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51.
MEMS压力传感器上柔性化凸点制备方法 总被引:1,自引:1,他引:0
介绍了一种适用于MEMS压力传感器的低成本、柔性化凸点下金属层(Under Bump Metal,UBM)和凸点(Bump)的制备工艺。其中凸点下金属层分为Ni-P/Cu两层,使用化学镀的方法沉积在Al焊盘表面;凸点通过焊膏印刷回流预制于陶瓷基片上,再通过转移工艺移植到焊盘上。为了检验此套工艺制出的凸点结构是否具有足够的强度,对凸点进行了剪切破坏试验。结果表明,凸点与凸点下金属层、凸点下金属层与Al焊盘均结合牢固,破坏主要发生在焊料凸点内最薄弱的金属间化合物层(Intermetallic Compound,IMC)。 相似文献
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对一j= LSI/VLSI具有积木块的单元,rt卞L给出单f7安置的算法一般来说,给出矩形单元的相对位置后,须从Zw个状态中选出最优解.我们证明在单行安置时可归结为N个状态的问题,得到一种很有效的算法.此算i?;曾用Fortran语言编程并在IBM-PC机上通行,结果令人满意. 相似文献
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Sadiq M. Sait Mustafa Imran Ali Ali Mustafa Zaidi 《Journal of Mathematical Modelling and Algorithms》2007,6(3):433-454
Simulated Evolution (SimE) is an evolutionary metaheuristic that has produced results comparable to well established stochastic
heuristics such as SA, TS and GA, with shorter runtimes. However, for optimization problems with a very large set of elements,
such as in VLSI cell placement and routing, runtimes can still be very large and parallelization is an attractive option for
reducing runtimes. Compared to other metaheuristics, parallelization of SimE has not been extensively explored. This paper
presents a comprehensive set of parallelization approaches for SimE when applied to multiobjective VLSI cell placement problem.
Each of these approaches are evaluated with respect to SimE characteristics and the constraints imposed by the problem instance.
Conclusions drawn can be extended to parallelization of SimE when applied to other optimization problems.
相似文献
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In an era of sub-micron technology, routing is becoming a dominant factor in area, timing, and power consumption. In this paper, we study the problem of selection and chaining of scan flip-flops with the objective of achieving minimum routing area overhead. Most of previous work on partial scan has put emphasis on selecting as few scan flip-flops as possible to break all cycles in S-graph. However, the flip-flops that break more cycles are often the ones that have more fanins and fanouts. The area adjacent to these nodes is often crowded in layout. Such selections will cause layout congestion and increase the number of tracks to chain the scan flip-flops. To take layout information into consideration, we propose a matching-based algorithm to solve the problem. First, an initial placement will be performed before scan flip-flops are selected. Then, iteratively, a matching-based algorithm taking the current layout into account is proposed to select and chain the scan flip-flops. Experimental results show that, on the average, our algorithm can reduce 8.1% area overhead as compared with the previously proposed methods that do not utilize the layout information in flip-flop selection. 相似文献
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The optimisation of a printed circuit board assembly line is mainly influenced by the constraints of the surface mount device (SMD) placement machine and the characteristics of the production environment. This paper surveys the characteristics of the various machine technologies and classifies them into five categories (dual-delivery, multi-station, turret-type, multi-head and sequential pick-and-place), based on their specifications and operational methods. Using this classification, we associate the machine technologies with heuristic methods and discuss the scheduling issues of each category of machine. We see the main contribution of this work as providing a classification for SMD placement machines and to survey the heuristics that have been used on different machines. We hope that this will guide other researchers so that they can subsequently use the classification or heuristics, or even design new heuristics that are more appropriate to the machine under consideration. 相似文献