140 GHz高速无线通信技术研究

太赫兹频段的宽带特性使得其在高速无线通信领域存在巨大的应用潜力,当前太赫兹通信存在的主要问题是辐射功率低、大气衰减严重及调制解调困难。该文在提出了基于肖特基二极管次谐波混频技术+16 QAM高速数字调制解调技术的太赫兹波超高速信息传输系统实现方案,该方案提高了太赫兹通信的频谱效率。并在国内首次实现了140 GHz无线通信实验系统,以实验方法验证了太赫兹信道的幅相失真特性完全满足高阶数字信号的传输要求。该系统在0.5 m距离上实现了10 Gbps无线传输实验和高清视频传输,辐射功率-3 dBm,系统误码率小于1e-6。     

用于太赫兹成像的CMOS肖特基二极管三维结构

提出了一种简单、科学、有效的高截止频率肖特基势垒二极管设计方法。通过SMIC 180 nm工艺制备的肖特基二极管的截止频率为800 GHz,分析测试结果和仿真数据优化后的肖特基势垒二极管截止频率可以达到1 THz左右。完成了包括天线、匹配电路和肖特基势垒二极管的集成探测器,在220 GHz下其测试响应率可达130 V/W,等效噪声功率估计为400 pw/。完成了陶瓷瓶内不可见液面的成像实验并取得了良好的效果。     

Schottky barrier formation at nonpolar Au/GaN epilayer interfaces

A new approach to studying Schottky barrier formation on a nanometer scale is demonstrated using both Auger electron spectroscopy core level shift and secondary electron threshold work function measurements on cleaved epilayers. Band bending induced by metallization of cleaved epilayer surfaces can be investigated without introducing defects due to chemical or ion beam surface cleaning. For GaN epilayers, this approach also avoids complications due to piezoelectric effects on polar-axis growth surfaces. Initial investigations of Au and Ag Schottky contact formation on GaN in ultrahigh vacuum reveal the presence of a pinning level ∼1.7 eV above the valence band edge.     

Pt/Au/n-InGaN肖特基接触的电流输运机理

基于热电子发射和热电子场发射模式,利用I-V方法研究了Pt/Au/n-InGaN肖特基接触的势垒特性和电流输运机理,结果表明,在不同背景载流子浓度下,Pt/Au/n-InGaN肖特基势垒特性差异明显.研究发现,较低生长温度制备的InGaN中存在的高密度施主态氮空位（V_N）缺陷导致背景载流子浓度增高,同时通过热电子发射模式拟合得到高背景载流子浓度的InGaN肖特基势垒高度和理想因子与热电子场发射模式下的结果差别很大,表明V_N缺陷诱发了隧穿机理并降低了肖特基势垒高度,相应的隧穿电流显著增大了肖特基势垒总的输运电流,证实热电子发射和缺陷辅助的隧穿机理共同构成了肖特基势垒的电流输运机理.低背景载流子浓度的InGaN肖特基势垒在热电子发射和热电子场发射模式下拟合的结果接近一致,表明热电子发射是其主导的电流输运机理.     

Study on the failure temperature of Ti/Pt/Au and Pt5Si2-Ti/Pt/Au metallization systems

The Ti/Pt/Au metallization system has an advantage of resisting KOH or TMAH solution etching. To form a good ohmic contact, the Ti/Pt/Au metallization system must be alloyed at 400℃. However, the process temperatures of typical MEMS packaging technologies, such as anodic bonding, glass solder bonding and eutectic bonding, generally exceed 400℃. It is puzzling if the Ti/Pt/Au system is destroyed during the subsequent packaging process. In the present work, the resistance of doped polysilicon resistors contacted by the Ti/Pt/Au metallization system that have undergone different temperatures and time are measured. The experimental results show that the ohmic contacts will be destroyed if heated to 500℃. But if a 20 nm Pt film is sputtered on heavily doped polysilicon and alloyed at 700℃ before sputtering Ti/Pt/Au films, the Pt₅Si₂-Ti/Pt/Au metallization system has a higher service temperature of 500℃, which exceeds process temperatures of most typical MEMS packaging technologies.     

