mercury Removal

The necessity to drastically act against mercury pollution has been emphatically addressed by the United Nations. Coal‐fired power plants contribute a great deal to the anthropogenic emissions; therefore, numerous sorbents/catalysts have been developed to remove elemental mercury (Hg⁰) from flue gases. Among them, ceria (CeO₂) has attracted significant interest, due to its reversible Ce³⁺/Ce⁴⁺ redox pair, surface‐bound defects and acid‐base properties. The removal efficiency of Hg⁰ vapor depends among others, on the flue gas composition and temperature. CeO₂ can be incorporated into known materials in such a way that the abatement process can be effective at different operating conditions. Hence, the scope of this account is to discuss the role of CeO₂ as a promoter, active phase and support in the design of composite Hg⁰ sorbents/catalysts. The elucidation of each of these roles would allow the integration of CeO₂ advantageous characteristics to such degree, that tailor‐made environmental solution to complex issues can be provided within a broader application scope. Besides, it would offer invaluable input to theoretical calculations that could enable the materials screening and engineering at a low cost and with high accuracy.     

固结金刚石研磨盘加工蓝宝石基片的磨削性能研究

通过蓝宝石基片磨削试验研究了陶瓷结合剂、树脂结合剂和陶瓷树脂复合结合剂制备的固结金刚石研磨盘磨削工件的材料去除率、表面粗糙度和磨盘自锐性能,确定了磨削性能最佳的金刚石研磨盘结合剂,在此基础上,进一步研究了W40、W20、W7和W2.5金刚石研磨盘磨削蓝宝石基片的材料去除率、表面粗糙度、表面/亚表面损伤及其材料去除机理,提出依次采用W40金刚石研磨盘粗磨、W7金刚石研磨盘半精磨和W2.5金刚石研磨盘精磨的蓝宝石基片高效低损伤磨削新工艺.结果表明,陶瓷树脂复合结合剂制备的固结金刚石研磨盘磨削蓝宝石基片的综合性能最好,随着磨料粒径的减小,磨削蓝宝石基片的表面材料去除方式从脆性断裂去除向塑性流动去除转变,同时蓝宝石基片的材料去除率、表面粗糙度和亚表面损伤深度也随之减小.     

抛光液酸碱性对固结磨料抛光硫化锌晶体的影响

硫化锌晶体是一种重要的红外光学材料,在红外成像、导弹制导、红外对抗等红外技术领域应用广泛.抛光液能够与工件及抛光垫发生化学反应从而影响工件表面质量和材料去除率.实验采用乙二胺、氢氧化钠、柠檬酸、盐酸分别配制不同的酸碱性抛光液,研究抛光液酸碱性对固结磨料抛光硫化锌晶体材料去除率、表面形貌和表面粗糙度的影响.实验结果表明:酸性抛光液抛光的材料去除率高于碱性抛光液;柠檬酸抛光液可同时获得优表面质量和高加工效率,抛光后的晶体表面粗糙度Sa值为4.22 nm,材料去除率为437 nm/min.