Thermal Annealing and Propagation of Shockley Stacking Faults in 4H-SiC PiN Diodes

Stacking faults within 4H-SiC PiN diodes are known to be detrimental to device operation. Here, we present electroluminescence (EL) images of 4H-SiC PiN diodes providing evidence that electrically and optically stimulated Shockley stacking fault (SSF) propagation is a reversible process at temperatures as low as 210°C. Optical beam induced current (OBIC) images taken following complete optical stressing of a PiN diode and that lead to a small number of completely propagated SSFs provide evidence that such defects propagate across the n–/p+ interface and continue to grow throughout the p+ layer. These observations bring about questions regarding the validity of the currently accepted driving force mechanism for SSF propagation.     

Effect of Annealing Ambient on the Self-Formation Mechanism of Diffusion Barrier Layers Used in Cu(Ti) Interconnects

Copper (titanium) [Cu(Ti)] films with low titanium (Ti) concentration were found to form thin Ti-rich barrier layers at the film/substrate interfaces after annealing, which is referred to as self-formation of the barrier layers. This Cu(Ti) alloy was one of the best candidates for interconnect materials used in next-generation ultra-large-scale integrated (ULSI) devices that require both very thin barrier layers and low-resistance interconnects. In the present paper, in order to investigate the influences of annealing ambient on resistivity and microstructure of the Cu alloys, the Cu(7.3at.%Ti) films were prepared on the SiO₂ substrates and annealed at 500°C in ultra-high vacuum (UHV) or argon (Ar) with a small amount of impurity oxygen. After annealing the film at 500°C in UHV, the resistivity was not reduced below 16 μΩ-cm. Intermetallic compounds of Cu₄Ti were observed to form in the films and believed to cause the high resistivity. However, after subsequently annealing in Ar, these compounds were found to decompose to form surface TiO _x and interfacial barrier layers, and the resistivity was reduced to 3.0 μΩ-cm. The present experiment suggested that oxygen reactive to titanium during annealing played an important role for both self-formation of the interfacial barrier layers and reduction of the interconnect resistivity.     

Passivation of Surface and Interface States in AlGaN/GaN HEMT Structures by Annealing

The Ni/AlGaN interfaces in AlGaN/GaN Schottky diodes were investigated to explore the physical origin of post-annealing effects using electron beam induced current (EBIC), current–voltage (I–V) characteristics, and X-ray photoelectron spectroscopy (XPS). The EBIC images of the annealed diodes showed that the post-annealing process reduces electrically active states at the Schottky metal/AlGaN interfaces, leading to improvement of diode performance, for example a decrease in reverse leakage current and an increase in Schottky barrier heights. Pulsed I–V characteristics indicate the Fermi level is up-shifted after annealing, resulting in a larger sheet carrier density at the AlGaN/GaN interface. Unintentional oxidation of the free AlGaN surface during the post-annealing process, revealed by XPS analysis, may prevent electron trapping near the drain-side of the gate edges. We suggest that the post-annealing process under an optimized conditions can be an effective way of passivating AlGaN/GaN heterojunction field-effect transistors.     

基于混合优化算法的正交多相码的设计

通过结合模拟退火算法的概率接受准则和蚁群算法的并行搜索，提出了一种有效的混合优化算法，设计出了具有良好自相关和互相关性能的正交信号组。混合算法弥补了模拟退火算法的搜索效率低和蚁群算法的容易陷入局部最小值的缺点，提高了全局搜索的能力。仿真结果表明，在搜索最优正交多相码方面该混合优化算法优于其他搜索算法。     

一种基于OTF稳定性的波前编码相位板优化方法

提出了一种简单的可用于光学系统中子午弧矢方向白光OTF稳定性评价的波前编码相位板参量优化方法.该方法仅以标准偏差来评价OTF在目标景深范围内的稳定性,并且结合自适应模拟退火算法在参量空间内优化得到相位板的最佳参量.使用该方法优化得到的相位板参量,可以大幅度提高光学系统的景深,并且可以获得更为清晰、稳定的成像.对应用波前编码技术前后光学系统的成像性能作了比较,并且考察了优化参量的容差性.     

