压电石英亚表面损伤层分析

压电石英基片在加工过程中会带来表面/亚表面损伤,这种损伤会直接影响电子器件的性能、稳定性及寿命。该文采用扫描电镜(SEM)观测与X-射线双晶回摆曲线检测化学腐蚀逐层剥离深度相结合的方法,定量分析了36°AT切压电石英基片亚表面损伤层厚度,并探讨了亚表面损伤层的形成原因及对器件性能的影响。     

平面和曲面光学零件气囊抛光材料去除的比较研究

气囊数控抛光是近年来一种新兴的先进光学制造技术,采用柔性的气囊作为抛光工具并以进动的方式进行加工。首先简要阐述了气囊抛光的抛光原理,然后针对平面和曲面光学零件,在自行研制的气囊抛光实验样机上进行了抛光实验。被抛光光学元件的材料去除是在抛光区内实现的。研究了进动角、气囊压缩量、气囊内部压力、气囊转速、抛光时间以及工件的曲率半径几种重要的工艺参数对平面工件和球面工件抛光接触区大小和形状影响情况的异同。在此基础上,总结了气囊抛光材料去除的影响规律。给出了几种重要工艺参数在平面工件和球面工件上取值范围。     

化学机械抛光浆料研究进展

化学机械抛光(CMP)作为目前唯一可以实现全面平坦化的工艺技术,已被越来越广泛地应用到集成电路芯片、计算机硬磁盘和光学玻璃等表面的超精密抛光.介绍了CMP技术的发展背景,以及目前国内外抛光浆料的研究现状,并根据CMP浆料磨料的性质,将其分为单磨料、混合磨料和复合磨料浆料,对每一种浆料做了总体描述.详细介绍了近年来发展的复合磨料制备技术及其在CMP中的应用,并展望了CMP技术的发展前景以及新型抛光浆料的开发方向.     

激光抛光技术的发展与展望

介绍激光抛光技术的发展历史,阐明激光抛光的应用现状及未来的发展前景,论述了激光抛光的工艺特点和作用机理,将激光抛光技术与其它抛光技术进行了全面的对比,指出激光抛光的优势及其存在的问题。     

钛基复合材料的离子抛光工艺适用性研究

金属基复合材料的制样难点在于基体和增强相物理性能差异大,采用机械-化学抛光、电解抛光等传统方法制样效率较低.离子抛光的制样优势在于可通过程序控制,实现对复合材料的整体加工,减小界面浮凸,从而提高制样效率.作者在前期研究中得到了最佳离子抛光工艺参数,将此系列参数应用于不同增强相含量钛基复合材料的扫描电镜制样中,对比观察微...     

数控抛光技术中抛光盘的去除函数

抛光盘去除函数的确定是数控抛光技术的应用基础,以Ｐｒｅｓｔｏｎ 方程为基础,应用运动学原理推导了抛光盘在行星运动及平转动两种运动方式下的材料去除函数,并通过计算机模拟出相应的工作特性曲线。结果表明,两种运动方式下工作特性曲线均在不同程度上趋近于高斯曲线。因而行星运动及平转动都可作为抛光盘的运动方式应用在ＣＣＯＰ技术中,使加工中的面形误差得到收敛。     

Synthesis, characterization of CeO2@SiO2 nanoparticles and their oxide CMP behavior

SiO₂ ultrafine spheres are prepared by sol-gel method using tetraethylorthosilicate and ammonia as raw materials. CeO₂-coated SiO₂ (CeO₂@SiO₂) composite nanoparticles are also synthesized through chemical precipitation method. X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM), X-ray photoelectron spectrometer (XPS) and dynamic light scattering (DLS) are used to characterize the CeO₂@SiO₂ composite particles. Silicon wafer covered by thermal oxide film is polished by CeO₂@SiO₂ composite abrasives, and the polishing behavior of novel composite abrasives is characterized by atomic force microscope (AFM). The results indicate that the phases of the as-prepared CeO₂@SiO₂ composite particles are composed of cubic fluorite CeO₂ and amorphous SiO₂. CeO₂@SiO₂ composite particles have excellent spherical morphologies and uniform particle size of 150-200 nm. The particle size of CeO₂ as shell is about 10 nm. After coating, the chemical state of SiO₂ is changed due to the formation of Si-O-Ce bond. The root-mean-square (RMS) roughness within 10 × 10 μm² area of thermal oxide film after polished by CeO₂@SiO₂ composite abrasives is 0.428 nm, and material removal rate can reach 454.6 nm/min.     

Dishing and nitride erosion of STI-CMP for different integration schemes

In this paper, we investigate the effects of integration schemes on the STI-CMP performance of two polishers, as well as the influence of consumables and process parameters. The experiment was based on both the blanket-oxide wafers and the patterned wafers processed using 0.18 μm technology. The polishing capability was evaluated, based on the results collected using metrology tools such as Opti-probe, Tencor profiler; atomic force microscope (AFM), and x-ray-scanning electron microscopy (X-SEM) analysis.     

高精度棱镜的快速抛光技术

本文以加工斯米特屋脊棱镜（ △９０°＝ ±５″） 为例，阐述了实现对高精度棱镜快速抛光的意义；介绍了高精度棱镜快速抛光技术的构成及其所应具备的保证条件     

Mathematical modelling of influence functions in computer-controlled polishing: Part I

Computer-controlled polishing (CCP) is commonly used to finish high-quality surfaces, such as optical lenses. Based on magnetorheological finishing (MRF), a mathematical model to calculate the polishing tool characteristic (influence function) was developed and verified experimentally. The first part of this paper introduces the model to predict the size and shape of an influence function. The second part of this paper describes the calculation of the distribution of material removal within the size of an influence function. The model supersedes the current cumbersome procedure for determining an influence function and thus results in considerably improved and more economical manufacture. Furthermore, the model enables the quality of the final surface to be enhanced when polishing complex, for example aspherical or free-form, workpiece geometries and provides the first step in the application of time-variant influence functions.