Discrete element simulation of effects of multicontact loading on single particle crushing

Particle crushing commonly occurs in granular materials and affects their structures and mechanical properties. Unlike idealized particles in experimental single particle crushing tests with two loading points, natural particles are crushed under multicontact loading. To date, the criteria and patterns of particle crushing under multicontact conditions are not fully understood. By using the three-dimensional discrete element method, this report explores the effect of multicontact loading on the crushing criterion of a single particle, the crushing pattern, and the relationship between the particle crushing strength and loading distribution. The particles are modelled as aggregates of glued Voronoi polyhedra. The numerical results indicate that the logarithm of the mean principal stress has a good linear correlation with the coordination number. For a specific coordination number, the number of child particles presents a significant normal distribution. For a specific number of child particles, the volumes of child particles can be statistically described as normal or gamma distribution. Three typical models are proposed to qualitatively analyse the relationship between the loading distribution and crushing strength. The relevant conclusions can be helpful in engineering practice and in further studies on crushable granular materials via the discrete element method.     

Ni2P-NiS双助剂促进g-C3N4光催化产氢动力学

本文通过简单的一步水热法得到Ni₂P-NiS双助催化剂,之后采用溶剂蒸发法将Ni₂P-NiS与g-C₃N₄纳米片结合构建获得无贵金属的Ni₂P-NiS/g-C₃N₄异质结。研究结果表明,优化后的复合材料具有良好的光催化产氢活性,其产氢速率最高可到6892.7 μmol·g^-1·h^-1,分别为g-C₃N₄ (150 μmol·g^-1·h^-1)、15%NiS/g-C₃N₄ (914.5 μmol·g^-1·h^-1)和15%Ni₂P/g-C₃N₄ (1565.9 μmol·g^-1·h^-1)的46.1、7.5和4.4倍。这主要归因于Ni₂P-NiS相比Ni₂P和NiS单体具有更好的载流子转移能力,其与g-C₃N₄形成的肖特基势垒能有效促进光生载流子在二者界面上的分离,同时Ni₂P-NiS能进一步降低析氢过电势,进而显著增强了表面析氢反应动力学。本研究为开发稳定、高效的非贵金属产氢助剂提供了实验基础。     

表面凹槽对流体动压润滑油膜厚度的影响

利用自行研发的面接触光干涉油膜厚度测量系统,对表面凹槽滑块的流体动压润滑油膜厚度进行了试验测量,试验中以静止的微型凹槽滑块平面和旋转的光学透明圆盘平面构成润滑副,且两润滑平面始终保持平行;在固定的载荷(速度)条件下,对油膜厚度-速度(载荷)曲线进行测量.结果表明：凹槽的宽度,深度,方向和位置等因素对油膜厚度有着重要影响.同时采用经典Reynolds方程对油膜厚度进行了理论计算,结果表明理论值在某些条件下并不能解释试验结果.     

4H-SiC MESFET肖特基栅接触的界面参数提取

研究了界面态对4H-SiC MESFET的肖特基栅接触的影响.栅接触工艺主要采用Ti/Pt/Au蒸发,经过剥离后形成.基于热电子理论提出了一种参数提取方法,得到界面态密度和界面电容分别为4.386×1013cm-2·eV-1和8.394×10-6F/cm2,这与测量得到的器件端特性一致.     

PtSi／p－Si肖特基势垒红外探测器的研制

介绍了ＰｔＳｉ／ｐ－Ｓｉ肖特基势垒红外探测器（简称ＩＲ－ＳＢＤ）的优化结构及探测机理，给出了探测器的光增益模型，并对器件进行了制作及性能测试。器件在７７Ｋ下，反偏４Ｖ时的反向漏电流为５×１０（－６）μＡ，对１．５２μｍ红外光的灵敏度为２．６９×１０（－２）Ａ／Ｗ，量子效率为２．４％。     

