Dielectric Relaxation Phenomena and Electric Properties of Conductive Composite Polyurethane/Polyaniline Films

Summary: Composite polyurethane/polyaniline (PU/PANI) films have been chemically prepared by oxidative in-situ polymerization of aniline inside the previously swelled PU film. Swelling kinetic studies have shown that for PU films the swelling degree of aniline is 25 wt.%. The dielectric and electrical properties of the composite films were measured using dielectric relaxation spectroscopy and four-probe method. Dielectric measurements as a function of temperature and frequency revealed the presence of a relaxation process for the composite PU/PANI-HCl film. This relaxation was explained in terms of interfacial polarization due to the double-layered structure of the composite film. The activation energy values found by dielectric and electrical measurements are close and this result confirms the conducting character of the PANI containing layer.     

Synthesis of fluorinated polybenzoxazoles with low dielectric constants

Two fluorinated aromatic bis(o‐aminophenol)s, 1,1‐bis(3′‐amino‐4′‐hydroxyphenyl)‐1‐(3′‐trifluoromethylphenyl)‐2,2,2‐trifluoroethane (6FAP) and 1,1‐bis(3′‐amino‐4′‐hydroxyphenyl)‐1‐(3′,5′‐ditrifluoromethylphenyl)‐2,2,2‐trifluoroethane (9FAP) were synthesized, which were allowed to polycondense with aromatic diacyl chlorides to afford the fluorinated aromatic polybenzoxazoles (PBOs) via a conventional two‐step procedure in which the low‐temperature solution polycondensation process was first performed to yield poly(o‐hydroxyamide)s (PHAs) followed by the thermal cyclodehydration to give the PBOs. Experimental results indicated that the PHAs had inherent viscosities in the range of 0.29–0.68 dL/g, showing excellent solubility in organic solvents. The PHAs could be thermally cyclodehydrated into the corresponding PBOs at 260–370 °C. The obtained PBOs exhibited enhanced glass‐transition temperature but decreased solubility with respect to the PHAs. The PBOs showed glass‐transition temperatures in the range of 315–337 °C and excellent thermal stabilities with 5% original weight‐loss temperatures (T₅) of >513 °C. Additionally, the PBO films had average refractive index of 1.5298–1.5656, birefringence of 0.0051–0.0092, and low dielectric constants of 2.57–2.70. © 2010 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem, 2010     

β-MnO2纳米棒的电磁特性和多极化驰豫损耗

采用低温水热合成法,以(NH₄)₂S₂O₈作氧化剂,以MnSO₄·H₂O为锰源,在高压反应釜中加热120 ℃并保压48 h制备了β-MnO₂纳米棒。利XRD,SEM,TEM和振动样品磁强计(VSM)对产物进行表征,并就产物的电磁特性和多极化损耗机制进行研究。结果表明,纳米粉体产物是直径为50～70 nm,长度约为几个微米并具有四方晶体结构的β-MnO₂纳米棒,同时产物表现出超顺磁性特征。β-MnO₂纳米棒具有优异的电磁波损耗特性,厚度为1 mm的试样其最大反射损耗在18 GHz能达到-8.1 dB,优于-5 dB的有效吸收带处于15.7～18 GHz宽频段内;2 mm厚的试样在9.8 GHz其反射损耗达到-25 dB,并且优于-5 dB的有效吸收带处于8～12.8 GHz。     

Study of poly(bisphenol A carbonate) relaxation kinetics at the glass transition temperature

In this work, the variations of the relaxation times are investigated above and below the glass transition temperature of a model amorphous polymer, the polycarbonate. Three different techniques (calorimetric, dielectric and thermostimulated currents) are used to achieve this goal. The relaxation time at the glass transition temperature was determined at the temperature dependence convergence of the relaxation times calculated with dynamic dielectric spectroscopy (DDS) for the liquid state and thermostimulated depolarisation currents (TSDC) for the vitreous state. We find a value of τ(T_g) = 110 s for PC samples. The knowledge of the temperature dependence, τ(T), and the value τ(T_g) enables to determine the glass-forming liquid fragility index, m. We find m = 178 ± 5.     

Dissecting Hofmeister Effects: Direct Anion–Amide Interactions Are Weaker than Cation–Amide Binding

Whereas there is increasing evidence for ion‐induced protein destabilization through direct ion–protein interactions, the strength of the binding of anions to proteins relative to cation–protein binding has remained elusive. In this work, the rotational mobility of a model amide in aqueous solution was used as a reporter for the interactions of different anions with the amide group. Protein‐stabilizing salts such as KCl and KNO₃ do not affect the rotational mobility of the amide. Conversely, protein denaturants such as KSCN and KI markedly reduce the orientational freedom of the amide group. Thus these results provide evidence for a direct denaturation mechanism through ion–protein interactions. Comparing the present findings with results for cations shows that in contrast to common belief, anion–amide binding is weaker than cation–amide binding.     

Gated Channels and Selectivity Tuning of CO2 over N2 Sorption by Post‐Synthetic Modification of a UiO‐66‐Type Metal–Organic Framework

The highly porous and stable metal–organic framework (MOF) UiO‐66 was altered using post‐synthetic modifications (PSMs). Prefunctionalization allowed the introduction of carbon double bonds into the framework through a four‐step synthesis from 2‐bromo‐1,4‐benzenedicarboxylic acid; the organic linker 2‐allyl‐1,4‐benzenedicarboxylic acid was obtained. The corresponding functionalized MOF (UiO‐66‐allyl) served as a platform for further PSMs. From UiO‐66‐allyl, epoxy, dibromide, thioether, diamine, and amino alcohol functionalities were synthesized. The abilities of these compounds to adsorb CO₂ and N₂ were compared, which revealed the structure–selectivity correlations. All synthesized MOFs showed profound thermal stability together with an increased ability for selective CO₂ uptake and molecular gate functionalities at low temperatures.     

含氟聚酰亚胺1,3-BPA-6FDA-DR1的合成及其热光性能

用1,3-双(3-氨基苯氧基)苯(1,3-BPA)、4,4′-(六氟异丙基)-苯二酸酐(6FDA)和分散红1(DR1)合成了含氟聚酰亚胺,采用示差扫描量热(DSC)、热失重分析(TGA)和紫外、红外吸收光谱等测试技术对该聚酰亚胺的热稳定性和结构进行了表征。结果显示,该聚酰亚胺的玻璃化转变温度(Tg)和在5%的质量损失温度分别为238和287℃,表明具有较好的热稳定性。不同浓度的材料在自然光下的热光系数(dn/dT)值为(-2.31～-3.04)×10-4/℃,体积热膨胀系数变化率(dβ/dT)为(2.56～4.32)×10-7/℃;一定浓度的材料在436nm单波长光照射下的热光系数(dn/dT)值为-3.08×10-4/℃,体热膨胀系数变化率(dβ/dT)为4.72×10-7/℃,表明该聚合物在低驱动功率的新型数字热光开关、光通信器件等领域具有潜在的应用前景。     

聚合物纳米复合电介质

聚合物纳米复合材料能够发挥纳米材料在电、磁、光等方面的优越性,也具有聚合物的易成型等方面的优点,正成为电介质领域研究的热点.本文综述了聚合物纳米复合材料在介电性能方面的研究概况,主要涉及了电导、介电强度与空间电荷、介电常数、介电损耗以及局部放电等方面的研究.最后展望了今后的研究方向.