Planar waveguides in neodymium-doped calcium niobium gallium garnet crystals produced by proton implantation

In this work, the fabrication and optical properties of a planar waveguide in a neodymium-doped calcium niobium gallium garnet(Nd:CNGG) crystal are reported. The waveguide is produced by proton(H~+) implantation at 480 ke V and a fluence of 1.0×10~(17) ions/cm~2. The prism-coupling measurement is performed to obtain the dark mode of the waveguide at a wavelength of 632.8nm. The reflectivity calculation method(RCM) is used to reconstruct the refractive index profile. The finite-difference beam propagation method(FD-BPM) is employed to calculate the guided mode profile of the waveguide.The stopping and range of ions in matter 2010(SRIM 2010) code is used to simulate the damage profile induced by the ion implantation. The experimental and theoretical results indicate that the waveguide can confine the light propagation.     

梯形管内壁等离子体离子注入鞘层扩展MATLAB-PIC数值模拟

基于MATLAB利用Particle-in-cell模型,对梯形管内壁等离子体离子注入过程,进行了二维数值模拟.计算结果表明在中心电极附近出现了"阳极鞘层",该鞘层内部不存在离子,而且在鞘层边缘离子密度最高.在上下管壁上的离子注入剂量呈现"m"形分布.通过对注入过程中等离子体密度分布和不同时间段管壁不同位置离子注入剂量的跟踪,发现"阳极鞘层"扩展行为是导致"m"形分布的原因.由于梯形管形状的不对称性,"阳极鞘层"的边缘向梯形长底方向扩展较快.在注入初始时刻离子注入的能量很低,随着时间延长离子能量逐渐升高,这是由离子初始位置决定的.可见梯形管自身形状决定了鞘层形状和最终的离子注入能量和剂量分布.     

强流离子注入均匀性控制

本文讨论了强流离子注入机的全机械扫描靶室中实现剂量高均匀性和高重复性注入的变速扫描设计原理及控制技术。     

磷（P31^＋）注入Si的快速退火电特性

本文报告了P_(31)~+离子注入Si中快速退火的电特性研究结果。采用高精度四探针测量了P_(31)~+注入层在不同注入剂量下,薄层电阻与退火温度和退火时间的关系。采用自动电化学测量仪PN-4200,测量了P_(31)~+离子注入Si中的载流子剖面分布。     

硅中硼离子注入层的卤钨灯辐照快速退火研究

本文研究了SiO_2掩蔽膜硼离子注入硅的卤钨灯辐照快速退火,测量了注入层表面薄层电阻与退火温度及退火时间的关系,得到了最佳的退火条件。对于采用920(?)SiO_2膜,25keV、1×10~(15)cm~(-2)的~(11)B离子注入样品,经不同时间卤钨灯辐照退火后,测量了注入层的载流子浓度分布,并与950℃、30分钟常规炉退火作了比较。结果表明,卤钨灯辐照快速退火具有电激活率高、注入杂质再分布小以及快速、实用等优点。     

室温铁磁性Al2O3∶Mn的制备及性质

以Al2O3为衬底利用多能态离子注入法在离子注入设备上制备了一系列具有室温铁磁性的Al2O3:Mn样品.在Al2O3的X射线衍射峰附近发现新的衍射峰,该衍射峰既可能对应一种未知新相,也可能对应Al2O3:Mn固溶体.所有样品都具有磁滞现象和室温铁磁性.     

异质结n＋多晶硅/n型4H-SiC欧姆接触的制备

从理论和实验的角度研究了n型4H-SiC上的多晶硅欧姆接触.在P型4H-SiC外延层上使用P 离子注入来形成TLM结构的n阱.使用LPCVD淀积多晶硅并通过P 离子注入及扩散进行掺杂,得到的多晶硅方块电阻为22Ω/□.得到的n 多晶硅/n-SiC欧姆接触的比接触电阻为3.82×10-5Ω·cm2,接触下的注入层的方块电阻为4.9kΩ/□.对n 多晶硅/n-SiC欧姆接触形成的机理进行了讨论.     

