裸眼3D系统SD卡FPGA读取显示研究

SD卡可为便携式裸眼3D设备提供数据来源,图像存储于SD卡中,FPGA以SPI协议方式读出,再经过FIFO和SDRAM进行数据缓存,通过接口输入显示器显示.探讨了通过FPGA器件读取SD卡图像进行显示的实现方法,得出了SD卡文件读取及显示的可行逻辑设计.系统性能经过初步验证,可行性良好.     

微波、毫米波GaN HEMT与MMIC的新进展

综述了近几年微波、毫米波氮化镓高电子迁移率晶体管(GaN HEMT)与单片微波集成电路(MMIC)在高效率、宽频带、高功率和先进热管理等方面的应用创新进展.介绍了基于GaN HEMT器件所具有的高功率密度和高击穿电压,采用波形工程原理设计的各类开关模式的高效率功率放大器,以及基于GaN HEMT器件的高功率密度、高阻抗的特点与先进的宽带拓扑电路和功率合成技术相结合的宽频带和高功率放大器.详细介绍了微波高端和毫米波段的高效率、宽频带和高功率放大器,多功能电路和多功能集成的GaN MMIC.最后阐述了由于GaN HEMT的功率密度是其他半导体器件的数倍,其先进热管理的创新研究也成为热点.     

n型纳米非对称DG-TFET阈值电压特性研究

n型纳米非对称双栅隧穿场效应晶体管(DG-TFET)速度快、功耗低,在高速低功耗领域具有很好的应用前景,但其阈值电压的表征及其模型与常规MOSFET不同.在深入研究n型纳米非对称DG-TFET的阈值特性基础上,通过求解器件不同区域电场、电势的方法,建立了n型纳米非对称DG-TFET器件阈值电压数值模型,探讨了器件材料物理参数以及漏源电压对阈值电压的影响,通过与Silvaco Atlas的仿真结果比较,验证了模型的正确性.研究表明,n型纳米非对称DG-TFET的阈值电压分别随着栅介质层介电常数的增加、硅层厚度的减薄以及源漏电压的减小而减小,而栅长对其阈值电压的影响有限.该研究对纳米非对称DG-TFET的设计、仿真及制造有一定的参考价值.     

Fabrication of ozone gas sensor based on FeOOH/single walled carbon nanotube-modified field effect transistor

A novel ozone (O₃) sensor is fabricated using commercial metal oxide field effect transistor (MOSFET), modified with single-walled carbon nanotubes (SWCNTs). In this study, integrated circuit (IC: BS250) was selected as the selective probe for O₃ detection. For this purpose, a plastic cover on the surface of the drain was drilled to bare the drain surface, followed by its modification with nitrogen and sulfur-functionalized SWCNTs by chemical vapor deposition (CVD) process. The CVD-synthesized SWCNTs were then electrodeposited with FeOOH nanostructures. According to the figures of merit, the fabricated sensor gave a linear output from 20 to 450 parts per billion (ppb). Detection limit was also 4.1?ppb. Relative standard deviation (RSD) for seven replicate analyses was 3.61%. Based on 90% of maximum response (t₉₀), the response time was ～1.5?min. Calibration sensitivity was measured to 1.3?mV/ppb. No interference was observed, when introducing at least 500 folds of interferences of gaseous species such as H₂O, HCl, H₂S, O₂, H₂, CO, CO₂, NO₂, SO₂, Cl₂, C₂H₂, CH₄ and volatile organic compounds (VOCs) to 250?ppb of O₃ solution. Reliability of the sensor was also evaluated via determination of O₃ in different air samples.     

