ITO材料在减反射膜设计中的应用

改变ITO材料通常作为透明导电膜单独使用的状况,将其作为减反射膜系中的一层,能够在很大程度上增加ITO透明导电膜在可见光部分的透过率.通过使用将ITO材料置于膜系的内层和最外层两类不同的设计思想,可以使ITO透明导电膜达到相当优良的应用效果.使用低压反应离子镀方法制备了设计的两类减反射膜系,实验证明,膜层在可见光部分的透过率显著提高,剩余反射率明显下降,并得到了平均透过率为95.83%,最高透过率达到97.26%,方块电阻为13.2～24.6Ω/□的试验结果.     

A surface-mounted device assembly technique for small optics based on laser reflow soldering

The three-dimensional miniaturized optical surface-mounted device (TRIMO-SMD) is a new flexible and automated assembly technique for small optical components (maximum diameter for a lens is 2 mm) based on laser reflow soldering technique. This technology can be compared to the electronic SMD technique but applied to micro-optical devices. We present some recent developments of TRIMO-SMD in its application to industrial products.     

大范围光纤Bragg光栅压力传感器增敏实验研究

鉴于钛合金材料具有低弹性模量、受温度影响小等特性,设计制作了一种以钛合金管作为光纤Bragg光栅应变增敏衬底元件的高压压力传感器件.通过与电阻应变计实时监控的对比,从实验上研究了光纤Bragg光栅的中心波长偏移对调谐压强的响应.结果表明:这种增敏设计,具有良好的线性响应和可重复性,且与理论推导结果吻合较好.增敏后对压力的响应灵敏度可达0.034 nm/MPa,测压量程可达0~40 MPa,甚至更宽.     

连续40 W 808 nm量子阱线阵二极管激光封装技术

研究了高功率二极管激光 (LD)封装中的铟焊料蒸镀工艺和回流焊工艺对芯片焊接状态的影响。在数值模拟和实验研究的基础上 ,优化了冷却器结构设计 ,研制出具有热阻低、压降小的铜微通道液体冷却器 ,可以满足热耗散功率大于 6 0W的二极管激光器散热冷却需要。通过封装实验得到输出功率 40W ,波长 80 8nm ,谱线半高宽<2nm ,电光效率近 40 %的连续线阵二极管激光器。用该激光器进行了抽运Nd∶YAG固体激光实验 ,在抽运功率为 40W时 ,获得 11 8W单横模固体激光输出 ,光 光效率约为 30 %。     

Sequence of the most informative joints (SMIJ): A new representation for human skeletal action recognition

Much of the existing work on action recognition combines simple features with complex classifiers or models to represent an action. Parameters of such models usually do not have any physical meaning nor do they provide any qualitative insight relating the action to the actual motion of the body or its parts. In this paper, we propose a new representation of human actions called sequence of the most informative joints (SMIJ), which is extremely easy to interpret. At each time instant, we automatically select a few skeletal joints that are deemed to be the most informative for performing the current action based on highly interpretable measures such as the mean or variance of joint angle trajectories. We then represent the action as a sequence of these most informative joints. Experiments on multiple databases show that the SMIJ representation is discriminative for human action recognition and performs better than several state-of-the-art algorithms.     

Analysis of Power Consumption on Laser Solder Joints of Electric Connector

Laser soldering process was introduced in Universal serial bus （USB） 2.0 electric connector to improve the mechanical and electrical bonding reliabil- ity. While, the effects of laser soldering technology on electric connector solder joints need to be estimated com- pletely, especially on power consumption. The combined method based on numerical simulation and the Accelerated temperature experiment （ATE） was developed to analyze the power consumption of USB 2.0 electric connector in this paper. The ATE contains thermal cycle and thermal shock tests, and the four-electrode method is used to ob- tain the conductivity of solder joints. Numerical modeling and analysis was used to quantify the power consumption and optimize the geometry of solder joints, because the electric experimental measurements of power consumption during ATE are time-costing and often intractable. Accurate knowledge of the power consumption is a prerequisite for the reliability of the electric connector.     

选择性波峰焊技术在SMT中的应用

选择性波峰焊技术是SMT技术中新兴发展的技术,它的出现较大的满足了高密度多样性混装PCB板的组装要求。选择性波峰焊具有焊点参数单独设置,对PCB热冲击小,助焊剂喷涂量少,焊接可靠性强等优点,正逐渐成为复杂PCB不可或缺的焊接技术。通过查阅大量资料,综述了选择性波峰焊技术的优势和其在SMT领域内的应用及其设备的维护。     

高密度超多芯连接器组装工艺研究

为了适应电子产品小型化和高密度集成要求,高密度超多芯连接器被广泛使用。由于其引线数量多、间距小、焊接间隙微小等原因,传统手工焊接方法很难满足其焊接质量要求。对高密度超多芯连接器组装方法进行了研究。通过焊接工艺优化,成功实现了焊接间隙0.08 mm的LRMS系列连接器可靠焊接,一次组装合格率达到98%以上。     

片式电阻混合焊点热循环负载可靠性研究

对在不同工艺参数下形成的、并且经过不同周数热循环负载的片式电阻混合焊点、有铅焊点和无铅焊点进行了外观检测和剪切测试。结果显示,在不同工艺参数下形成的混合焊点的剪切力,随热循环周数的变化趋势有所不同,但是在保证片式电阻焊端和焊料充分熔融的情况下,部分混合焊点的平均剪切力比有铅焊点高,热循环1 000周后,为9.1～11.1 N。     

Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding

While extensive research on the lead-free solder has been conducted, the high melting temperature of the lead-free solder has detrimental effects on the packages. Thermosonic bonding between metal bumps and lead-free solder using the longitudinal ultrasonic is investigated through numerical analysis and experiments for low-temperature soldering. The results of numerical calculation and measured viscoelastic properties show that a substantial amount of heat is generated in the solder bump due to viscoelastic heating. When the Au bump is thermosonically bonded to the lead-free solder bump (Sn-3%Ag-0.5%Cu), the entire Au bump is dissolved rapidly into the solder within 1 sec, which is caused by the scrubbing action of the ultrasonic. More reliable solder joints are obtained using the Cu/Ni/Au bump, which can be applied to flip-chip bonding.