PCB钻孔用涂胶铝基盖板的制备及其性能分析

以聚乙二醇（PEG）、聚环氧乙烷（PEO）、粘结树脂等为基本涂层材料,以铝箔为基材,成功制备了高性能的PCB钻孔用铝基盖板材料。对PCB铝基盖板产品的外观、热熔性、水溶性等基本性能进行了测试和分析表明：铝基盖板上的涂层表面较为平整且无相分离结构,便于钻孔;铝基盖板涂层的吸热性能良好,有利于在打孔时带走钻头的热量,降低钻头的温度,保护钻头;涂层的水溶性能也较好,即使在钻孔时被钻头带入PCB板材,也容易用水冲洗掉。利用涂胶PCBX铝基盖板进行钻孔测试发现,所制备的PCB铝基盖板产品在断刀率、耐磨耗、孔位精度等方面均要优干常规铝箔．可见,涂胶蓑板的基本性能完全满足PCB用高性能铝基盖板的要求．     

Superhydrophobic hierarchical surfaces fabricated by anodizing of oblique angle deposited Al-Nb alloy columnar films

A combined process of oblique angle magnetron sputtering and anodizing has been developed to tailor superhydrophobic surfaces with hierarchical morphology. Isolated submicron columns of single-phase Al-Nb alloys are deposited by magnetron sputtering at several oblique deposition angles on a scalloped substrate surface, with the gaps between columns increasing with an increase in the deposition angle from 70° to 110°. Then, the columnar films have been anodized in hot phosphate-glycerol electrolyte to form a nanoporous anodic oxide layer on each column. Such surfaces with submicron-/nano-porous structure have been coated with a fluoroalkyl phosphate layer to reduce the surface energy. The porous surface before coating is superhydrophilic with a contact angle for water is less than 10°, while after coating the contact angles are larger than 150°, being superhydrophobic. The beneficial effect of dual-scale porosity to enhance the water repellency is found from the comparison of the contact angles of the submicron columnar films with and without nanoporous oxide layers. The larger submicron gaps between columns are also preferable to increase the water repellency.     

A method for determining foil thicknesses in TEM by using convergent beam electron diffraction under weak beam conditions

In the present work, convergent beam electron diffraction was studied in zirconium (a material of intermediate atomic number) at 300 keV, under weak beam diffraction conditions. For a particular thickness, the details in an observed low order disc were matched to those calculated using the multibeam dynamical theory. This presents the possibility of determining foil thickness over a wide range, with an estimated experimental accuracy of ≈7% or less. In contrast to other convergent beam techniques, the present method, which uses weak beam conditions, can employ commonly-occurring low order reflections to extract thicknesses.

A simple equation based on the two beam approximation, is derived to determine foil thickness (to within ≈ 10%) without resorting to detailed image matching. This equation can be used for a rough estimate of foil thickness while carrying out TEM observations.     

强激光和超薄等离子体薄膜相互作用产生高次谐波

通过一维粒子（particle in cell,简称PIC）模拟，研制了超薄等离子体薄膜在两列旋转方向相反的圆偏振激光脉冲作用下的高次谐波辐射。在10^21W/cm^2强度的激光作用下，可以获得200次以上的高次谐波。当激光脉冲宽度较短时，由于等离子体薄膜被压缩所导致的多普勒频移对高次谐波产生了显著的频率调制。而这种多普勒频移可以通过对抽运光脉冲引入频率啁啾来补偿。     

固体激光器泵浦灯

本文概述了华北电技术研究所固体激光器泵浦灯技术的发展概况。三十年来，历经了确定工艺、拓宽品种和技术引进三个阶段，如今成为国内独家生产国际通用的高温过渡封接泵浦灯的单位。     

多层非晶薄带爆炸焊接温度场模型

 从非晶合金形成的特点出发，结合爆炸焊接传热的特殊性，提出用一种方波形温度场模型来解释非晶薄带爆炸焊接后能保证非晶态的原因。结果表明此模型符合非晶薄带爆炸焊接的实际情况。     

超疏水碱式碳酸钴纳米线薄膜的制备及抗腐蚀性

以镍为基底,采用水热法在其表面制得碱式碳酸钴纳米线薄膜,用十二烷基硫醇进行表面修饰后其表现出超疏水性,水滴在其表面的接触角达到152.3°,滚动角接近5°.研究结果表明,薄膜表面微纳米阶层结构及低表面物质的协同作用使其呈超疏水性.与普通镍片和硫醇修饰前的碱式碳酸钴纳米线薄膜相比,超疏水碱式碳酸钴纳米线薄膜具有更好的抗腐蚀性.相关研究有望为超疏水金属表面的制备及其抗腐蚀性研究提供思路.     

铋膜修饰玻碳电极用于线性扫描溶出伏安法测定铝箔中痕量镓

用电化学沉积法将铋离子修饰在玻碳电极上,应用此铋膜修饰玻碳电极测定镓时,将试液在pH 5.4的六次甲基四胺-盐酸缓冲溶液中在-1.30 V处预还原40 s,然后在-1.30~-0.50 V范围内扫描,使镓离子从修饰电极上溶出,实现了镓离子的溶出伏安法测定,在-1.01 V处可得镓离子的氧化峰电位,镓的质量浓度在0.002 8~0.21μg.L-1范围内与其峰电流值呈线性关系,方法的检出限(3S/N)为0.7 ng.L-1。方法用于测定铝箔中镓的含量,加标回收率在98.2%~103.8%之间。     

Evaluation of adhesion between glass/epoxy composite substrate and copper foil for printed circuit board applications

Adhesion between glass/epoxy composite substrate and copper foil was evaluated by 90° peeling test. Effect of fracture behavior and the peel strength on copper foil style was experimentally investigated using copper foils with various surface roughness. As mechanical anchoring effect increases with increased surface roughness, the surface roughness increased the surface roughness of copper foil strongly affected the peeling strength and local load variation during the test. The fracture behavior was characterized by secondary electron image and reflective electron image techniques of scanning electron microscopy (SEM). All of the specimens were found to fracture at the anchor points formed in the resin layer on the surface of the substrate. The experimental results were correlated to a formulation based on the theory of beams on elastic foundation, which is presented for predicting the adhesive strength in the adherend- adhesive system. In order to apply this formulation to a no adhesive system, such as FR-4/copper foil, an analytical model was proposed. In this model, a mixture phase of the copper with the surface resin in the substrate was regarded as the adhesive. The calculated results were in relatively good agreement with the experimental results. It was confirmed that the analysis model and evaluation method is useful to predict the peel strength due to the mechanical anchoring effect.     

200微米DC腐蚀铝箔极限长度的研究

为了探讨电子铝箔经直流电腐蚀后形成隧道孔的生长机理,进一步提高电子铝箔的腐蚀工艺水平,研究了200微米HEC光箔的极限长度在硫酸浓度、温度、二级腐蚀等条件下的影响。发现只改变一级硫酸浓度而不经过二级腐蚀,隧道孔的极限生长有限,不能贯穿整个夹芯层,这可能是光箔成分和立方织构影响蚀孔的生长方向。在不添加硫酸的条件下温度对极限长度的影响非常小,低于70℃下甚至不生长隧道孔,所形成的夹芯层非常厚。而经过0.8 mol/L游离酸的二级腐蚀,隧道孔径向生长可以贯穿整个夹芯层。