等离子体浸没注入超低能注入掺杂研究

A plasma immersion ion implantation(PIII) system based on inductively coupled plasma(ICP) technology was designed. The PIII system had a cylindrical chamber, and a radio frequency(RF) power was used to sustain discharge and a pulsed voltage source was provided to bias the wafer. The RF power was coupled into chamber by a non-coplanar two-turn circular structure coil. A Langmuir probe was connected to the PIII system to diagnose the plasma parameters. The probe diagnosis indicated that plasma ion density of the system achieves 10¹⁷m^-3, the uniformity of the ion density along radial direction achieves 3.53%. Boron (B) and phosphorus (P) doping experiments were performed on the system. Results from second ion mass spectrum (SIMS) tests showed that the measured injection depth is about 10nm and the shallowest is 8.6 nm (at 10¹⁸cm^-3), the peak ion concentration is below the surface of the wafer, and the ion dose reaches above10¹⁵cm^-2 and the abrupt 2.5 nm/decade.     

Conductive and optical properties of PPV modified by N+ ion implantation

In this article, a soluble poly[2‐methoxy‐5‐(3′‐methyl)butoxy]‐p‐phenylene vinylene (MMB‐PPV) was synthesized by dehydrochlorination reaction and the MMB‐PPV film was implanted by nitrogen ions (N⁺) with the ion dose and energy in the range of 3.8 × 10¹⁵ to 9.6 × 10¹⁶ ions/cm² and 15–35 keV, respectively. The surface conductivity, optical absorption, optical band gap (E_g) of modified MMB‐PPV film were studied, and the third‐order nonlinear optical susceptibility (χ⁽³⁾) as well as its environmental stability of modified MMB‐PPV film were also measured by degenerate four‐wave mixing system. The results showed that the surface conductivity of MMB‐PPV film was up to 3.2 × 10^?2 S when ion implantation was performed with the energy of 35 keV at an ion dose of 9.6 × 10¹⁶ ions/cm², which was seven order of magnitude higher than that of the pristine film. UV‐Vis absorption spectra demonstrated that the optical absorption of MMB‐PPV film was enhanced gradually in the visible region followed by a red shift of optical absorption threshold and the E_g value was reduced from 2.12 eV to 1.59 eV with the increase of ion dose and energy. The maximum χ⁽³⁾ value of 2.45 × 10^?8 esu for modified MMB‐PPV film was obtained with the ion energy of 20 keV at an ion dose of 3.8 × 10¹⁶ ions/cm², which was almost 33 times larger than that for pristine film. In comparison to the reduction of 17% in the χ⁽³⁾ value of pristine MMB‐PPV film, the maximum χ⁽³⁾ value of 2.45 × 10^?8 esu for modified MMB‐PPV film decreased by over 5.3% when they had been exposed under the same ambient conditions for 90 days. © 2010 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 48: 2072–2077, 2010     

Effect of Nb,Ti, and W ion implantation on surface properties and cell compatibility of silicon carbide

Silicon carbide is considered as a bio-inert semiconductor material; consequently, it has been proposed for potential applications in human body implantation. In this study, we study the effect of implanting different metal ions on the surface properties of silicon carbide single crystal. The valence states of the elements and the surface roughness of implanted SiC were studied using X-ray photoelectron spectroscopy and atomic force microscope, respectively. Osteoblastic MG-63 cells were utilized to characterize the cytocompatibility of ion implanted SiC. The results show that after Nb ion implantation on the SiC surface, it mainly exists in the form of Nb–C bond, Nb–O bond, and a small amount of metallic niobium. The titanium implanted on SiC primarily forms Ti-C bond and Ti-O bond. The tungsten implanted on SiC mostly presents as metallic tungsten and W–O bond. The roughness of silicon carbide single crystal is improved by ion implantation of all three metal ions. Ion implantation of titanium and niobium can improve the cell compatibility and hydrophilicity of silicon carbide, whereas ion implantation of tungsten reduces the cell compatibility and hydrophilicity of silicon carbide.