Optical spectroscopy study of damage evolution in 6H-SiC by H_2~+ implantation

Lattice defects induced by ion implantation into Si C have been widely investigated in the decades by various techniques. One of the non-destructive techniques suitable to study the lattice defects in Si C is the optical characterization. In this work, confocal Raman scattering spectroscopy and photoluminescence spectrum have been used to study the effects of 134-ke V H_2~+ implantation and thermal treatment in the microstructure of 6 H-Si C single crystal. The radiation-induced changes in the microstructure were assessed by integrating Raman-scattering peaks intensity and considering the asymmetry of Raman-scattering peaks. The integrated intensities of Raman scattering spectroscopy and photoluminescence spectrum decrease with increasing the fluence. The recovery of the optical intensities depends on the combination of the implantation temperature and the annealing temperature with the thermal treatment from 700℃ to 1100℃. The different characterizations of Raman scattering spectroscopy and photoluminescence spectrum are compared and discussed in this study.     

Investigation of pillar thickness variation effect on oblique rotating implantation (ORI)-based vertical double gate MOSFET

The rapid scaling of integrated circuit requires further shrinkage of lateral device dimension, which correlates with pillar thickness in vertical structure. This paper investigates the effect of pillar thickness variation on vertical double gate MOSFET (VDGM) fabricated using oblique rotating ion implantation (ORI) method. For this purpose, several scenarios of silicon pillar thickness t_si were evaluated for 20–100 nm channel length. The source region was found to merge at pillar thickness below 75 nm, which results in floating body effect and creates isolated region in the middle of pillar. The vertical devices using ORI method show better performance than those with conventional implantation method for all pillar thickness, due to the elimination of corner effect that degrades the gate control. The presence of isolated depletion region in the middle of pillar at floating body increases parasitic effect for higher drain potential. By further reduction of pillar thickness towards fully depleted feature, the increase in gate-to gate charge coupling improves the performance of ORI-based vertical double gate MOSFET, as evident in near-ideal swing value and lower DIBL, compared to the partially depleted and body-tied device.     

Dislocation multiplication inside contact holes

Ion implantation into contact holes has been widely used to dope the specific contact area and to reduce the contact resistance. In this study, mask edge defects were observed at the edge area of small contact holes with high aspect ratio, which resulted in multiplied dislocations penetrating into Si substrate for more than 0.3 μm after back-end processings. Those dislocations were identified to be Schockley partial dislocations and stair rod dislocations lying on 4 sets of inclined {111}Si planes.     

一种全新的超高速双极ECL硅工艺—氧化物隔离等平面S（Z）

氧化物隔离等平面S(z)工艺采用全离子注入工艺代替原始的扩散工艺,使得整个工艺流程更为简化,对于浅结工艺的重复性和均匀性均有较大提高。发射极条和基极条形成自对准,发射极四周靠墙。发射极条宽为3微米时,f_γ>3GHz。该工艺已应用于超高速双极ECL分频器中。     

β-NMR in II–VI semiconductors

β-active probe nuclei are implanted in nominally undoped ZnSe crystals. β-radiation detected nuclear magnetic resonance (β-NMR) studies are described for two different probe nuclei, ⁸Li and ¹²B. This way, the implantation behavior of two “opposite”dopants, one acceptor (Li) and one donor (B) can be characterized by the same microscopic technique. Such characterizations are attempted in terms of the structure of intermediate or final lattice sites, defect charge states, or the kinetics of defect reactions and site changes. This revised version was published online in July 2006 with corrections to the Cover Date.     

Halogen lamp rapid thermal annealing of Si- and Be-implanted In0.53Ga0.47As

Halogen lamp rapid thermal annealing was used to activate 100 keV Si and 50 keV Be implants in In_0.53Ga_0.47As for doses ranging between 5 × 10¹²−4 × 10¹⁴ cm⁻². Anneals were performed at different temperatures and time durations. Close to one hundred percent activation was obtained for the 4.1 × 10¹³ cm⁻² Si-implant, using an 850° C/5 s anneal. Si in-diffusion was not observed for the rapid thermal annealing temperatures and times used in this study. For the 5 × 10¹³ cm⁻² Be-implant, a maximum activation of 56% was measured. Be-implant depth profiles matched closely with gaussian profiles predicted by LSS theory for the 800° C/5 s anneals. Peak carrier concentrations of 1.7 × 10¹⁹ and 4 × 10¹⁸ cm⁻³ were achieved for the 4 × 10¹⁴ cm⁻² Si and Be implants, respectively. For comparison, furnace anneals were also performed for all doses.     

