SMT回流焊温度测试仪的设计

在表面组装技术中，炉温测试对于检测和监控回流焊质量是极其重要的，回流焊温度测试仪就是检测温度变化曲线的设备。本文设计的回流焊温度测试仪由现场单片机控制的测试系统和上位微机组成。现场单片机控制的测试系统对温度进行采集和处理，并通过串口发送给微机，由微机实现数据分析、曲线显示和打印。实验结果表明，该测试仪能够准确地测出回流焊温度。     

倒装片的无铅焊接

文章通过试验证明:纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。锡和钴金属互化物具有比目前铜-UBM替代物更好的特性。     

无铅焊接爆板之成因及控制

主要从板材、PCB制程、焊接过程和受潮吸湿等方面论述了无铅焊接爆板产生的原因并提出相应的控制措施。     

Analytical wide-band modeling of high frequency resistance in integrated spiral inductors

For integrated spiral inductor synthesis, designers and design automation tools require efficient modeling techniques during the initial design space exploration process. In this paper, we introduce an analytical frequency-dependent resistance model for integrated spiral inductors. Based on our resistance formulation, we have developed a systematic technique for creating wide-band circuit models for accurate time domain simulation. The analytical resistance model provides a fast alternative to field solver-based approaches with typical errors of less than 2.6 percent while surpassing the accuracy of several other analytical modeling techniques by an order of magnitude. Furthermore, the wide-band circuit generation technique captures the frequency-dependent resistance of the inductor with typical errors of less than 3.2 percent.     

Microstructure coarsening during static annealing of 60Sn40Pb solder joints: I stereology

The phase size distributions (PSDs) of the Sn, Pb, and the combined Pb and Sn phases, and the shape factor δ were determined for as-reflowed 60Sn40Pb solder joints and following their annealing at 50°C to 150°C. The PSDs in all cases had a positive skew which was approximated by a log-normal function. The PSDs were time invariant and were in accord with the Bitti and Nunzio model for phase coarsening. The shape factor, δ, decreased with the mean of the combined Pb and Sn phase size, and with temperature. Whether or not δ affects the PSDs is not clear.     

High Entropy Alloys as Filler Metals for Joining

In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 °C) and brazing (>450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.     

黄土构造节理研究及其应用

作者发现大量不同力学性质的黄土构造节理后，识别了它们的区域性、系统性特征；认定其两组扭裂面代表新构造应力场最大剪切应力方向，利用黄土构造节理系及由其控制的土层沟槽网络恢复了相应地区Q3-4构造应力场；提出构造节理是黄土区地下水运移的主要通道和赋存的场所；发现构造节理是黄土区地裂缝、滑坡、崩塌和水土流失等地质灾害的构造基础之一，证实构造节理是黄土地层的软弱面，风化和继之而来的应力侵蚀就由此开始，进而逐步塑造黄土碟、穴、井、桥、柱、墙、沟等潜蚀地貌和部分侵蚀地貌。研究黄土构造节理对恢复新构造应力场、帮助预测地裂乃至地震活动、控制水土流失和滑塌灾害、进行工程乃至区域稳定性评价、重新认识黄土潜蚀地貌发育规律、指导干旱半干旱黄土区找水，既有理论意义又有实际意义。     

XIAP表达水平对5-Fu诱导肝癌细胞凋亡的影响

目的研究XIAP mRNA及蛋白表达水平对不同剂量5-氟尿嘧啶（5-fluorouracil,5-Fu）诱导人肝癌细胞HepG2凋亡的影响。方法脂质体介导含XIAP基因全长的质粒pef-XIAP转染人肝癌细胞HepG2,采用逆转录聚合酶链反应（RT—PCR）及western blotting检测XIAP基因和蛋白表达水平。通过不同剂量5-Fu诱导细胞凋亡,使用CCK-8试剂通过比色法分析检测5-Fu对转染pef-XIAP的HepG2细胞生长活性的抑制作用。结果各组HepG2细胞在不同剂量的5-Fu诱导下发生凋亡、与普通HepG2细胞组比较．转染XIAP基因的HepG2细胞组的凋亡率显著降低。结论XIAP基因在人肝癌细胞HepG2中的高表达可以明显降低化疗药物5-Fu诱导的细胞凋亡,其可能在肝癌化疗耐药中起一定作用。     

低卤素无铅焊锡膏研制

针对当前高卤素无铅焊锡膏腐蚀性较大的缺点,研制出一种低卤素无铅焊锡膏,并测试其主要性能参数,如黏度、润湿性、卤素含量、坍塌性等。结果表明:该焊锡膏的黏度为195Pa·s,卤素质量分数为0.023%,其他性能符合IPCJ—STD—005等行业要求。     

超薄芯片叠层封装器件热可靠性分析

采用通用有限元软件MSC.Marc,模拟分析了一种典型的多层超薄芯片叠层封装器件在经历回流焊载荷后的热应力及翘曲分布情况,研究了部分零件厚度变化对器件中叠层超薄芯片翘曲、热应力的影响。结果表明:在整个封装体中,热应力最大值(116.2 MPa)出现在最底层无源超薄芯片上,结构翘曲最大值(0.028 26 mm)发生于模塑封上部边角处。适当增大模塑封或底层无源芯片的厚度或减小底充胶的厚度可以减小叠层超薄芯片组的翘曲值;适当增大底层无源超薄芯片的厚度(例如0.01 mm),可以明显减小其本身的应力值10 MPa以上。