GeV能量的Fe离子在C60薄膜中的辐照效应研究

利用傅立叶转换红外光谱和Raman谱仪分析了0.98 GeV的Fe离子在电子能损Se为3.5 keV/nm时， 不同辐照剂量（5×1010 —8×1013 ions/cm2)下， 在C60薄膜中引起的辐照损伤效应。 分析表明， Fe离子辐照引起了C60分子的聚合与损伤。 在辐照剂量达到一中间值1×1012 ions/cm2， C60分子的损伤得到部分恢复， 归因于电子激发引起的退火效应。 通过对Raman数据的拟合分析， 演绎出Fe离子辐照在C60材料中形成的潜径迹截面或引起损伤的截面约为1.32×10-14 cm2。     

Fluctuation of semiconductor surface potential in Si-SiO<Subscript>2</Subscript> structure after irradiation and subsequent annealing

Fluctuations of the semiconductor surface potential in a Si-SiO₂ structure, caused by irradiation with different high-energy particles (50 MeV electrons and 40 keV arsenic ions) and subsequent annealing, have been studied by measuring the semiconductor interface state parameters. It is established that the fluctuation of the semiconductor surface potential decreases slightly, from 0.049 V to 0.044 V, after irradiation, while a considerable increase is observed after annealing. For the samples irradiated by arsenic ions, the increase in fluctuation is much larger (0.096 V) than that for the electron-irradiated samples (0.06 V).     

Excimer laser processing of ZnO thin films prepared by the sol-gel process

ZnO thin films were prepared on soda-lime glass from a single spin-coating deposition of a sol-gel prepared with anhydrous zinc acetate [Zn(C₂H₃O₂)₂], monoethanolamine [H₂NC₂H₄OH] and isopropanol. The deposited films were dried at 50 and 300 °C. X-ray analysis showed that the films were amorphous. Laser annealing was performed using an excimer laser. The laser pulse repetition rate was 25 Hz with a pulse energy of 5.9 mJ, giving a fluence of 225 mJ cm⁻² on the ZnO film. Typically, five laser pulses per unit area of the film were used. After laser processing, the hexagonal wurtzite phase of zinc oxide was observed from X-ray diffraction pattern analysis. The thin films had a transparency of greater than 70% in the visible region. The optical band-gap energy was 3.454 eV. Scanning electron microscopy and profilometry analysis highlighted the change in morphology that occurred as a result of laser processing. This comparative study shows that our sol-gel processing route differs significantly from ZnO sol-gel films prepared by conventional furnace annealing which requires temperatures above 450 °C for the formation of crystalline ZnO.     

Analysis of excimer laser annealing of amorphous SiGe on La2O3//Si structures

The reduction of complementary metal oxide semiconductor dimensions through transistor scaling is in part limited by the SiO₂ dielectric layer thickness. Among the materials evaluated as alternative gate dielectrics one of the leading candidate is La₂O₃ due to its high permittivity and thermodynamic stability. However, during device processing, thermal annealing can promote deleterious interactions between the silicon substrate and the high-k dielectric degrading the desired oxide insulating properties.The possibility to grow poly-SiGe on top of La₂O₃//Si by laser assisted techniques therefore seems to be very attractive. Low thermal budget techniques such as pulsed laser deposition and crystallization can be a good choice to reduce possible interface modifications due to their localized and limited thermal effect.In this work the laser annealing by ArF excimer laser irradiation of amorphous SiGe grown on La₂O₃//Si has been analysed theoretically by a numerical model based on the heat conduction differential equation with the aim to control possible modifications at the La₂O₃//Si interface. Simulations have been carried out using different laser energy densities (0.26-0.58 J/cm²), different La₂O₃ film thickness (5-20 nm) and a 50 nm, 30 nm thick amorphous SiGe layer. The temperature distributions have been studied in both the two films and substrate, the melting depth and interfaces temperature have been evaluated. The fluences ranges for which the interfaces start to melt have been calculated for the different configurations.Thermal profiles and interfaces melting point have shown to be sensitive to the thickness of the La₂O₃ film, the thicker the film the lower the temperature at Si interface.Good agreement between theoretical and preliminary experimental data has been found.According to our results the oxide degradation is not expected during the laser crystallization of amorphous Si_0.7Ge_0.3 for the examined ranges of film thickness and fluences.     

基于模拟退火算法校正天线阵列位置误差

天线阵元的位置误差会影响阵列所接收到的信号相位。基于特征值分解的DOA估计算法对信号的相位误差非常敏感,因此有必要对阵元位置误差进行校正。文中提出一种基于模拟退火算法的校正方法对阵元位置误差进行校正,其优点是所需的辅助信号源数目较少,算法稳健性较好,并且适用于任意形式的天线阵。计算机模拟结果表明该方法是有效的。