Cubic GaN/AlGaN Schottky-barrier devices on 3C-SiC substrates

In this work, we focus on the fabrication of cubic GaN based Schottky-barrier devices (SBDs) and measured current voltage (I-V) characteristics and the critical field for electronic breakdown. Phase-pure cubic GaN and c-Al_xGa_1 − xN/GaN structures were grown by plasma assisted molecular beam epitaxy (MBE) on 200 μm thick free-standing 3C-SiC (1 0 0) substrates, which were produced by HOYA Advanced Semiconductor Technologies Co., Ltd. The thickness of the c-GaN and c-Al_0.3Ga_0.7N epilayers were about 600 and 30 nm, respectively. Ni/In Schottky contacts 300 μm in diameter were produced on c-GaN and c-Al_0.3Ga_0.7N/GaN structures by thermal evaporation using contact lithography. A clear rectifying behavior was measured in our SBDs and the I-V behavior was analyzed in detail, indicating the formation of a thin surface barrier at the Ni-GaN interface. Annealing of the Ni Schottky contacts in air at 200 °C reduces the leakage current by three orders of magnitude. The doping density dependence of breakdown voltages derived from the reverse breakdown voltage characteristics of c-GaN SBDs is investigated. The experimental values of breakdown voltage in c-GaN are in good agreement with theoretical values and show the same dependence on doping level as in hexagonal GaN. From our experimental data, we extrapolate a blocking voltage of 600 V in c-GaN films with a doping level N_D = 5 × 10¹⁵ cm⁻³.     

单壁碳纳米管场效应晶体管的制备工艺研究

综述了碳纳米管场效应晶体管(CNTFET)的主要结构和导电沟道的制备工艺,如AFM探针操控、CVD原位生长、交流介电泳和L-B大面积操控排布等方法。在对CNTFET的这些结构和制备工艺进行详细分析的基础上,着重指出目前CNTFET导电沟道制备中存在的诸如金属性单壁碳纳米管(SWCNT)的烧除、接触电阻大、滞后现象以及p型CNTFET转化等问题,并针对这些问题提出了具体可行的解决方案。     

Ni(Zr)Si薄膜热稳定性及其肖特基势垒二极管的电学特性

提出在Ni中掺入夹层Zr的方法来提高NiSi的热稳定性．具有此结构的薄膜,600～800℃快速热退火后,薄层电阻保持较低值,小于2Ω/□．经XRD和Raman光谱分析表明,薄膜中只存在低阻NiSi相,而没有高阻NiSi2相生成．Ni(Zr)Si的薄层电阻由低阻转变为高阻的温度在800℃以上,比没有掺Zr的镍硅化物的转变温度上限提高了100℃．Ni(Zr)Si/Si肖特基势垒二极管能够经受650～800℃不同温度的快速热退火,肖特基接触特性良好,肖特基势垒高度为0.63eV,理想因子接近于1．     

A High Power 320-356GHz Frequency Multipliers with Schottky Diodes

A 320-356GHz fixed-tuned frequency doubler is realized with discrete Schottky diodes mounted on 50μm thick quartz substrate.Influence of circuit channel width and thermal dissipation of the diode junctions are discussed for high multiplying effficiency.The doubler circuit is flip-chip mounted on gold electroplated oxygenfree copper film for grounding of RF and DC signals,and better thermal transportation.The whole multiplying circuit is optimized and established in Computer simulation technology (CST) suite.The highest measured multiplying efficiency is 8.0％ and its output power is 5.4mW at 328GHz.The measured typical output power is 4.0mW in 320-356GHz.     

W频段二次谐波I/Q调制混频器的设计

基于自主研发GaAs肖特基二极管（SBD）设计了一款工作于W频段的二次谐波混频器,实现了对射频（RF）信号的I/Q调制。建立了二极管模型,利用电路结构走线长度控制信号流,实现了宽频带内的射频信号混频,并基于此通过HFSS和ADS联合仿真,完成了W频段二次谐波混频器设计。测试结果显示,采用45 GHz信号作为本振信号源,射频80~89 GHz与91~100 GHz的频带范围内变频损耗低于17 dB,最低变频损耗为12 dB;1 dB压缩功率大于11 dBm。仿真结果显示,80~89 GHz与91~100 GHz的镜频抑制效果明显,最好频点镜像抑制达到20 dB。相比于W频段GaAs pHEMT（赝晶型高电子迁移率晶体管）混频器,所设计的GaAs肖特基二极管混频器在较低变频损耗的情况下,具有工艺简单、易实现、高线性度、宽带匹配、高镜像抑制等优点,芯片尺寸仅为1 mm×1 mm。该款W频段混频器达到了目前国内较高水平。