高功率微波高斯馈源口面场分析

 用波导本征模展开方法对用于高功率微波发射系统的方角锥高斯馈源口面场进行分析，提出结合馈源远场辐射特性和避免高功率击穿折衷选定相应的高斯模注腰半径，进而确定多个波导模幅值，从而为运用模匹配或耦合波理论设计高斯馈源提供依据。     

THE DESIGNS OF HIGH EFFICIENCY LAUNCHER OF QUASI-OPTICAL MODE CONVERTER FOR HIGH POWER GYROTRONS

A high efficiency launcher of quasi-optical (QO) mode converters for high power gyrotrons have been designed and tested. A helical cut launcher radiates the RF power via its straight cut onto the first phase correcting mirror. The launchers have been optimized for the TE_31.8 mode at 170 GHz and TE_22.6 mode at 110 GHz by numerically optimizing a launcher surface. The helical cut of the launcher has been optimized by taking the taper angle into account. Further more, the amplitude of the surface perturbation have been optimized for improved focusing in order to reduce the diffraction losses at the helical cut. Low power measurement shows a good agreement with the design. High efficiency characteristics of the design have also been calculated on the assumption of frequency downshift due to the thermal expansion of the cavity and stepwise frequency tuning by changing the operating mode. Besides, the possibility of high efficiency launcher for higher mode is discussed, and these results give the prospect to high efficiency long pulse gyrotrons.     

Molecular dynamics simulations on the structures and properties of ε-CL-20-based PBXs ——Primary theoretical studies on HEDM formulation design

Five polymer bonded explosives (PBXs) with the base explosive ε-CL-20 (hexanitrohexaazaisowurtzi- tane), the most important high energy density compound (HEDC), and five polymer binders (Estane 5703, GAP, HTPB, PEG, and F2314) were constructed. Molecular dynamics (MD) method was employed to investigate their binding energies (Ebind), compatibility, safety, mechanical properties, and energetic properties. The information and rules were reported for choosing better binders and guiding formula- tion design of high energy density material (HEDM). According to the calculated binding energies, the ordering of compatibility and stability of the five PBXs was predicted as ε-CL-20/PEG > ε-CL-20/ Estane5703 ≈ε-CL-20/GAP > ε-CL-20/HTPB > ε-CL-20/F2314. By pair correlation function g(r) analyses, hydrogen bonds and vdw are found to be the main interactions between the two components. The elasticity and isotropy of PBXs based ε-CL-20 can be obviously improved more than pure ε-CL-20 crystal. It is not by changing the molecular structures of ε-CL-20 for each binder to affect the sensitivity. The safety and energetic properties of these PBXs are mainly influenced by the thermal capability (C°p) and density (ρ) of binders, respectively.     

FeCoB-SiO2磁性纳米颗粒膜的微波电磁特性

采用交替沉积磁控溅射工艺制备了超薄多层的FeCoB SiO2 磁性纳米颗粒膜 .利用x射线衍射仪、扫描探针显微镜、透射电子显微镜分析了薄膜的微结构和形貌特征 .采用振动样品磁强计、四探针法、微波矢量分析仪及谐振腔法测量薄膜试样的磁电性能和微波复磁导率 .重点对SiO2 介质相含量、薄膜微结构对电磁性能产生重要影响的机理做了分析和探讨 .结果表明 :这类FeCoB SiO2 磁性纳米颗粒膜具有良好的软磁性能和高频电磁性能 ,2GHz时的磁导率 μ′高于 70 ,可以应用于高频微磁器件或微波吸收材料的设计     

Al/Al2O3P金属基复合材料的静动态压缩性能及损伤分析

用气压浸渗工艺制备了体积分数40％～50％Al2O3颗粒增强纯铝基复合材料，使用了4种不同尺寸的Al2O3颗粒，其平均粒径分别为5μm、10μm、30μm和60μm．测定了这些复合材料的静、动态压缩性能，并通过材料压缩前后密度变化的测量定量表征了材料的累计损伤，结果表明，与基体材料相似，这些复合材料表现出明显的应变率敏感性；当增强颗粒平均粒径小于60μm时，材料的累计损伤基本与应变率无关，而主要取决于材料的应变．材料中颗粒的破裂主要是由颗粒间的相互作用引起的．较小尺寸颗粒增强的复合材料具有较高的流动应力和较小的累计损伤，并随着颗粒体积分数的增加，材料的流动应力和损伤率都相应增加．     

侵彻环境下两种钨合金的细观响应特性

本文实验发现具有较大密度和较高速度的93W钨合金长杆模拟弹的穿靶深度反而比密度较小，速度较低的90W钨合金长杆弹的穿靶深度小．针对这一现象，本文从两种材料在侵彻环境下的细观响应特性的差异上给出了有实验根据的合理分析，结论是90W在侵彻环境下较易于形成绝热剪切带，从而在弹头部发生“自锐化”效应所致．     

高温超导体的结构组装

 在总结铜氧化物高温超导体晶体结构特点的基础上，提出了以无限层结构Cu-O钙钛矿为核心的结构组装概念，通过和相关结构的外延组合，衍生出了高温超导体的主要晶体构型。进一步运用此观念，建立了新的三元数命名法，并对高温超导体的晶体结构进行了归类。     

环氧基的PCB对无铅组装的兼容性

综述了环氧树脂基的PCB与无铅化组装的兼容性问题。经过大量试验表明,常规的FR-4基材和双氰胺固化的高Tg基材是不能满足无铅化组装要求的,而采用酚醛固化的中等-Tg的环氧树脂基材是可能成为无铅化组装用基材的。同时,PCB制造过程也起着重要的作用。PCB设计和再(回)流焊的加热梯度也影响着无铅化的性能。     

硫酸/盐酸比例和Al~(3+)含量对铝箔隧道孔生长的影响

研究了硫酸/盐酸比例、温度和Al3+含量对高纯铝箔隧道孔生长的影响,发现随着硫酸浓度增加,温度对隧道孔极限长度和孔径的影响减小,在本文条件下隧道孔生长的临界温度最低可降低到35℃。在电解液中一定含量的Al3+可以避免铝箔表面形成大孔,从而改善隧道孔分布均匀性。     

Ku波段10W功率PHEMT

报告了研制的 9.6mm栅宽双δ-掺杂功率 PHEMT,在 fo=1 1 .2 GHz、Vds=8.5 V时该器件输出功率3 7.2 8d Bm,功率增益 9.5 d B,功率附加效率 44.7% ,在 Vds=5～ 9V的范围内 ,该器件的功率附加效率均大于42 % ,两芯片合成 ,在 1 0 .5～ 1 1 .3 GHz范围内 ,输出功率大于 3 9.92 d Bm,最大功率达到 40 .3 7d Bm,功率增益大于 9.9d B,典型的功率附加效率 40 %。