多元杂环萘二酰亚胺衍生物的合成及其场效应性能研究

杂环修饰的萘二酰亚胺(NDI)类化合物由于其独特的光电性能被研究人员广泛关注,并应用于有机场效应晶体管(OFETs)、有机太阳能电池中(OSCs)、传感器等领域。但是含有给受体单元的多元杂环萘二酰亚胺衍生物的合成并不容易,本文通过简单高效的方法设计合成了含有氮、硫原子的11个杂环类萘二酰亚胺衍生物,并通过紫外可见吸收光谱、循环伏安曲线和X射线衍射对其进行了物性研究。通过溶液旋涂法,制备了该材料的底栅底接触场效应晶体管器件,在空气中表现出p型半导体性能,当退火温度为140 ℃时性能达到最优,其空穴迁移率为0.2 cm_²?V_^-1?s_^-1。     

Effect of gate engineering in JLSRG MOSFET to suppress SCEs: An analytical study

In this work, an analytical model of gate-engineered junctionless surrounding gate MOSFET (JLSRG) has been proposed to uncover its potential benefit to suppress short-channel effects (SCEs). Analytical modelling of centre potential for gate-engineered JLSRG devices has been developed using parabolic approximation method. From the developed centre potential, the parameters like threshold voltage, surface potential, Electric Field, Drain-induced Barrier Lowering (DIBL) and subthershold swing are determined. A nice agreement between the results obtained from the model and TCAD simulation demonstrates the validity and correctness of the model. A comparative study of the efficacy to suppress SCEs for Dual-Material (DM) and Single-Material (SM) junctionless surrounding gate MOSFET of the same dimensions has also been carried out. Result indicates that TM-JLSRG devices offer a noticeable enhancement in the efficacy to suppress SCEs by as compared to SM-JLSRG and DM-JLSRG device structures. The effect of different length ratios of three channel regions related to three different gate materials of TM-JLSRG structure on the SCEs have also been discussed. As a result, we demonstrate that TM-JLSRG device can be considered as a competitive contender to the deep-submicron mainstream MOSFETs for low-power VLSI applications.     

A scheme for a topological insulator field effect transistor

We propose a scheme for a topological insulator field effect transistor. The idea is based on the gate voltage control of the Dirac fermions in a ferromagnetic topological insulator channel with perpendicular magnetization connecting to two metallic topological insulator leads. Our theoretical analysis shows that the proposed device displays a switching effect with high on/off current ratio and a negative differential conductance with a good peak to valley ratio.     

Electrode metal penetration of amorphous indium gallium zinc oxide semiconductor thin film transistors

Penetration effects of various electrode materials, namely Al, Au, and Cu, on the physical and electrical characteristics of amorphous oxide semiconductor thin film transistors (TFTs) were investigated. Amorphous indium gallium zinc oxide (a-IGZO) TFTs were fabricated with conventional staggered bottom gate structures on a p-type Si substrate. X-ray photoemission spectroscopy (XPS) analysis under the electrode deposition area revealed variations in the oxygen bonding states and material compositions of the a-IGZO layer. Field-emission scanning electron microscopy (FE-SEM) with the line scan of energy dispersive spectroscopy (EDS) showed lateral penetration by the electrode metal. To compare the electrical characteristics of the tested TFTs, the initial current–voltage (I–V) transfer characteristics were examined. In addition, the tested TFTs fabricated using various electrode materials were tested under bias stress to verify the correlations between variations in TFT characteristics and both the metal work function and penetration-induced oxygen vacancies in the channel around the contact area.     

Investigation of laterally single-diffused metal oxide semiconductor (LSMOS) field effect transistor

We propose a distinct approach to implement a laterally single diffused metal-oxide-semiconductor (LSMOS) FET with only one impurity doped p-n junction. In the LSMOS, a single p-n junction is first created using lateral dopant diffusion. The channel is formed in the p region of the p-n junction and the n region acts as the drift region. Two distinct metals of different work function are used to form the “n⁺” source/drain regions and “p⁺” body contact using the charge plasma concept. We demonstrate that the LSMOS is similar in performance to a laterally double diffused metal-oxide-semiconductor (LDMOS) although it has only one impurity doped p-n junction. The LSMOS exhibits a breakdown voltage of ∼50.0 V, an average ON-resistance of 48.7 mΩ-mm² and a peak transconductance of 53.6 μS/μm similar to that of a comparable LDMOS.