Visible photoluminescence from Ge nanoclusters implanted in nanoporous aluminum oxide films

Nanoporous aluminum oxide (Al₂O₃) films with uniform porous size of 45 nm prepared by the electrochemical process in inorganic acid medium were implanted at room temperature (RT) with 120 keV Ge⁺ ions with a fluence of 1.2×10¹⁶ cm⁻². The nucleation and growths of Ge nanoparticles, were obtained by thermal annealing of the implanted samples at the temperature range of 200-600 °C. The size and distribution of the nanoparticles were characterized by photoluminescence (PL) measurements. The photoluminescence measurements as a function of the annealing temperature shows that at low annealing temperature (200 °C), the sample presents a low intensity and broad emission band centered at 5456 Å consistent with emission band characteristics of nanocluster of Ge with diameter in the range of 4-8 nm, as the annealing temperature increases to 400 °C the PL intensity increases by a factor of almost 20 and the emission band suffers a small red shift. The intensity increases can be related to the increase of the number of Ge nanocluster. At the annealing temperature of 600 °C, the emission band is considerably red shifted by almost 172 Å and the emission intensity decreases significantly, strongly suggesting that nanocrystalline Ge having a character of direct optical transitions exhibits the visible photoluminescence.     

The effects of thermal annealing on the microstructural,optical and electrical properties of beta silicon carbide films implanted with boron or nitrogen

The effects of annealing of B or N dual implanted regions in 15-20 Μm thick monocrystalline Β-SiC films has been investigated using cross-sectional TEM, SIMS, Raman spectroscopy, C-V and sheet resistance measurements. Implantation resulted in buried amorphous regions (in the B films) or highly disordered regions (in the N films) and residually strained regions. Annealing for 300 s at selected temperatures between 1173 and 2073 K caused structural reordering, precipitation (in the B samples) and dopant diffusion, as the temperature was progressively increased. Only slight changes were noted in the sheet resistance of either type of sample as a result of annealing to 1973 K. However, the values of this parameter decreased markedly atT > 1973 K in both implanted and as-grown samples. Thus, this phenomenon was most probably caused by the formation of additionaln-type defects in the bulk of the materials. Presented at the 1985 Electronic Materials Conference, Boulder, CO, June, 1985.     

高剂量离子注入直接形成Ge纳米晶的物理机理

研究了单束双能高剂量Ge离子注入、不经过退火在非晶态SiO2薄膜中直接形成镶嵌结构Ge纳米晶的物理机制．实验中利用不加磁分析器的离子注入机，采用Ge弧光放电离化自动形成的Ge+和Ge2+双电荷离子并存的单束双能离子注入方法，制备了1e16～1e18cm－2多种剂量Ge离子注入的Si基SiO2薄膜样品．用GIXRD表征了Ge纳米晶的存在，并仔细分析得到了纳米晶形成的阈值剂量．通过TEM分析了Ge纳米晶的深度分布和晶粒尺寸．用SRIM程序分别计算了双能离子在SiO2非晶层的射程和深度分布，与实验结合，得到纳米晶形成的物理机制，即纳米晶的形成与单束双能离子注入时Ge＋和Ge2＋相互碰撞产生的能量沉积在SiO2中形成的局域高温有关．     

Mechanism of defect evolution in H+ and He+ implanted InP

The defect evolution in InP with the 75 keV H⁺ and 115 keV He⁺ implantation at room temperature after subsequent annealing has been investigated in detail. With the same ion implantation fluence, the He⁺ implantation caused much broader damage distribution accompanied by much higher out-of-plane strain with respect to the H⁺ implanted InP. After annealing, the H⁺ implanted InP did not show any blistering or exfoliation on the surface even at the high fluence and the H₂ molecules were stored in the heterogeneously oriented platelet defects. However, the He molecules were stored into the large bubbles which relaxed toward the free surface, creating blisters at the high fluence.