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141.
142.
143.
J. Liang S. Downes N. Dariavach D. Shangguan S. M. Heinrich 《Journal of Electronic Materials》2004,33(12):1507-1515
Reliability of lead-free solder joints has been a hot topic widely debated in the electronic industry. Most published data
indicate that a change to lead-free soldering has the potential benefit of more reliable solder joints than the current Sn-Pb
eutectic solder joints. However, in reality many mechanical, metallurgical, thermal, and environmental factors affect the
service reliability of solder joints. This paper tries to shed some light on the effects of mechanical loading and thermal
conditions on solder joint reliability. These conditions are determined not only by external environments but also by the
solder alloy itself and the joint geometry. Analyses with first principles are carried out on solder joints of both areal
array and peripheral packages. Effects on fatigue life of solder joint geometry, thermal and mechanical characteristics of
components and substrate materials, and application conditions are discussed. The analysis helps explain why lead-free solder
joints may not be more reliable in certain application conditions than the current Sn-Pb eutectic solder joints. 相似文献
144.
To develop design rules for dynamically loaded composite structures, extensive static and cyclic tension/compression-torsion
tests were carried out on carbon-fibre-reinforced composites, in which especially the important influence of multiaxial loading
conditions on their fatigue behaviour was investigated. Physically based failure criteria for static loadings are modified
for multiaxial cyclic loadings, and a good agreement with experiments is achieved.
Russian translation published in Mekhanika Kompozitnykh Materialov, Vol. 42, No. 5, pp. 631–641, September–October, 2006. 相似文献
145.
Fatigue crack propagation tests on annealed and quenched medium-density polyethylene showed the annealed specimens to have much lower resistance to crack initiation and subsequent propagation. Although the same fracture mechanism, in which the brittle crack gradually becomes more ductile, prevailed in both cases, the voided and fibrillated crack tip root craze in the annealed material was much weaker that the nonfibrillated quenched root craze. Microstructural analyses indicate that the annealed material had separate crystallite populations, whereas the quenched material had a more homogeneous morphology. The highest melting fraction of the annealed material was composed of lamellae that were about 270 Å thick, and the quenched lamellae were estimated to be 160 Å thick. The reduced fatigue crack propagation resistance of the annealed material was suggested to be a result of a lower concentration of tie molecules and its reduced damping capability, compared to the quenched material. © 1995 John Wiley & Sons, Inc. 相似文献
146.
This paper describes a methodology for adapting the acoustoultrasonic technique for use in monitoring structures or mechanical
components. As a practical example, the adaptation of the technique for monitoring fatigue tests on front suspension arms
is considered. From this particular example, it will be shown that the procedure is suitable for application to more general
cases. The results of a number of fatigue tests carried out at the Fiat Research Center on a typical component test rig are
also presented. 相似文献
147.
Z. Mei J. W. Morris M. C. Shine T. S. E. Summers 《Journal of Electronic Materials》1991,20(10):599-608
This paper reports the results of a study on the effect of the cooling rate during solidification on the shear creep and low
cycle shear fatigue behavior of 60 Sn/40 Pb solder joints, and on bulk solder tensile properties. Solder joints were made
with three different initial microstructures by quenching, air-cooling and furnace-cooling. They have similar steady-state
strain rates under creep at relatively high shear stresses (i.e. in the matrix creep region) but creep at quite different strain rates at lower shear stresses (i.e. in the grain boundary creep region). These results are ascribed to the refined grain size and less lamellar phase morphology
that results on increasing the cooling rate. Tensile tests on bulk solders that were cold-worked, quenched and furnace-cooled
show that a faster cooling rate decreases the ultimate strength and increases the ductility at low strain rates. The fatigue
life of quenched solder joints is shown to be longer than that of the furnace-cooled joints. 相似文献
148.
给出了数据处理的方法,通过对试验数据的分析,给出了裂纹扩展速率与ΔK的关系,为油田的安全生产提供了依据。 相似文献
149.
The fatigue behavior of an ethylene-hexene copolymer was investigated. The effects of R, frequency, relative times under the maximum and minimum stress, and waveform were measured. The phenomenological aspects were related to the microscopic aspects of the failure process. The maximum stress produces damage by disentangling the molecules in the fibrils of the craze and the minimum stress produces damage by bending the fibrils. The net damage, which is a product of these two damage processes, has been represented by a simple equation which accounts for the phenomenological observations. 相似文献
150.