Layout-Specific Circuit Evaluation in 3-D Integrated Circuits

In this paper, we describe a comprehensive layout methodology for bonded three-dimensional integrated circuits (3D ICs). In bonded 3D integration technology, parts of a circuit are fabricated on different wafers, and then, the wafers are bonded with a glue layer of Cu or polymer based adhesive. Using our layout methodology, designers can layout such 3D circuits with necessary information on inter-wafer via/contact and orientation of each wafer embedded in the layout. We have implemented the layout methodology in 3DMagic. Availability of 3DMagic has led to interesting research with a wide range of layout-specific circuit evaluation, from performance comparison of 2D and 3D circuits to layout-specific reliability analyses in 3D circuits. Using 3DMagic, researchers have designed and simulated an 8-bit encryption processor mapped into 2D and 3D FPGA layouts. Moreover, the layout methodology is an essential element of our ongoing research for the framework of a novel Reliability Computer Aided Design tool, ERNI-3D.     

LT348电路的研制

本文介绍了ＬＴ３４８的电路、版图和工艺设计。ＬＴ３４８是由四个功能和７４１组件等同而又各自独立的高增益、内补偿、低功耗运放器组成，并且它的电源电流可以和单个的７４１典型运放器相比拟。此外，它还具有比标准７４正低得多的输入失调电流和输入偏流的特征。     

用边界元法提取VLSI版图电阻

介绍了ＶＬＳＩ版图验证中电阻提取的基本原理和主要方法，给出了一种新颖的基于边界元法的电阻提取算法。该算法采用变节点单元，较好地解决了实际问题中经常出现的角点问题。通过应用该算法对几个实例进行提取，证明使用本文的算法不仅在精度上而且在占用ＣＰＵ时间上都取得了令人满意的效果     

VHDL逻辑综合及FPGA实现

运用ＶＨＤＬ语言描述了一个１２×１２位的高速补码阵列乘法器。重点是运用ＶＨＤＬ逻辑综合优化该乘法器，并进行了乘法器的ＸｉｌｉｎｘＦＰＧＡ实现、功能仿真和时序仿真。经选用ＸＣ４００５ＰＣ－８４－４芯片进行验证，证明了其正确性     

国外模拟IC的发展现状分析

本文主要根据电子整机的发展要求,从集成化、高性能和高可靠等三方面分析国外模似IC的发展,进而说明模拟IC总的发展趋势及其表现。最后指出,模拟IC正面临一个新的变革时期。     

基于MOCCⅡ多功能滤波器的设计

本文简要介绍了Mulitple-output CCⅡ（简称MOCCⅡ）器件的电路特性，提出了一个新颖的基于MOCCⅡ多功能滤波器的电路。该电路可同时实现一阶低通以及二阶低通、高通、带阻、全通和带通等输出。经分析，该电路具有很低的灵敏度。电路中所有RC元件均接地，便于集成等优点。     

集成pH－ISFET／压力传感器的研究

基于ＳＤＢ／ＳＯＩ材料和硅微机械加工技术，提出了一种含微参比电极和择优差分补偿单元的背面引线ＰＨ－ＩＳＦＥＴ／压力传感器的新结构。并且设计了高稳定的可调芯片自恒温系统，以减少硅材料对温度敏感的效应。这种结构既方便地实现敏感元和信号处理电路的完全隔离，又有效地改善了敏感特性和稳定性。初步实验结果证实了新结构设计是成功的。     

动态分频器技术

本文介绍了动态分频器的基本原理；详细叙述了动态分频器电路及其主要工艺技术；综述了国外动态分频器的发展动态。     

Measurement selection for parametric IC fault diagnosis

This article presents experimental results which show feedforward neural networks are well-suited for analog IC fault diagnosis. Boundary band data (BBD) measurement selection is used to reduce the computational overhead of the FFN training phase. We compare the diagnostic accuracy between traditional statistical classifiers and feedforward neural networks trained with various measurement selection criteria. The feedforward networks consistently perform as well as or better than the other classifiers in term of accuracy. Training using BBD consistently reduces the FFN training efforts without degrading the performance. Experimental results suggest that feedforward networks provide a cost efficient method for IC fault diagnosis in a large scale production testing environment.This work is supported by NSF-IUC CDADIC, Project 90-1.     

半导体集成电路在锂离子电池保护电路中的应用

本文首先扼要介绍锂离子电池保护电路的功能，然后分别介绍过充电保护，过放电保护，过电流保护，最后列举几种保护性半导体IC的性能及应用电路的结构。