Intermixing during epitaxial growth and Mössbauer spectroscopy with probe layers

Mössbauer spectroscopy with ⁵⁷Fe (¹¹⁹Sn) probe layers is a useful method to study the local magnetic structures at buried interfaces. However interface alloying, which always exists in the real samples, have to be taken into account for accurate interpretation of experimental data. We developed an algorithm, which describes the interface intermixing in the multilayers. Substituting deposited atoms by atoms of substrate and floating of deposited atoms in the upper layers during epitaxial growth leads to the formation of asymmetric chemical and magnetic interfaces. This asymmetry in the M₁/M₂ superlattices can explain the difference between magnetic responses from M₁ on M₂ and M₂ on M₁ interfaces which were observed in experiments. Applying this intermixing model to the systems with probe layers located at different distances from the interfaces gives the natural explanation of hyperfine fields distributions on probe atoms and helps us clarify some discrepancies reported in the literature.     

微机在应变测量中的应用

微机在应变测量中的应用，采用上位机和下位机组合方式．上位机为一台ＩＢＭ－ＰＣ／ＸＴ微机，用于对数据进行后处理．下位机以Ｚ８０－ＣＰＵ为控制器，由传感器、转换器、接口及外设等组成数据采集器，实施对应变、压力和位移等参数的采集、显示和打印（即数据的预处理）．上位机和下位机之间的数据传输，采用串行的方式，通过ＲＳ－２３２接口完成．本文主要以应变的采集处理为例，介绍系统功能、硬件配置及软件设计．     

采用热处理方法提高MEH-PPV单层聚合物有机发光二极管发光性能的研究

对以MEH－PPV为发光层的单层聚合物有机发光二极管（OLED）器件在最佳条件下进行真空热处理，并用金相显微镜观察施加电压后器件的阴极表面形貌。发现处理后的器件阴极表面的气泡及黑斑明显减少。器件的发光性能显著提高。与未经处理的器件相比，最大相对发光强度提高了一个数量级、启亮电压降低了2．0V，半寿命提高了12．7倍。初步分析表明热处理方法提高器件发光性能的主要原因在于有效地减少了器件在工作过程中由于焦耳热产生的某些气体，从而减少阴极表面气泡及黑斑的出现，另一方面，热处理方法也增强了有机发光层与阴极接触界面的结合力，提高电子注入水平。     

串行接口LED数码管及键盘管理器件ZLG7289A的原理与应用

介绍了LED数码管及键盘管理器ZLG7289A的原理与应用。该芯片具有SPI串行接口，可同时驱动8位共阴式数码管(或64只独立LED)，还可连接多达64键的键盘矩阵，单块芯片即可完成LED显示、键盘接口等全部功能。文章给出了ZLG7289A的特点、引脚功能、指令说明和经典电路．并以单片机AT89C51为例，给出了其接口电路及相应源程序。     

NiCuZn铁氧体和银内电极的共烧行为

NiCuZn铁氧体正作为磁介质广泛地应用于低烧多层片式电感，因此有必要对其与银内电极的共烧行为进行研究。该文主要介绍NiCuZn铁氧体／银内电极多层复合体共烧过程中的烧结收缩、界面反应、扩散对介质性能的影响。尖晶石结构中存在相当数量的空位，这为银离子提供了一定的溶解度，因此在共烧过程中银对铁氧体的相组成影响较小。银对铁氧体性能的影响体现在两个方面。一方面是由于银具有相对低的烧结温度，从而在烧结过程中起到助烧剂的作用，促进致密化过程，提高烧结体的密度和磁导率；另一方面，银促使铁氧体中的铜在晶界处析出，导致晶界处应力，使磁导率降低，晶粒生长也被一定程度地抑制。     

TMS320F240串口通信特征及其应用

主要论述了TMS320F240串行外设接口模块的特点，并通过与MCS5l单片机通信，实现液晶显示。     

Molecular weight dependence of diblock copolymer segregation at a polymer/polymer interface

Utilizing forward recoil spectrometry (FRES), we have determined the segregation isotherm which describes the interfacial excess z_i^* of diblock copolymers of poly (d₈-styrene-b-2-vinylpyridine) (dPS-PVP) at the interface between the homopolymers PS and PVP as a function of ?_∞, the volume fraction of diblock copolymer remaining in the host homopolymer. All the samples were analyzed after annealing at temperatures and times sufficient to achieve equilibrium segregation. The effect of the degree of polymerization of both the diblock copolymers and the host homopolymers on the segregation isotherm is investigated. When the degree of polymerization of the homopolymer is much larger than that of the diblock copolymer, the normalized interfacial excess (z_i^*/R_g), where R_g is the radius of gyration of an isolated block copolymer chain, is a universal function of that portion of the block copolymer chemical potential due to chain stretching. The existence of such a universal function is predicted by theory and its form is in good agreement with self-consistent mean field calculations. Using these results, one can predict important aspects of the block copolymer segregation (e.g., the saturation interfacial excess) without recourse to the time-consuming numerical calculations. © 1994 John Wiley & Sons, Inc.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.     

SDI接口数字监视设备的设计与实现

介绍了一种对SDV(串行数字视频)信号进行解码的设备设计方案，提出了该系统的总体构架，并对该系统的硬件设计、软件设计进行了全面的论述。设计的产品具有较高的性能价格比，已进入了推广阶段。     

等厚双层涂层材料受集中力作用的平面问题理论解

界面应力的正确评价是分析薄膜涂层材料力学特性的难题之一。利用镜像点法和Dirichlet等值性原理，本文推导了等厚双层薄膜涂层材料受表面集中力作用的平面问题理论解。该显式理论解是以固定在各镜像点上的局部坐标系下的Goursat应力函数的形式给出的。对应于高阶镜像点的应力函数，可通过递推的方法，从对应于低阶镜像点的应力函数求得，而且也易于计算机编程。随着镜像点阶数的增大，它与界面的距离也越来越大，因而相对应的应力函数对界面应力的影响越来越小。最后的算例表明，只需考虑前面有限个镜像点，便可获得足够精度的解。该理论解可作为格林函数，以求解复杂问题的理论解，也可用作边界元法的基本解，提高数值计算的精度和效率。