The role of the electrode configuration on the electrical properties of small-molecule semiconductor thin-films

This paper presents a systematic analysis of the electrode configuration influence on the electrical properties of organic semiconductor (OSC) thin-film devices. We have fabricated and electrically characterized a set of planar two-terminal devices. The differences in I-V characteristics between the top and bottom contact structures are presented and analyzed. Top-contact configurations have a linear current vs. electric field behavior, while the bottom-electrode devices display a transition from ohmic to space-charge-limited conduction regime. The transition is temperature- and thickness-dependent. Finite-element calculations show that when the OSC film is connected using top electrodes, the current flows through the OSC bulk region. On the other hand, the bottom-electrode configuration allows most of the current to flow near the OSC/substrate interface. The current probes interfacial states resulting in a space-charge conduction regime. The results shed some light on the so-called “contact effects” commonly observed in organic thin-film transistors. The findings presented here have implications for both the understanding of the charge transport in OSC films and the design of organic semiconductor devices.     

NiuPt1-uSivGe1-v/Si0.72Ge0.28界面形貌的改善

针对锗硅在形成金属锗硅化物时存在部分应力释放、界面形貌特性变差的问题,提出了在Si0.72Ge0.28上分别外延薄硅(Si)覆盖层和锗硅(Si072Ge0.28)缓冲层的工艺方案.实验结果表明,通过两步快速热退火,两个方案的工艺条件都能形成低阻的NiuPt1-uSitGe1-v和改善NivPt1-uSitGe./Si0.72Ge0.28的界面形貌.但相比较而言,在Si0.72Ge0.28上外延10 nm Si覆盖层的方案能够形成更好的NiuPt1-uSivGe1-t/Si0.72Ge0.28界面形貌.与没有改进的方案相比,该方案形成的肖特基接触更具有更低的肖特基接触势垒高度,更易形成欧姆接触.     

用于毫米波段行波管的可调预失真器

提出了满足行波管功率放大器(TWTA)要求的毫米波段的可调预失真线性化器,该预失真器基于90°定向耦合器、GaAs肖特基二极管、微带线和负载电阻,产生预失真信号。通过调节GaAs肖特基二极管的偏置电压、微带线电长度及负载电阻可以得到不同的增益扩展和相位扩张效应,在频率为29 GHz~31 GHz和额定输入功率范围内,增益扩展范围为5 dB~11.5 dB,相位扩张范围为35°~65°。仿真及实测结果表明:该预失真电路可调性强,满足通信工程TWTA的补偿需求。     

Dimers linked by type‐I C—F...F—C contacts in (Z)‐3‐methyl‐4‐[2‐(4‐methylphenyl)hydrazinylidene]‐1‐(pentafluorophenyl)‐1H‐pyrazol‐5(4H)‐one

The title compound, C₁₇H₁₁F₅N₄O, is described and compared with two closely related analogues in the literature. There are two independent molecules in the asymmetric unit, linked by N—H...O hydrogen bonds and π–π interactions into dimeric entities, presenting a noticeable noncrystallographic C₂ symmetry. These dimers are in turn linked by a medium‐strength type‐I C—F...F—C interaction into elongated tetramers. Much weaker C—H...F contacts link the tetramers into broad two‐dimensional substructures parallel to (101).     

Influence of sputter power on structural and electrical properties of TiO2 films for Al/TiO2/Si gate capacitors

Titanium dioxide (TiO₂) thin films were deposited onto p‐Si substrates held at room temperature by reactive Direct Current (DC) magnetron sputtering at various sputter powers in the range 80–200 W. The as‐deposited TiO₂ films were annealed at a temperature of 1023 K. The post‐annealed films were characterized for crystallographic structure, chemical binding configuration, surface morphology and optical absorption. The electrical and dielectric properties of Al/TiO₂/p‐Si structure were determined from the capacitance–voltage and current–voltage characteristics. X‐ray diffraction studies confirmed that the as‐deposited films were amorphous in nature. After post‐annealing at 1023 K, the films formed at lower powers exhibited anatase phase, where as those deposited at sputter powers > 160 W showed the mixed anatase and rutile phases of TiO₂. The surface morphology of the films varied significantly with the increase of sputter power. The electrical and dielectric properties on the air‐annealed Al/TiO₂/p‐Si structures were studied. The effect of sputter power on the electrical and dielectric characteristics of the structure of Al/TiO₂/p‐Si (metal‐insulator‐semiconductor) was systematically investigated. Copyright © 2014 John Wiley & Sons, Ltd.     

