Global Existence for Rate-Independent Gradient Plasticity at Finite Strain

We provide a global existence result for the time-continuous elastoplasticity problem using the energetic formulation. For this, we show that the geometric nonlinearities arising from the multiplicative decomposition of the strain can be controlled via polyconvexity and a priori stress bounds in terms of the energy density. While temporal oscillations are controlled via energy dissipation, the spatial compactness is obtained via regularizing terms involving gradients of the internal variables. Dedicated to Sir John Ball on the occasion of his 60th birthday.     

高密度多重埋孔印制板的设计与制造

采用新材料及多重埋孔方式，研制出高密度及高可靠性印制电路板（PCB），其孔径，线宽／线间距以及厚径比分别为0．2mm,0.08mm/0.08mm和15：1,综合性能达到和超过国家军标GJB362的有关条款要求。     

任意除环上一矩阵方程组的一般解与中心和反中心对称解

Necessary and sufficient conditions are given for the existence of the general solution, the centrosymmetric solution, and the centroskewsymmetric solution to a system of linear matrix equations over an arbitrary skew field. The representations of such the solutions of the system are also derived.     

Characterization of inner layer thickness change of a composite circular tube using nonlinear circumferential guided wave:A feasibility study

The feasibility of using the nonlinear effect of primary circumferential guided wave (CGW) propagation for characterizing the change of inner layer thickness of a composite circular tube (CCT) has been investigated. An appropriate mode pair of the fundamental and double-frequency CGWs (DFCGWs) has been selected to enable the second harmonics of primary wave mode in the given CCT to accumulate along the circumferential direction. When changes in the inner layer thickness (described as the equivalent inner layer thickness) take place, the corresponding nonlinear CGW measurements are conducted. It is found that there is a direct correlation between change of equivalent inner layer thickness of the CCT and the relative acoustic nonlinearity parameter (Δβ) measured with CGWs propagating through one full circumference, and that the effect of second-harmonic generation (SHG) is very sensitive to change in the inner layer thickness. The experimental result obtained demonstrates the feasibility for quantitatively assessing the change of equivalent inner layer thickness in CCTs using the effect of SHG by primary CGW propagation.     

Open tubular capillary electrochromatography: A useful microreactor for collagen I glycation and interaction studies with low-density lipoprotein particles

Diabetes, a multifunctional disease and a major cause of morbidity and mortality in the industrialized countries, strongly associates with the development and progression of atherosclerosis. One of the consequences of high level of glucose in the blood circulation is glycation of long-lived proteins, such as collagen I, the most abundant component of the extracellular matrix (ECM) in the arterial wall. Glycation is a long-lasting process that involves the reaction between a carbonyl group of the sugar and an amino group of the protein, usually a lysine residue. This reaction generates an Amadori product that may evolve in advanced glycation end products (AGEs). AGEs, as reactive molecules, can provoke cross-linking of collagen I fibrils. Since binding of low-density lipoproteins (LDLs) to the ECM of the inner layer of the arterial wall, the intima, has been implicated to be involved in the onset of the development of an atherosclerotic plaque, collagen modifications, which can affect the affinity of native and oxidized LDL for collagen I, can promote the entrapment of LDLs in the intima and accelerate the progression of atherosclerosis.In this study, open tubular capillary electrochromatography is proposed as a new microreactor to study in situ glycation of collagen I. The kinetics of glycation was first investigated in a fused silica collagen I-coated capillary. Dimethyl sulphoxide, injected as an electroosmotic flow marker, gave information about the charge of coating. Native and oxidized LDL, and selected peptide fragments from apolipoprotein B-100, the protein covering LDL particles, were injected as marker compounds to clarify the interactions between LDLs and the glycated collagen I coating. The method proposed is simple and inexpensive, since only small amounts of collagen and LDL are required. Atomic force microscopy images complemented our studies, highlighting the difference between unmodified and glycated collagen I surfaces.     

NaAlF4: Preparation, crystal structure and thermal stability

The compound NaAlF₄ has been obtained in the form of thin fibrous crystals or fine colorless powder by condensation at 18 °C of vapors arising over chiolite Na₅Al₃F₁₄ or NaCaAlF₆, heated up to 800 °C. Thermal stability has been investigated by the methods of thermal analysis and high temperature X-ray diffraction. When heated in air, NaAlF₄ is stable up to 390-400 °C, then there is an exothermal solid state decay into Na₅Al₃F₁₄(s) and AlF₃(s). At higher temperature Na₅Al₃F₁₄(s) decays into Na₃AlF₆(s) and NaAlF₄(g). The crystal structure (space group Cmcm, a=3.6124(1) Å, b=14.9469(7) Å, c=5.2617(3) Å, V=284.10 Å³) has been determined by X-ray powder diffraction method. In the crystal structure of NaAlF₄ the octahedrons [AlF₆] are joined through vertices and form corrugated layers, sodium ion layers being located between them. The distances between the atoms of Al-F are in the range 1.791-1.814 Å, and those for Na…F are in the range 2.297-2.439 Å. In spite of limited thermal stability of the crystal form, the compound NaAlF₄ is the main component of the gas mixture over solid and molten salts in the ternary system NaF-AlF₃-CaF₂ and participates in chemical transformations between the phases at high temperature.     

IC封装基板的新一代过孔互连技术

文章主要介绍封装基板芯板通孔的电镀填孔技术及其特点。     

Au丝键合改为Cu丝键合技术

现阶段Au丝作为内引线一直占着键合的主导地位,由于Cu丝具有优良的电性能和价格优势,随着键合技术的发展,以Cu丝代替Au丝作为键合用内引线已经成为必然,封装行业许多厂家正热衷于将原有的Au丝键合设备进行改造,但还存在这样那样的问题。以Au丝键合改为Cu丝键合的技术研究为出发点,首先介绍了键合技术的发展,然后通过工艺调整和设备改造,使得Cu丝作为内引线能够代替Au丝在该设备上使用,同时达到了节约生产成本,节约资金的目的。对改造过程中的气体流量、压力、功率、焊接时间等参数问题进行了详细地阐述,同时对芯片、键合劈刀等也做了相应调整,使得改造后的检测结果完全满足产品要求。大力推进以Cu丝替代Au丝键合技术,可节约生产成本,提高键合强度,增强导电率、导热率等,具有重要的经济技术效益,必将迎来封装业的又一次大变革。     

Fabrication of a two-step Ni stamp for blind via hole application on PWB

This study examined imprint lithography with a two-step Ni stamp to solve the laser process problems and simultaneously form a blind via and layer pattern. The Ni stamp was fabricated by electroplating on a dry-etched Si mold, made from a SOI (silicon on insulator) wafer, and pattern replication. For the pattern transfer of the Ni stamp, hot embossing was performed on SU8-coated BT and Si wafer substrates. The residual layer was of a uniform thickness with an embossed shape of acceptable squareness.     

色噪声环境中TLS-ESPRIT谐波谱重构语音增强研究

为了提高语音在色噪声环境中的信噪比,提出了一种基于总体最小二乘旋转不变子空间技术（TLS—ESPRIT）谐波谱重构语音增强方法。通过对观察数据矩阵进行奇异值分解,有效地将信号及噪声分开。运用TLS—ESPRIT算法对语音谐波信号进行谱估计,重构语音信号,消除了帧与帧之间的噪声残留,得到了在巴克域上与原始语音几乎相同的语音信号。