浅析FIPS PUB 140-2标准

论文简单分析了FIPSPUB140-2标准及其在密码模块开发过程中的指导意义,可作为密码模块技术开发人员在进行安全性设计时的参考。     

掺Er Al2O3光波导薄膜材料的制备及光学特性

介绍了掺ErAl2O3光波导薄膜的四种典型制备方法的研究结果。比较铒的发光环境和发光特性,分析了影响光致发光强度和寿命的条件和因素。不同工艺制得的Er∶Al2O3薄膜,膜内成分、膜的晶相、掺杂浓度等对Er3 的发光特性均有影响。退火对发光特性及材料具有改善作用。     

实时硬件系统中控制方法的研究

由于实时硬件系统的规模和复杂度不断增大，系统结构的模块化设计已成为硬件系统开发的发展趋势。研究了硬件系统中模块控制的方法和特点。结合MPEG2电视编码器中各功能模块的特点，提出了适合该硬件系统的模块控制方案，说明了控制模块的硬件设计思想和软件实现。实践证明，该方案满足系统实时性和可靠性的设计要求。     

草酸钙在硫酸软骨素自组装膜上周期沉淀的研究

利用硫酸软骨素(chondroitin sulfate，CS)在云母基底上通过浇铸法制备的自组装膜为基底，诱导草酸钙在其上的凝集生长。发现当硫酸软骨素的浓度为1．Omg／ml时在该膜体系中可形成规整的周期性草酸钙环状沉淀。这种有序的环状结构可能是耗散结构的一种具体表现形式。利用原子力显微镜(atomic forcemicroscope，AFM)和傅立叶红外光谱仪对这种结构进行了表征，实验结果显示合适浓度下形成的CS膜在一定程度上可以抑制草酸钙的凝集结晶，表明高分子基质与无机离子间强烈的相互作用对无机盐的成核结晶有显著影响，为探讨结石的形成与抑制提供了一定的实验依据。     

Synchronous Full-Scan for Asynchronous Handshake Circuits

Handshake circuits form a special class of asynchronous circuits that has enabled the industrial exploitation of the asynchronous potential such as low power, low electromagnetic emission, and increased cryptographic security. In this paper we present a test solution for handshake circuits that brings synchronous test-quality to asynchronous circuits. We add a synchronous mode of operation to handshake circuits that allows full controllability and observability during test. This technique is demonstrated on some industrial examples and gives over 99% stuck-at fault coverage, using test-pattern generators developed for synchronous circuits. The paper describes how such a full-scan mode can be achieved, including an approach to minimize the number of dummy latches in case latches are used in the data path of the handshake circuit.     

任意取向多个介质旋转椭球的散射场

本文提出了一种用于计算任意取向多个介质椭球电磁散射的混合方法.利用扩展边界条件(EBC)导出具有旋转轴对称单个椭球以球面波矢量函数为基底的T矩阵,结合球矢量波函数旋转定理和递推T矩阵方法,给出多个任意取向介质椭球的散射场.数值例子验证了该混合方法的计算精度和有效性.     

校园网宿舍网络管理模式的探讨

讨论了高校学生宿舍区网络的特点，结合天津商学院校园网的实践，讨论了校园网宿舍网络管理的模式。     

镍铬合金在酸性CuCl2溶液中反应机理

对铜在酸性CuCl_2溶液中蚀刻反应机理论述,利用氧化-还原电动势原理,详细论述了Ni80Cr20合金在酸性CuCl_2溶液中化学蚀刻反应机理,以及影响蚀刻速度的因素,并对溶液中金属离子的存在形式作了验证。     

Atomic layer chemical vapour deposition of copper

Copper films with (1 1 1) texture are of crucial importance in integrated circuit interconnects. We have deposited strongly (1 1 1)-textured thin films of copper by atomic layer deposition (ALD) using [2,2,6,6-tetramethyl-3,5-heptadionato] Cu(II), Cu(thd)₂, as the precursor. The dependence of the microstructure of the films on ALD conditions, such as the number of ALD cycles and the deposition temperature was studied by X-ray diffraction, scanning electron microscopy (SEM), and transmission electron microscopy. Analysis of (1 1 1)-textured films shows the presence of twin planes in the copper grains throughout the films. SEM shows a labyrinthine structure of highly connected, large grains developing as film thickness increases. This leads to low resistivity and suggests high resistance to electromigration.