HgCdTe离子注入掺杂及损伤特性

运用红外反射谱，背散射谱和二次离子质谱等方法研究ＨｇＣｄＴｅ注入Ｂ、Ｐ、Ｉｎ和Ａｓ等元素的掺杂与损伤特性。     

Layer-transfer process for silicon-on-insulator with improved manufacturability

We observe hydrogen platelet buildup in single-crystalline silicon caused by hydrogen-plasma processing. The platelets are aligned along a layer of lattice defects formed in silicon before the plasma processing. The buried-defect layer is formed by either silicon-into-silicon or argon-into-silicon implantation. We discuss the platelet nucleation, growth, and merge phenomena and discuss applicability of the plasma hydrogenation to silicon-on-insulator (SOI) wafer fabrication by layer transfer.     

多晶硅膜离子注入和扩散掺杂制备浅结的研究

本文对多晶硅膜离子注入掺杂和扩散掺杂制备浅发射结进行了实验研究。针对新型薄发射极晶闸管特性改善对薄发射极参数的要求,重点研究了采用不同方法时退火条件对薄发射区掺杂剖面、结深以及杂质总量的影响。管芯研究结果表明,在适当的退火条件下,离子注入掺杂制备浅结是改善器件特性较为理想的方法。     

Modifications of He implantation induced cavities in silicon by MeV silicon implantation

Doppler broadening spectroscopy (DBS) coupled to a slow positron beam has been used to investigate the formation of He-cavities in the presence of high vacancy concentrations in Cz-Si (1 1 1). Si samples were first implanted with MeV Si ions in order to create a damaged Si layer. DBS measurements show the presence of divacancy (SV₂/SSi lattice=1.052,WV₂/WSi lattice=0.83) from the surface up to 4.2 μm depth with a concentration higher than 10¹⁸ cm⁻³. The thickness of this damaged layer was confirmed by spreading resistance measurements. In the second step, samples were implanted with 50 keV ³He with fluence of 10¹⁶ cm⁻². DBS results show that the apparent divancancy concentration decreases at ³He implantation depth ∼435 nm due to ³He passivation of vacancies that occurs during the implantation process. After 900 °C annealing, large defects are detected at depth up to 2 μm and (S, W) values suggest the detection of cavities at the implantation depth. We also report the possible presence of impurity complexes. The formation of these complexes is attributed to the gettering of metallic impurities present in the Si sample.     

HgCdTe红外探测器离子注入剂量优化研究

在中波响应波段的p型Hg_0.709Cd_0.291Te(MCT)分子束外延生长薄膜上，利用材料芯片技术获得叠加注入不同硼离子剂量的系列大光敏元面积(500μm×500μm)的n-op-p结.通过测量液氮温度下不同离子注入剂量单元的电流-电压特性和对零偏微分电阻R₀分析，观测到p-n结的性能与硼离子注入剂量明显的依赖关系.在另一片薄膜材料(镉组分值为0.2743)上通过该方法获得R₀A优于现有常规数值的探测器单元. 关键词： p-n结 离子注入 碲镉汞薄膜     

Characteristics and uniformity of group V implanted and annealed HgCdTe heterostructure

This work presents characterization of implanted and annealed double layer planar heterostructure HgCdTe for p-on-n photovoltaic devices. Our observation is that compositional redistribution in the structure during implantation/ annealing process differs from that expected from classical composition gradient driven interdiffusion and impacts the placement of the electrical junction with respect to the metallurgical heterointerface, which in turn affects quantum efficiency and R_oA. The observed anomalous interdiffusion results in much wider cap layers with reduced composition difference between base and cap layer composition. The compositional redistribution can, however, be controlled by varying the material structure parameters and the implant/anneal conditions. Examples are presented for dose and implanted species variation. A model is proposed based on the fast diffusion in the irradiation induced damage region of the ion implantation. In addition, we demonstrate spatial uniformity obtained on molecular beam epitaxy (MBE) material of the compositional and implanted species profile. This reflects spatial uniformity of the ion implantation/annealing Processes and of the MBE material characteristics.     

高剂量Ge离子注入直接形成nc-Ge的研究

报道了分别采用剂量为1e1 6 ,1e1 7,5e 1 7和1e1 8cm- 2的高剂量Ge离子注入,不需退火即可在Si O2中直接形成Ge纳米晶的新现象.采用掠入射X射线衍射和激光喇曼谱等实验手段对样品进行了物相分析.结果表明,高剂量Ge离子注入可在SiO2 薄膜中直接形成Ge纳米晶(nc- Ge) ;非晶态Ge向晶态Ge发生相变的阈值剂量约为1e1 7cm- 2 ,离子注入直接形成的nc- Ge内部具有较大压应力,随着注入剂量的提高,nc- Ge的尺寸和含量均有提高.对纳米晶形成机理的研究认为,在Ge离子注入剂量达到阈值,此时膜中Ge非晶态团簇浓度达到饱和甚至过饱和,新入射的     

Ag/Ni双元素注入玻璃光吸收和磁学特性

将MEVVA源（metal vapor vacuurm arc ion source）71出的Ag，Ni离子以不同的剂量比在室温条件下注入到高纯非晶二氧化硅玻璃，透射电镜明场像以及光学吸收谱证明了该样品中形成了Ag，Ni会属纳米颗粒．样品在空气中邀火，随着退火温度的升高，光学吸收淆变得平缓，当退火温度达到600℃时，Ni被部分氧化，用超导量子干涉仪（SQUID）测最样品的磁学特性，结果显示在外磁场为0～80kA／m时表现为铁磁性，在外磁场为80-240kA／m时表现为抗磁性。     

强流离子注入均匀性控制

本文讨论了强流离子注入机的全机械扫描靶室中实现剂量高均匀性和高重复性注入的变速扫描设计原理及控制技术。     

铒,氧共注a—Si：H和a—SiCx：H的1.54μm光致发光

在ａ－Ｓｉ：Ｈ和ａ－ＳｉＣｘ：Ｈ中共注稀土铒和氧。３００℃和４００℃热退火后，测得了来自发光中心Ｅｒ３＋内层４ｆ电子跃迁的１．５４μｍ光致发光。４００℃是较好的退火温度。随着碳含量的增加，发光强度逐渐减弱，这可能是由于碳的引入减弱了间隙氧退火时的迁移能力所致。