Thermal annealing behaviour of Al/Ni/Au multilayer on n-GaN Schottky contacts

Recently GaN-based high electron mobility transistors (HEMTs) have revealed the superior properties of a high breakdown field and high electron saturation velocity. Reduction of the gate leakage current is one of the key issues to be solved for their further improvement. This paper reports that an Al layer as thin as 3 nm was inserted between the conventional Ni/Au Schottky contact and n-GaN epilayers, and the Schottky behaviour of Al/Ni/Au contact was investigated under various annealing conditions by current--voltage (I--V) measurements. A non-linear fitting method was used to extract the contact parameters from the I--V characteristic curves. Experimental results indicate that reduction of the gate leakage current by as much as four orders of magnitude was successfully recorded by thermal annealing. And high quality Schottky contact with a barrier height of 0.875 eV and the lowest reverse-bias leakage current, respectively, can be obtained under 12 min annealing at 450°C in N₂ ambience.     

叠盖电极技术在SPRITE 探测器上的应用

文中主要介绍了叠盖电极技术在SPRITE探测器上的实际应用，并给出了具体实验结果。选择适当的叠盖电极尺寸可以使SPRITE的响应率Rυ提高一倍以上，探测率D^*普遍提高30％左右，高的可达80％。实验结果表明，叠盖电极技术明显地提高了SPRITE器件的性能，是一种简便的提高SPRITE性能的新途径。     

N—H…X (X = Cl and Br) hydrogen bonds in three isomorphous 3,5‐dichloropyridinium salts

Specific short contacts are important in crystal engineering. Hydrogen bonds have been particularly successful and together with halogen bonds can be useful for assembling small molecules or ions into crystals. The ionic constituents in the isomorphous 3,5‐dichloropyridinium (3,5‐diClPy) tetrahalometallates 3,5‐dichloropyridinium tetrachloridozincate(II), (C₅H₄Cl₂N)₂[ZnCl₄] or (3,5‐diClPy)₂ZnCl₄, 3,5‐dichloropyridinium tetrabromidozincate(II), (C₅H₄Cl₂N)₂[ZnBr₄] or (3,5‐diClPy)₂ZnBr₄, and 3,5‐dichloropyridinium tetrabromidocobaltate(II), (C₅H₄Cl₂N)₂[CoBr₄] or (3,5‐diClPy)₂CoBr₄, arrange according to favourable electrostatic interactions. Cations are preferably surrounded by anions and vice versa ; rare cation–cation contacts are associated with an antiparallel dipole orientation. N—H…X (X = Cl and Br) hydrogen bonds and X …X halogen bonds compete as closest contacts between neighbouring residues. The former dominate in the title compounds; the four symmetrically independent pyridinium N—H groups in each compound act as donors in charge‐assisted hydrogen bonds, with halogen ligands and the tetrahedral metallate anions as acceptors. The M —X coordinative bonds in the latter are significantly longer if the halide ligand is engaged in a classical X …H—N hydrogen bond. In all three solids, triangular halogen‐bond interactions are observed. They might contribute to the stabilization of the structures, but even the shortest interhalogen contacts are only slightly shorter than the sum of the van der Waals radii.     

220GHz 次谐波混频器设计

本文介绍了一种基于平面肖特基势垒二极管的220GHz 次谐波混频器的设计。该混频器采用Teratech 公司的反 向并联二极管对,安装在0.05mm 厚的石英基片悬置微带上。采用HFSS 和ADS 联合仿真,使得混频器在射频频率为 215GHz~225GHz 范围内仿真所得变频损耗低于8dB,并在219GHz 时取得最佳变频损耗6.75dB。该混频器具有结构简单, 易于加工,变频损耗低的优点。     

Alpha particle detector with planar double Schottky contacts directly fabricated on semi-insulating GaN:Fe template

Alpha particle radiation detectors with planar double Schottky contacts (DSC) are directly fabricated on 5-μm-thick epitaxial semi-insulating (SI) GaN:Fe film with resistivity higher than 1×10⁸Ω·cm. Under 10 V bias, the detector exhibits a low dark current of less than 5.0×10^-11 A at room-temperature, which increases at higher temperatures. Linear behavior in the semi-log reverse current-voltage plot suggests that Poole-Frenkel emission is the dominant carrier leakage mechanism at high bias. Distinct double-peak characteristics are observed in the energy spectrum of alpha particles regardless of bias voltage. The energy resolution of the SI-GaN based detector is determined to be ～ 8.6% at the deposited energy of 1.209 MeV with a charge collection efficiency of ～ 81.7%. At a higher temperature of 90 ℃, the measured full width at half maximum (FWHM) rises to 235 keV with no shift of energy peak position, which proves that the GaN detector has potential to work stably in high temperature environment. This study provides a possible route to fabricate the low cost GaN-based alpha particle detector with reasonable performance.