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81.
本征导电聚合物的智能性 总被引:5,自引:1,他引:5
在化学掺杂或电化学掺杂过程中,性质发生可逆性变化的本征导电聚合物是一种潜在的智能材料,可望实现或部分实现传感、处理和执竽功能,适于制成电机执行器、智能窗、化学分离与释放体系、传感器和非线性光学器件等。 相似文献
82.
Adaptive Constrained Control of Unknown Strict Feedback Nonlinear Systems With Dead Zone Input北大核心CSCD
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研究了具有死区输入的预设约束未知高阶严格反馈非线性系统的控制问题,提出了一种基于免疫函数的自抗扰预设漏斗约束自适应控制策略。首先,针对系统内部的未知问题,采用免疫函数与扩张状态观测器结合对系统内部未知项进行观测;其次,通过Lyapunov方法与漏斗控制相结合设计控制器,使得跟踪误差能够维持在预先设定的漏斗约束范围内;同时,利用双曲正切函数速率变化快这一特性设计自适应控制律,引入指令滤波器避免反步法中重复求导问题,分析证明了闭环系统所有信号的有界性。仿真实例表明了控制方法的有效性。 相似文献
83.
84.
文中介绍了一种双目标数字预失真(DPD)方案,并进行了实验研究。不增加系统复杂度的情况下,
可以有效地扩展MIMO 系统的线性化波束宽度。在发射机附近增设一个发射低功率信号的线性辅助转动装置,该
架构实现了MIMO 系统主波束线性化。实验平台由发射机系统和一个辅助转动装置组成,发射机天线阵列为1×4。
输入信号采用两个20 MHz 带宽峰均比分别为5. 7 dB 和5. 6 dB 的正交频分复用(OFDM)信号。实验研究结果表明,
采用了辅助转动装置的双目标DPD 方法后,邻信道功率比(ACPR)达到-50 dBc 以下的主波束线性化宽度可以扩展
到22°,同时信号归一化均方误差(NMSE)平均数值为-40 dB。该方案有效地拓宽了MIMO 系统线性化波束宽度。 相似文献
85.
Yu Cheng Xinnan Xu Mengfan Wang Chengwei Deng Yi Sun Chenglin Yan Tao Qian 《Advanced functional materials》2023,33(44):2302332
As a promising energy carrier, ammonia synthesis by electrocatalytic nitrogen reduction reaction (eNRR) is a promising green and low-carbon ammonia synthesis strategy that can replace the traditional Haber–Bosch process. However, the development of eNRR processes is mainly severely constrained by competitive hydrogen evolution reaction (HER), and the corresponding strategies to inhibit this adverse side reaction to obtain high eNRR selectivity are still limited. In addition, for this complex reaction involving gas–liquid–solid three-phase interface and proton/electron transfer, it is great significance to analyze and summarize the existing inhibition HER strategies from the viewpoint of dynamics. In view of this, this work reviews proton supply/filtration regulation strategy in catalytic system, allowing a systematic survey of the literature focusing on interface membrane regulation (inorganic membrane and organic membrane), electrolyte regulation (metal-mediated strategy and electrolyte ion regulation strategy) and system device design (electrode structure design and electrolytic cell device design). Constructive catalytic system design guidance is also suggested to inhibit hydrogen evolution and improve NH3 selectivity, aiming for scalable and economically feasible applications. 相似文献
86.