Triplet pairing states with equal spins in ferromagnet/superconductor heterojunctions for noncollinear magnetizations

Four-component Bogoliubov-de Gennes equations are applied to study tunneling conductance spectra of ferromagnet/ferromagnet/d-wave superconductor (F₁/F₂/d-wave S) tunnel junctions and to find out signs of spin-triplet pairing correlations induced in the proximity structure. The pairing correlations with equal spins arises from the novel Andreev reflection (AR), which requires at least three factors: the usual AR at the F₂/S interface, spin flip in the F₂ layer, and superconducting coherence kept up in the F₂ layer. Effects of angle α between magnetizations of the two F layers, polarizations of the F₁ and F₂ layers, the thickness of the F₂ layer, and the orientation of the d-wave S crystal on the tunneling conductance are investigated. A conversion from a zero-bias conductance dip at α = 0 to a zero-bias conductance peak at a certain value of α can be seen as a sign of generated spin-triplet correlations.     

Back contact–absorber interface modification by inserting carbon intermediate layer and conversion efficiency improvement in Cu2ZnSn(S,Se)4 solar cell

Carbon layers have been employed as intermediate layers between Mo back contact and Cu₂ZnSn(S_1–xSe_x)₄(CZTSSe) absorber film prepared by sol–gel and post‐selenization method. Carbon layers with appropriate thickness can significantly inhibit the formation of MoSe₂ and voids at bottom region of the absorber, and therefore reduce the series resistance remarkably. The conversion efficiency can be boosted by the introducing of the carbon layer from 6.20% to 7.24% by enhancement in short current density, fill factor and open voltage in comparison to the reference sample without carbon layer. However, excess thickness of carbon layer will worse device performance due to the deteriorated absorber crystallinity. In addition, the time‐resolved photoluminescence analysis shows that inserting the carbon layer with suitable thickness does not introduce recombination and lower minority lifetime. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

Swift heavy ion induced capacitance and dielectric properties of Ni/n-GaAs Schottky diode

The in-situ capacitance and dielectric properties of 25 MeV C⁴⁺ ion irradiated Ni/n-GaAs Schottky barrier diode (SBD) were studied at 100 kHz in the fluence range 5 × 10¹⁰ – 5 × 10¹³ ions/cm². The investigation shows reduction in capacitance and charge density with increase in ion fluence. Consequent changes were observed in other related parameters like conductance, dielectric constant, dielectric loss, loss tangent and electrical modulus. The results were interpreted in terms of generation of swift heavy ion induced acceptor trap states by electronic energy loss mechanism. Besides, the switch over characteristics of depletion to inversion regions in the CV plot reveals minority carrier recombination centers also. The dispersion and relaxation peaks observed in bias dependent dielectric plots were ascribed to the polarization and relaxation mechanism due to the interfacial trap states. The traps and recombination centers were found to alter the barrier characteristics of the fabricated SBD depending upon the ion fluence.     

Dielectric properties of tetragonal tungsten bronze films deposited by RF magnetron sputtering

Tetragonal tungsten bronze (TTB) films have been synthesised on Pt(111)/TiO₂/SiO₂/Si substrates from Ba₂LnFeNb₄O₁₅ ceramics (Ln = La, Nd, Eu) by RF magnetron sputtering. X-ray diffraction measurements evidenced the multi-oriented nature of films with some degrees of preferential orientation along (111). The dependence of the dielectric properties on temperature and frequency has been investigated. The dielectric properties of the films are similar to those of the bulk, i.e., ε ∼150 and σ ∼10⁻⁶ Ω⁻¹ cm⁻¹ at 1 MHz and room temperature. The films exhibit two dielectric anomalies which are attributed to Maxwell Wagner polarization mechanism and relaxor behaviour. Both anomalies are sensitive to post-annealing under oxygen atmosphere and their activation energies are similar E_a ∼0.30 eV. They are explained in terms of electrically heterogeneous contributions in the films.