Anisotropic ferromagnetism induced in rutile single crystals by Co implantation

The magnetic and electrical properties of Co-implanted single crystalline TiO₂ rutile are presented. For fluences of the order of 10¹⁷ cm^-2 and implantation energy of 150 keV the maximum atomic concentration of cobalt is 13 at% at a depth of 65 nm from the surface. The as implanted single crystals exhibit superparamagnetic behaviour attributed to the formation of nanosized cobalt clusters. After annealing at 1073 K an anisotropic ferromagnetic behaviour emerges with the easy magnetization axis lying in the (001) plane of rutile. The ferromagnetic behaviour is associated with oriented cobalt aggregates. Electrical conductivity of the implanted samples annealed in vacuum also exhibits anisotropic behaviour at low temperatures, but no magnetoresistive effects were detected.     

低能N+注入植物种子射程分布的模拟计算

伴随着离子束生物技术的广泛应用, 国内许多单位开展了低能离子注入植物种子的实验研究. 其中关于低能离子注入植物种子诱变的物理机理, 集中在离子注入的深度-浓度分布上. 一些单位直接使用纵向非静态(LSS)理论和TRIM程序来计算低能离子注入植物种子的深度-浓度分布, 却发现计算结果与实验测量结果相差甚远. 所以在对植物种子靶材料进行处理和对LSS理论进行修正的基础上, 在二维近似情况下, 用蒙特卡罗方法分别模拟计算了200keV V⁺和20keV Ti⁺注入花生和棉花种子的射程分布, 得到了与实验结果较符合的曲线. 在此模型基础上, 计算了同样初始条件和理论计算模型下无法从实验上测量的N⁺注入植物种子的射程分布, 初步地为低能N⁺注入植物种子射程分布提供了一种理论计算方法.     

Investigation of pillar thickness variation effect on oblique rotating implantation (ORI)-based vertical double gate MOSFET

The rapid scaling of integrated circuit requires further shrinkage of lateral device dimension, which correlates with pillar thickness in vertical structure. This paper investigates the effect of pillar thickness variation on vertical double gate MOSFET (VDGM) fabricated using oblique rotating ion implantation (ORI) method. For this purpose, several scenarios of silicon pillar thickness t_si were evaluated for 20–100 nm channel length. The source region was found to merge at pillar thickness below 75 nm, which results in floating body effect and creates isolated region in the middle of pillar. The vertical devices using ORI method show better performance than those with conventional implantation method for all pillar thickness, due to the elimination of corner effect that degrades the gate control. The presence of isolated depletion region in the middle of pillar at floating body increases parasitic effect for higher drain potential. By further reduction of pillar thickness towards fully depleted feature, the increase in gate-to gate charge coupling improves the performance of ORI-based vertical double gate MOSFET, as evident in near-ideal swing value and lower DIBL, compared to the partially depleted and body-tied device.     

Dislocation multiplication inside contact holes

Ion implantation into contact holes has been widely used to dope the specific contact area and to reduce the contact resistance. In this study, mask edge defects were observed at the edge area of small contact holes with high aspect ratio, which resulted in multiplied dislocations penetrating into Si substrate for more than 0.3 μm after back-end processings. Those dislocations were identified to be Schockley partial dislocations and stair rod dislocations lying on 4 sets of inclined {111}Si planes.     

一种全新的超高速双极ECL硅工艺—氧化物隔离等平面S（Z）

氧化物隔离等平面S(z)工艺采用全离子注入工艺代替原始的扩散工艺,使得整个工艺流程更为简化,对于浅结工艺的重复性和均匀性均有较大提高。发射极条和基极条形成自对准,发射极四周靠墙。发射极条宽为3微米时,f_γ>3GHz。该工艺已应用于超高速双极ECL分频器中。     

离子注入SiO_2玻璃的光吸收研究

本文用卢瑟福背散射和光吸收技术研究了高剂量Ag离子注入SiO_2玻璃以及退火后的状况.吸收光谱测量表明,注入的Ag离子聚集形成了胶态粒子,其等离子共振峰的极大值在400nm处.运用米(Mie)理论和德拜(Doyle)方法,根据测得的等离子共振峰的光宽度,估算出Ag胶态粒子的半径约为18(?).     