Internet of Things (IoT) is a newly emerged paradigm where multiple embedded devices, known as things, are connected via the Internet to collect, share, and analyze data from the environment. In order to overcome the limited storage and processing capacity constraint of IoT devices, it is now possible to integrate them with cloud servers as large resource pools. Such integration, though bringing applicability of IoT in many domains, raises concerns regarding the authentication of these devices while establishing secure communications to cloud servers. Recently, Kumari et al proposed an authentication scheme based on elliptic curve cryptography (ECC) for IoT and cloud servers and claimed that it satisfies all security requirements and is secure against various attacks. In this paper, we first prove that the scheme of Kumari et al is susceptible to various attacks, including the replay attack and stolen-verifier attack. We then propose a lightweight authentication protocol for secure communication of IoT embedded devices and cloud servers. The proposed scheme is proved to provide essential security requirements such as mutual authentication, device anonymity, and perfect forward secrecy and is robust against security attacks. We also formally verify the security of the proposed protocol using BAN logic and also the Scyther tool. We also evaluate the computation and communication costs of the proposed scheme and demonstrate that the proposed scheme incurs minimum computation and communication overhead, compared to related schemes, making it suitable for IoT environments with low processing and storage capacity. 相似文献
87.
Ping Cai Ling Ding Ziming Chen Dianhui Wang Hongliang Peng Changlai Yuan Chaohao Hu Lixian Sun Yuriy N. Luponosov Fei Huang Qifan Xue 《Advanced functional materials》2023,33(30):2300113
2D Ti3C2Tx MXene, possessing facile preparation, high electrical conductivity, flexibility, and solution processability, shows good application potential for enhancing device performance of perovskite solar cells (PVSCs). In this study, tetrabutylammonium bromide functionalized Ti3C2Tx (TBAB-Ti3C2Tx) is developed as cathode buffer layer (CBL) to regulate the PCBM/Ag cathode interfacial property for the first time. By virtue of the charge transfer from TBAB to Ti3C2Tx demonstrated by electron paramagnetic resonance and density functional theory, the TBAB-Ti3C2Tx CBL with high electrical conductivity exhibits significantly reduced work function of 3.9 eV, which enables optimization of energy level alignment and enhancement of charge extraction. Moreover, the TBAB-Ti3C2Tx CBL can effectively inhibit the migration of iodine ions from perovskite layer to Ag cathode, which synergistically suppresses defect states and reduce charge recombination. Consequently, utilizing MAPbI3 perovskite without post-treatment, the TBAB-Ti3C2Tx based device exhibits a dramatically improved power conversion efficiency of 21.65% with significantly improved operational stability, which is one of the best efficiencies reported for the devices based on MAPbI3/PCBM with different CBLs. These results indicate that TBAB-Ti3C2Tx shall be a promising CBL for high-performance inverted PVSCs and inspire the further applications of quaternary ammonium functionalized MXenes in PVSCs. 相似文献
88.
89.
碳化硅(SiC)器件的新特性和移动应用的功率密度要求给功率器件的封装技术提出了新的挑战。现有功率器件的封装技术主要是在硅基的绝缘栅双极晶体管(Insulated Gate Bipolar Transistor,IGBT)和金属氧化物半导体场效应晶体管(Metal Oxide Semiconductor Field Effect Transistor,MOSFET)等基础上发展起来的,并一直都在演进,但这些渐进改良尚不足以充分发挥SiC器件的性能,因而封装技术需要革命性的进步。在简述现有封装技术及其演进的基础上,主要从功率模块的角度讨论了封装技术的发展方向。同时讨论了功率模块的新型叠层结构以及封装技术的离散化、高温化趋势,并对SiC器件封装技术的发展方向做出了综合评估。 相似文献
90.
针对某双列直插式(DIP)封装器件在整机温循试验中出现的失效现象,分析在器件与电路板焊接环节、电路板与整机装配环节和整机温循试验环节3个工况下可能的失效原因,对原因分别进行单工况和多工况的失效仿真分析。针对不同仿真模型在不同工况下的叠加仿真难题,提出基于ANSYS Workbench有限元软件的多应力叠加仿真方法,对比单一工况和多种工况下的仿真结果。结果表明,DIP封装器件失效是器件在焊接尺寸不匹配、过定位装配和温循试验三种工况下,机械应力和热应力的叠加使玻璃绝缘子产生裂纹导致的,有限元仿真结果与实验结果基本吻合,为DIP封装器件在多工况下应力叠加失效的故障机理研究提供一种可参考的仿真方法。 相似文献