利用微悬臂梁表面应力研究聚N-异丙基丙烯酰胺分子的构象转变

提出了一种基于微悬臂梁传感技术研究大分子折叠/构象转变的新方法.通过分子自组装的方法将热敏性的聚N-异丙基丙烯酰胺(PNIPAM)分子链修饰到微悬臂梁的单侧表面，用光杠杆技术检测温度在20—40℃之间变化时由于微悬臂梁上的PNIPAM分子在水中的构象转变所引起的微悬臂梁变形.实验结果显示：在升温过程中，微悬臂梁的表面应力发生了变化并且导致微悬臂梁产生了弯曲变形，这个过程对应着微悬臂梁上的PNIPAM分子从无规线团构象到塌缩小球构象的构象转变.在降温过程中，微悬臂梁发生了反方向的弯曲变形，这对应着PNIPA 关键词： 构象转变 聚N-异丙基丙烯酰胺分子链 表面应力 微悬臂梁     

超薄氧化层中的中性陷阱对隧穿电流的影响和应变诱导漏电流

用数值分析的方法讨论了中性陷阱对超薄场效应晶体管(MOSFET )隧穿电流的影响.中性陷阱引起势垒的变化在二氧化硅的导带中形成一个方形的势阱.对于不同的势垒变化,计算了电子隧穿氧化层厚度为4nm的超薄金属氧化物半导体结构的电流.结果表明,中性陷阱对隧穿电流的影响不能被忽略,中性陷阱的存在使隧穿电流增加,并且通过这个简单的模型能够理解应变诱导漏电流的产生机制.     

The Casimir effect of Reissner-NordstrSm black hole

The stress tensor of a massless scalar field satisfying a mixed boundary condition in a （1 ＋ 1）-dimensional Reissner- Nordstrom black hole background is calculated by using Wald＇s axiom. We find that Dirichlet stress tensor and Neumann stress tensor can be deduced by changing the coefficients of the stress tensor calculated under a mixed boundary condition. The stress tensors satisfying Dirichlet and Neumann boundary conditions are discussed. In addition, we also find that the stress tensor in conformal flat spacetime background differs from that in flat spacetime only by a constant.     

用干涉方法测量薄膜应力

基于基片弯曲法和牛顿环的基本原理,使用He-Ne激光器、扩束镜、凸透镜和带分光镜的移测显微镜,搭建了薄膜应力测量装置.采用直流溅射法制备了厚度为30~144 nm的银薄膜,衬底采用厚度为0.15 mm、直径为18 mm的圆形玻璃片.实验发现,薄膜厚度对银薄膜的内应力有显著的影响,在薄膜厚度很小时,随着薄膜厚度的增加,应力迅速增大,达到最大值后,随着厚度的继续增加,薄膜应力下降较快并趋于稳定值.     

Assessment of thermal expansion coefficient of methylsilsesquioxane thin film

For the methylsilsesquioxane film whose optical birefringence is almost zero, it was recently reported that its vertical thermal expansion coefficient (CTE) was approximately one order of magnitude larger than the lateral CTE. Though the birefringence is not an absolute predictor of anisotropic behavior, the discrepancy in both the CTEs was so remarkable that it was essential to investigate whether the anisotropy was intrinsic property or not. If the effect of Poisson's ratio is considered in the calculation of the vertical CTE and when elastic modulus measured by surface acoustic wave spectroscopy is used in the assessment of the lateral CTE, both the CTEs are coincident with each other. Therefore, it can be concluded that the discrepancy in the CTEs can be attributed to a higher in‐plane polymer chain orientation but it can also arise from the misleadingly assumed modulus and Poisson's ratio. © 2006 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 44: 3109–3120, 2006     

Non-destructive evaluation of residual stresses in thin films via x-ray diffraction topography methods

Quantitative x-ray diffraction topography techniques have been used to measure the residual strain magnitude and uniformity of deposition for Mo and W sputtered films on Si(100) substrates. High sensitivity rocking curve measurements were able to determine differential strains for films as thin as 2.5 nm; while Bragg angle contour mapping had similar sensitivity and was also able to assess coating uniformity and stress distribution over areas covering a whole wafer. Measurements of strain versus film thickness over a range of 2.5 nm to 80 nm showed that a critical thickness exists for maximum residual strain. Growth beyond this range produces stress relaxation. This non-destructive type of analysis could be employed on a wide range of film-substrate combinations.     

Altered protein synthesis in rat kidney cells exposed to semiconductor materials

It is thought that the extensive industrial use of arsenic, gallium and indium, which have applications as the materials for III–V semiconductors, will increase human exposure to these compounds in the near future. We have undertaken the development of new biological indicators for assessing exposure to these elements. Element-specific alterations in protein synthesis patterns were expected to occur following exposure to arsenic compounds. We examined alterations in protein synthesis in primary cultures of rat kidney proximal tubule epithelial cells by sodium arsenite, gallium chloride and indium chloride, utilizing two-dimensional gel electrophoresis. After incubation with the chemicals for 20 h, newly synthesized proteins were labeled with [³⁵S]methionine. A protein with a molecular weight (M_r) of 30 000 was markedly induced on exposure to 10 μM arsenite or 300 μM gallium chloride, and synthesis of proteins with M_r values of 85 000, 71 000, 65 000, 51 000, 38 000 and 28 000 were also increased by exposure to arsenite and gallium chloride. No significant changes were observed upon exposure to indium. Some of these increased proteins could be heat-shock proteins.     

Evolution of stress and strain relaxation of Ge and SiGe alloy films on Si(0 0 1)

The growth of Ge and SiGe alloy films on Si substrates has attracted considerable interest in the last years because of their importance for optoelectronic devices as well as Si-based high speed transistors. Here we give a short overview on our recent real time stress measurements of Ge and SiGe alloy films on Si(0 0 1) performed with a sensitive cantilever beam technique and accompanied by structural investigations with atomic force microscopy. Characteristic features in the stress curves provide detailed insight into the development and relief of the misfit strain. For the Stranski–Krastanow system Ge/Si(0 0 1) as well as for SiGe films with Si contents below 20%, the strain relaxation proceeds mainly into two steps: (i) by the formation of 3D islands on top of the Ge wetting layer; (ii) via misfit dislocations in larger 3D islands and upon their percolation.     

全20CrMnTi表面激光重熔的组织与性能研究

本文对激光重熔20CrMnTi材料表明改性层显微组织分布特征、表面硬度分布规律以及残余应力状态作了研究,结果表明,表面改性层由熔融层、相变硬化层及过渡层组成,且材料表面显微硬度得到大幅度提高,表面硬度达到HV841,约提高4倍。硬化层深度约1mm。残余应力测试得出最大残余应力出现在熔凝带中心,表现为压应力。随着离中心距离的增大,残余应力逐步降低,到熔化带边缘,表现为低幅值压应力;而熔池的外边缘应力在热影响区则转变为拉应力状态。     

某军用直流电源的RET方法研究

可靠性强化试验(RET)是一种新兴的试验技术,它使用在产品的设计阶段,用于快速暴露产品的缺陷和薄弱环节。以某军用直流电源为例介绍了可靠性试验方法,并对可靠性强化试验方法的优越性进行了讨论。