β-NMR in II–VI semiconductors

β-active probe nuclei are implanted in nominally undoped ZnSe crystals. β-radiation detected nuclear magnetic resonance (β-NMR) studies are described for two different probe nuclei, ⁸Li and ¹²B. This way, the implantation behavior of two “opposite”dopants, one acceptor (Li) and one donor (B) can be characterized by the same microscopic technique. Such characterizations are attempted in terms of the structure of intermediate or final lattice sites, defect charge states, or the kinetics of defect reactions and site changes. This revised version was published online in July 2006 with corrections to the Cover Date.     

Halogen lamp rapid thermal annealing of Si- and Be-implanted In0.53Ga0.47As

Halogen lamp rapid thermal annealing was used to activate 100 keV Si and 50 keV Be implants in In_0.53Ga_0.47As for doses ranging between 5 × 10¹²−4 × 10¹⁴ cm⁻². Anneals were performed at different temperatures and time durations. Close to one hundred percent activation was obtained for the 4.1 × 10¹³ cm⁻² Si-implant, using an 850° C/5 s anneal. Si in-diffusion was not observed for the rapid thermal annealing temperatures and times used in this study. For the 5 × 10¹³ cm⁻² Be-implant, a maximum activation of 56% was measured. Be-implant depth profiles matched closely with gaussian profiles predicted by LSS theory for the 800° C/5 s anneals. Peak carrier concentrations of 1.7 × 10¹⁹ and 4 × 10¹⁸ cm⁻³ were achieved for the 4 × 10¹⁴ cm⁻² Si and Be implants, respectively. For comparison, furnace anneals were also performed for all doses.     

Visible photoluminescence from Ge nanoclusters implanted in nanoporous aluminum oxide films

Nanoporous aluminum oxide (Al₂O₃) films with uniform porous size of 45 nm prepared by the electrochemical process in inorganic acid medium were implanted at room temperature (RT) with 120 keV Ge⁺ ions with a fluence of 1.2×10¹⁶ cm⁻². The nucleation and growths of Ge nanoparticles, were obtained by thermal annealing of the implanted samples at the temperature range of 200-600 °C. The size and distribution of the nanoparticles were characterized by photoluminescence (PL) measurements. The photoluminescence measurements as a function of the annealing temperature shows that at low annealing temperature (200 °C), the sample presents a low intensity and broad emission band centered at 5456 Å consistent with emission band characteristics of nanocluster of Ge with diameter in the range of 4-8 nm, as the annealing temperature increases to 400 °C the PL intensity increases by a factor of almost 20 and the emission band suffers a small red shift. The intensity increases can be related to the increase of the number of Ge nanocluster. At the annealing temperature of 600 °C, the emission band is considerably red shifted by almost 172 Å and the emission intensity decreases significantly, strongly suggesting that nanocrystalline Ge having a character of direct optical transitions exhibits the visible photoluminescence.     

The effects of thermal annealing on the microstructural,optical and electrical properties of beta silicon carbide films implanted with boron or nitrogen

The effects of annealing of B or N dual implanted regions in 15-20 Μm thick monocrystalline Β-SiC films has been investigated using cross-sectional TEM, SIMS, Raman spectroscopy, C-V and sheet resistance measurements. Implantation resulted in buried amorphous regions (in the B films) or highly disordered regions (in the N films) and residually strained regions. Annealing for 300 s at selected temperatures between 1173 and 2073 K caused structural reordering, precipitation (in the B samples) and dopant diffusion, as the temperature was progressively increased. Only slight changes were noted in the sheet resistance of either type of sample as a result of annealing to 1973 K. However, the values of this parameter decreased markedly atT > 1973 K in both implanted and as-grown samples. Thus, this phenomenon was most probably caused by the formation of additionaln-type defects in the bulk of the materials. Presented at the 1985 Electronic Materials Conference, Boulder, CO, June, 1985.