基于SPSS软件与多元线性回归分析理论的分析--分析儿童血液必需元素与血红蛋白浓度的相关关系

基于多元线性回归分析的理论和方法，应用统计软件SPSS对儿童血液中血红蛋白含量和钙元素、铁元素、铜元素含量进行统计分析，得出了结论如下：钙元素对儿童血红蛋白浓度存在显著性差异，存在负相关性；铁元素对儿童血红蛋白浓度存在显著性差异。存在正相关性；而铜元素对儿童血红蛋白浓度不存在显著性差异。     

晶圆级芯片规模封装——微型表面贴装元器件

概述了美国国家半导体的晶圆级芯片规模封装技术——也就是微型表面贴装元器件(Mi-croSMD)。采用8I/O数、凸点节距为0.5mm封装论证此新型封装技术,该技术满足于低管脚数模拟和无线元器件。较高管脚数(多达48)产品扩展在各种范围的限定条件之内。论述了封装结构、工艺流程及封装可靠性,并阐述了板级组装工艺过程和互连可靠性。     

基于FPGA的IP承载网损伤仪设计

针对IP承载网的结构和技术特点,结合目前网络性能测试的现状和需求,提出了一种基于FPGA的IP承载网损伤仪的系统框架,研究了在FPGA上实现模拟丢包率的方法,阐述了损伤仪硬件模块的设计思想。该方案在仿真测试上通过验证,有着良好的应用前景。     

氮化铝陶瓷材料

本文介绍了AIN陶瓷基片生产的关键技术,国内外AIN陶瓷封装概况。探讨了AIN陶瓷封装发展的趋势。     

晶体管封装腔内水汽含量的分析与控制

本文在对现有国军标晶体管封装腔内水汽含量检测及分析的基础上,提出了降低腔内水汽含量的有效办法和途径,经改进封装后的国军标晶体管,其腔内水汽含量从原来的27300－26200PPm下降到274－542PPm,改善了将近两个数量级,大大低于GJB33A－97规定的500PPm的标准要求,器件可靠性的提高,必将为广大军用户重点国防工程,军事装备的系统可靠性创造美好的前景。     

集成电路封装技术的发展与山东省的对策

本文介绍了当前集成电路封装技术的现状及今后的主要发展趋势，并就我省集成电路业的发展提出了建议。     

Suppression of ferroresonance using passive memristor emulator

Power system inherently consists of capacitance and inductance in its components. Equipment with saturable inductance and circuit capacitance provides circumstances of generating ferroresonance, resulting in overvoltage and overcurrent in the connected system. The effects of ferroresonance result in insulation failure and hence damage to the equipment is unavoidable. Though many devices are proposed for mitigating such circumstances, a promising technology of using memristors may provide better performance than others in the future. A memristor emulator using the N-channel JFET J310 is used in this work. Unlike other electronic components that replicate memristor properties, the chosen memristor emulator is a passive device since it does not need any external power supply. Simulation and experimental results verify the design of a memristor emulator and the characteristics of an ideal memristor. Experimental results prove that the memristor emulator can suppress the fundamental ferroresonance induced in a prototype single phase transformer. The results of the harmonic analysis also validate the memristor performance against the conventional technique.     

3D芯片封装晶圆植球装备关键技术研究

为了应对半导体芯片高密度、高性能与小体积、小尺寸之间日益严峻的挑战,3D芯片封装技术应运而生.从工艺和装备两个角度诠释了3D封装技术;介绍了国内外3D封装技术的研究现状和国内市场对3D高端封装制造设备植球机的需求.介绍了晶圆植球这一3D封装技术的工艺路线和关键技术,以及研制的这一装备的技术创新点.以晶圆植球机X-Y-θ植球平台为例,分析了选型的技术参数.封装技术的研究和植球机的研发,为我国高端芯片封装制造业的同行提供了从技术理论到实践应用的参考.     

硅基梳齿式MEMS器件及封装的失效调查

对典型硅基梳齿式MEMS器件进行失效调查和分析,验证其主要失效模式,分析其失效机理.利用电子扫描显微镜(SEM),X射线透视系统、扫描声学显微镜(SAM),X射线能谱成份分析(EDX)、金相切片分析、封装气体分析及电性能测试等分析技术,发现在工艺制造中的机械失效是造成此类器件失效的主要原因.另外,此类器件的封装失效主要表现为气密性失效和装配工艺失效.     

Experimental behavior evaluation of series and parallel connected constant phase elements

Fractional-order capacitors are the core building blocks for implementing fractional-order circuits. Due to the absence of their commercial availability, they can be approximated through appropriately configured passive or active integer-order element topologies. Such a topology, constructed using Operational Transconductance Amplifiers (OTAs) and capacitors has been implemented in monolithic form through the AMS 0.35 μm CMOS process, and the fabricated chips are employed here for the experimental evaluation of the behavior of networks constructed from fractional-order capacitors connected in series or in parallel.