单晶金刚石p型和n型掺杂的研究

超宽禁带半导体材料金刚石在热导率、载流子迁移率和击穿场强等方面表现出优异的性质,在功率电子学领域具有广阔的应用前景。实现p型和n型导电是制备金刚石半导体器件的基础要求,其中p型金刚石的发展较为成熟,主流的掺杂元素是硼,但在高掺杂时存在空穴迁移率迅速下降的问题;n型金刚石目前主流的掺杂元素是磷,还存在杂质能级深、电离能较大的问题,以及掺杂之后金刚石晶体中的缺陷造成载流子浓度和迁移率都比较低,电阻率难以达到器件的要求。因此制备高质量的p型和n型金刚石成为研究者关注的焦点。本文主要介绍金刚石独特的物理性质,概述化学气相沉积法和离子注入法实现金刚石掺杂的基本原理和参数指标,进而回顾两种方法进行单晶金刚石薄膜p型和n型掺杂的研究进展,系统总结了其面临的问题并对未来方向进行了展望。     

Development toward a double focusing isotopic separator for noble gas isotope enrichment

A double focusing sector field mass filter used in Nier–Johnson geometry has been built in order to perform Kr isotope enrichment for ⁸¹Kr and ⁸⁵Kr isotopes. The principle consists in implanting Kr⁺ ions accelerated at 7 keV in Al foils after separation using the magnetic sector. A specific ion source has been designed capable of generating high Kr⁺ ion beams (>0.5 μA) to transfer into the collecting Al foils in 3 to 5 h significant fractions of large Kr samples (10¹⁵ to 10¹⁶ atoms) initially introduced in the instrument. Implanted Kr isotopes can be further selectively released from the Al foil by surface ablation using an infrared laser beam. Implantation yields and enrichment factors are measured using a conventional mass spectrometer. Copyright © 2016 John Wiley & Sons, Ltd.     

Application of a synchrotron microprobe to the analytical characterization of ion-implanted material

A synchrotron microprobe has been used to characterize ion implantations of nickel and cobalt in silicon (100) or (111) wafers. The synchrotron radiation is collimated by means of a rigid cylindrical glass capillary of 110 mm length, 5 mm outer and 30 μm or 10 μm inner diameter. The beam is pointed at the wafer sample and the emitted radiation of X-rays is detected by an energy dispersive spectrometer. Line scans are recorded step by step over the implantation areas and across their borders. The sharpness of the borders is characterized at a lateral resolution of 13 μm and the edge lengths ranging from 0.6 to 8 mm are determined with an accuracy better than ± 20 μm. The signal intensity and implantation dose of cobalt ranging from 1 × 10¹⁵ to 1 × 10¹⁷ ions cm⁻² show a linear relationship as is to be expected for the micrometre thin implanted layers.     

硅探测器加工中的离子注入工艺设计与控制

应用离子注入工艺可制备获得线性电流大、窗口死层薄的硅pin辐射探测器。首先简要介绍了离子注入工艺形成pn结的原理,重点根据技术要求进行了离子注入工艺设计和计算,分别得到了注入能量为40 keV和注入剂量为4×1014/cm2的两个重要控制参数。同时分析了在离子注入工艺中存在的影响因素和相应处理方法,对生产具有良好的指导作用。采用所设计的工艺参数制备获得的硅pin辐射探测器各项技术指标均满足要求,验证了离子注入工艺设计与参数控制的有效性。     

BF+2注入的多晶硅薄膜快速热退火后氟行为的研究

本文报道BF_2~+注入的多晶硅薄膜经快速热退火后的物理和电学性质。发现造成氟异常分布的原因是由于快速热退火过程中氟的外扩散以及在多晶硅/二氧化硅界面处的聚集。在注入剂量为1×10~(15)和5×10~(15)cm~(-2)的样品中,经快速热退火后可以观察到氟泡。     

As~+、Si~+双注入GaAs瞬态退火的行为

研究了不同能量、剂量As~+、Si~+双注入于SI GaAs中,As~+注入对注Ss~+有源层的影响.首次给出了双注入样品瞬态退火后有源层的激活率和载流子迁移率,退火前后材料的沟道谱.实验表明,As~+、Si~+双注入样品比Si~+单注入样品在较低退火温度下就能激活Si~+,在适当高温下能得到性能良好的有源层.     

二维离子注入的改进模型及数值模拟

本文提出了一个改进的二维离子注入模型.对于在任意形状掩蔽边界下的离子注入分布,我们在纵向采用联结的半高斯分布或修改过的Pearson-IV分布,在横向采用余误差函数分布,并且考虑了在多层掩蔽情况下各种材料阻止本领的不同.利用这一模型发展起来的离子注入模拟器能连续计算多次不同能量、剂量和杂质类型的注入分布,并考虑了多种不同掩蔽边界的影响.通过与其它工艺模拟器的比较,表明我们的模拟器在精度和功能上都有明显的改进.     

离子注入和脉冲激光退火制备碲超饱和掺杂单晶硅pn结

Pn junctions based on single crystalline tellurium supersaturated silicon were formed by ion implantation followed by pulsed laser melting（PLM）.P type silicon wafers were implanted with 245 keV ¹²⁶Te⁺ to a dose of 2×10¹⁵ ions/cm²,after a PLM process（248 nm,laser fluence of 0.30 and 0.35 J/cm²,1-5 pulses,duration 30 ns）,an n⁺ type single crystalline tellurium supersaturated silicon layer with high carrier density(highest concentration 4.10×10¹⁹ cm^-3,three orders of magnitude larger than the solid solution limit) was formed,it shows high broadband optical absorption from 400 to 2500 nm.Current-voltage measurements were performed on these diodes under dark and one standard sun（AM 1.5）,and good rectification characteristics were observed.For present results,the samples with 4-5 pulses PLM are best.     

硅中硼离子注入层的卤钨灯辐照快速退火研究

本文研究了SiO_2掩蔽膜硼离子注入硅的卤钨灯辐照快速退火,测量了注入层表面薄层电阻与退火温度及退火时间的关系,得到了最佳的退火条件。对于采用920(?)SiO_2膜,25keV、1×10~(15)cm~(-2)的~(11)B离子注入样品,经不同时间卤钨灯辐照退火后,测量了注入层的载流子浓度分布,并与950℃、30分钟常规炉退火作了比较。结果表明,卤钨灯辐照快速退火具有电激活率高、注入杂质再分布小以及快速、实用等优点。     

大剂量Mn离子注入GaAs的性质

在室温条件下在半绝缘性GaAs衬底上进行了大剂量Mn离子的低能注入，并进行了不同条件的退火. 借助于X射线衍射(XRD)和高分辨X射线衍射(HR-XRD)进行了结构分析，经过退火后生成的新相衍射峰增多，根据衬底(004)峰摇摆曲线分析结果退火后更多的Mn离子进入晶格. 运用原子力显微镜分析了样品的表面，发现退火后突起的起伏度增加. 磁性分析表明，退火样品的磁化强度增大.