A Broadband Quadrature-Modulator with Integrated Baluns

A broadband direct-conversion quadrature-modulator has been implemented in 0.8 m SiGe with integrated baluns in its RF-signal paths. Measured performance includes IRR-values at better than –40 dBc in 0.75–3.6 GHz with output power levels in excess of –20 dBm. For this performance circuit draws 46 mA from a single 2.5 V supply.Esa Tiiliharju was born in Rovaniemi, Finland, in 1966. He received the M.Sc. degree in Information Technology in 1995, and the Lic.Tech degree in electrical engineering in 1998, both from Helsinki University of Technology, Finland.From 1996 to July 1997 he was employed as assistant at Helsinki University of Technology. He has been holding a position of a research assistant from 1997, and he is currently working towards the Ph.D. degree in the Electronic Circuit Design Laboratory at Helsinki University of Technology.His research interests include the design of integrated low-power circuits for portable telecommunication applications. He has designed and measured several integrated circuits for this application area. He is author or co-author for several international refereed conference and journal publications on analog integrated circuits.Kari A.I. Halonen was born in Helsinki, Finland, on May 23, 1958. He received the M.Sc. degree in electrical engineering from the Helsinki University of Technology (HUT) in 1982 and the Ph.D. degree in electrical engineering from the Katholieke Universiteit Leuven, Heverlee, Belgium, in 1987.From 1982 to 1984, he was with HUT as an Assistant and with the Technical Research Center of Finland as a Research Assistant. From 1984 to 1987, he was a Research Assistant with the E.S.A.T. Laboratory, Katholieke Universiteit Leuven, with a temporary grant from the Academy of Finland. Since 1988, he has been with the Electronic Circuit Design Laboratory, HUT, as a Senior Assistant from 1988 to 1990, and as the Director of the Integrated Circuit Design Unit of the Microelectronics Center from 1990 to 1993. He was on leave of absence during the academic year 1992–1993, acting as Research and Development Manager with Fincitec Inc., Finland. From 1993 to 1996, he was an Associate Professor, and since 1997, he has been a full Professor with the Faculty of Electrical Engineering and Telecommunications, HUT. He became the Head of Electronic Circuit Design Laboratory year 1998. He was the Technical Program Committee Chairman for the European Solid-State Circuits Conference in 2000. He is the author or coauthor of over 150 international and national conference and journal publications on analog integrated circuits, and holds several patents on analog integrated circuits. His research interests are in CMOS and BiCMOS analog integrated circuits, particularly for telecommunication applications.Dr. Halonen was an Associate Editor of the IEEE Transactions on Circuits and Systems–Part I: Fundamental Theory and Applications from 1997 to 1999. He has been a Guest Editor for the IEEE Journal of Solid-State Circuits. He received the BeatriceWinner Award from the IEEE International Solid-State Circuits Conference in 2002.     

SiGe／Si异质结器件

本文综述了国际上ＳｉＧｅ／Ｓｉ异质结器件的发展状况，分析了该器件的结构要理，特点，优越性及制造技术，阐述了该器件的广阔应用和对微电子将产的重大影响。     

Solid- and gas-source “hybrid” Si molecular beam epitaxy for a Si1−xGex/Si single quantum well electroluminescent device

A p-i-n diode for a Si_1−xGe_x/Si single quantum well (SQW) electroluminescent (EL) device was successfully fabricated by solid-source (SS) and gas-source (GS) “hybrid” Si molecular beam epitaxy (MBE). First, the undoped SQW layer was grown on a p-type Si(100) substrate by GSMBE using disilane (Si₂H₆) and germane (GeH₄). Then the n-type Si contact layer was regrown by SSMBE after transferring the sample through the air. A (2 × 1) reconstruction was observed on a GSMBE-prepared Si surface even after the sample was exposed to air for 15 h. The excellent quality of the EL p-i-n device was shown by the sharpest emission lines, ≈5.5 meV, ever reported in the EL spectra of an SiGe system. Linear polarization along the SQW plane was also observed for no-phonon replica of EL.     

