面向远海岛礁群的双向物流网络规划

针对若干远海岛礁群系统封闭性的分布特点,将中心岛礁选址、各岛礁建设泊位数量和规模、仓库储存量、运输船型和数量以及航线设置、班期组织等作为规划内容,以整个运输网络系统总成本最低为原则,综合考虑了仓库存储理论,建立了兼顾“选址-库存-路径”的规划模型。结合所建模型特点,提出了双层并行搜索遗传算法,构建了以海上运输为基本交通方式的双向物流系统。最后,以我国南海为例进行建模并求解,采用不同算法并通过多组不同规模的算例进行演算比较,验证了所建模型和算法的有效性与合理性。     

Parallel and totally geodesic hypersurfaces of non-reductive homogeneous four-manifolds

We classify totally geodesic and parallel hypersurfaces of four-dimensional non-reductive homogeneous pseudo-Riemannian manifolds.     

类氖氩离子能级及碰撞强度的计算

利用扭曲波波恩近似方法及AUTOSTRUCTURE (AS)程序，快速精确地计算了类氖Ar8+离子2s22p6、2s22p53s、2s22p53p、2s22p53d、2s2p63s、2s2p63p和2s2p63d组态的能级以及当电子碰撞能量为75.0、125.0、175.0、250.0 (Ry)时，从j能态到i能态的碰撞强度.并且与已有的研究成果进行了对比.结果表明，采用扭曲波波恩近似并结合AUTOSTRUCTURE (AS)程序的研究方法，可以成为研究原子或离子碰撞强度的有效途径。     

Modeling and character analyzing of multiple fractional-order memcapacitors in parallel connection

Recently,the memory elements-based circuits have been addressed frequently in the nonlinear circuit theory due to their unique behaviors.Thus,the modeling and characterizing of the mem-elements become essential.In this paper,the analysis of the multiple fractional-order voltage-controlled memcapacitors model in parallel connection is studied.Firstly,two fractional-order memcapacitors are connected in parallel,the equivalent model is derived,and the characteristic of the equivalent memcapacitor is analyzed in positive or negative connection.Then a new understanding manner according to different rate factor K and fractional orderαis derived to explain the equivalent modeling structure conveniently.Additionally,the negative order appears,which is a consequence of the combination of memcapacitors in different directions.Meanwhile,the equivalent parallel memcapacitance has been drawn to determine that multiple fractional-order memcapacitors could be calculated as one composite memcapacitor.Thus,an arbitrary fractional-order equivalent memcapacitor could be constructed by multiple fractional-order memcapacitors.     

MOVIPAC: Vibrational spectroscopy with a robust meta‐program for massively parallel standard and inverse calculations

We present the software package MO VI PAC for calculations of vibrational spectra, namely infrared, Raman, and Raman Optical Activity (ROA) spectra, in a massively parallelized fashion. MO VI PAC unites the latest versions of the programs SNF and AKIRA alongside with a range of helpful add‐ons to analyze and interpret the data obtained in the calculations. With its efficient parallelization and meta‐program design, MO VI PAC focuses in particular on the calculation of vibrational spectra of very large molecules containing on the order of a hundred atoms. For this purpose, it also offers different subsystem approaches such as Mode‐ and Intensity‐Tracking to selectively calculate specific features of the full spectrum. Furthermore, an approximation to the entire spectrum can be obtained using the Cartesian Tensor Transfer Method. We illustrate these capabilities using the example of a large π‐helix consisting of 20 (S)‐alanine residues. In particular, we investigate the ROA spectrum of this structure and compare it to the spectra of α‐ and 3₁₀‐helical analogs. © 2012 Wiley Periodicals, Inc.     

Modern information technologies in construction of kinetic models for reactions of metal complex catalysis

For detailed study of complex chemical reactions mechanisms experiment is conducted for selected private reactions. This causes a problem of kinetic parameters getting—the same set of rate constants must describe both public and private reaction stages, and also a general mechanism. In this paper, solution of this problem for a reaction of olefins hydroalumination is proposed. To optimize the computational process a methodology of parallelization is elaborated. On the base of parallel computations, a kinetic model for the reaction assigned is constructed, and on its base, the physical and chemical conclusions about reaction mechanism are done.     

平行缝焊工艺的热效应研究

平行缝焊作为一种高可靠性的气密性密封方法,在陶瓷封装行业中有着愈发重要的应用。封焊过程中瞬间产生的高能量在完成密封的同时,会对陶瓷外壳造成很高的热应力残留,可能会对器件可靠性产生影响。介绍了平行缝焊的工作原理及工艺参数,并通过使用ANSYS软件对工艺过程中的各参数进行热仿真分析,研究平行缝焊工艺参数对陶瓷封装的热影响。