应变硅NMOS晶体管沟道应变的模拟研究

建立了一种基于硅/锗硅异质结构的应变硅NMOS晶体管的有限元模型,通过模拟研究了沟道区的应变分布及其与器件参数的关系。结果表明,提高锗硅虚拟衬底中锗的摩尔组分、减小应变硅层厚度,可以增加沟道应变。此外,应变量还随器件结构长度的增加而增加。研究结果可为应变硅器件的设计、工艺优化提供参考依据。     

基于锗硅工艺的40-Gb/s分接器

采用0.35μmSiGeBiCMOS工艺设计了一个1∶2分接器,核心电路单元采用经过改进的电路结构实现。由于传统的发射极耦合逻辑结构(ECL)电路的工作速度不能达到要求,对此加以了改进,在发射极耦合逻辑结构中增加一级射极跟随器,形成发射极-发射极耦合逻辑(E2CL)结构,从而提高电路的工作速度。测试结果显示,所设计分接器的工作速度可以达到40Gb/s。整个电路采用单电源5V供电,功耗为510mW。     

一款适用于WCDMA标准的大动态范围SiGe HBT可变增益放大器设计

第三代移动通信标准WCDMA要求放大器增益可调,并且增益动态范围较大.根据这一要求给出了一种基于SiGe HBT具有高动态范围的可变增益放大器(VGA)设计.放大器为三级级联结构,第一级为输入缓冲级,第二级为增益控制级,最后为放大级.VGA的增益控制通过调整第二级的偏置实现.VGA在1.95 GHz频率下,在0～2.7 V增益控制电压变化下,具有44 dB增益变化范围,最大增益49 dB.在最大增益处最小噪声系数为2.584 dB,输入输出电压驻波比低于2,性能良好.     

采用输入信号适配技术的BiCMOS运放

为了满足高性能开关电源中集成运放的应用需要,设计了一种结构简单且具有轨对轨输出的运算放大器.该运放基于0.5μm BiCMOS 工艺,采用浮动输出的输入信号适配器(ISAFO),将输入信号放大至差分输入级的工作区域,从而实现了轨对轨的运行.对所设计的运放进行了仿真分析,结果表明在工作电源电压为±0.75 V、外接100 kΩ电阻的条件下,该运放的直流开环增益达到了102 dB,单位增益-带宽为6.35 MHz,相位裕度为62.5°,而功耗仅约为150 μW.所设计的运放具有很宽的共模输入范围及较高的增益,所以特别适用于开关电源的误差放大器、过流、过压和过热保护模块中.     

一种多模多频无线收发器前端SiGe BiCMOS低噪声放大器

基于IBM 0.18μm SiGe BiCMOS工艺,提出了一种应用于2.4～2.5GHz 802.11b/g频段的低噪声放大器(LNA).电路采用全差分发射极电感负反馈共射共基(Cascode)结构,对称电感有效地降低了芯片面积,优化了电路性能.仿真结果表明:该电路在2.4 GHz到2.5 GHz频率范围内,增益(S21)达到25 dB,噪声系数(NF)小于1.5 dB,大幅度提高了收发机系统的性能.此外,输入和输出匹配(S11,S22)分别达到-15 dB,1 dB压缩点大于-25 dBm.电源电压为2.5 V时电路总电流为3 mA.     

一种新型热关断电路的设计

提出了一种新型BiCMOS过热关断电路.该电路结构简单、功耗较低、迟滞温度范围基本保持不变,可集成在电源管理芯片中作为过热保护模块使用.采用0.6,um BiCMOS工艺,对电路进行HSPICE仿真,结果表明:该电路对电源电压有很强的抑制比,可用于2～12 V电源电压.     

A low power high linearity baseband for a direct conversation CMMB tuner

An analog baseband circuit made in a 0.35-μm SiGe BiCMOS process is presented for China Multimedia Mobile Broadcasting (CMMB) direct conversion receivers. A high linearity 8th-order Chebyshev low pass filter (LPF) with accurate calibration system is used. Measurement results show that the filter provides 0.5-dB passband ripple, 4% bandwidth accuracy, and -35-dB attenuation at 6 MHz with a cutoff frequency of 4 MHz. The current steering type variable gain amplifier (VGA) achieves more than 40-dB gain range with excellent temperature compensation. This tuner baseband achieves an OIP3 of 25.5 dBm, dissipates 16.4 mA under a 2.8-V supply and occupies 1.1 mm2 of die size.