对有核与无核多层基板的供电网络分析

由于具有高密度布线能力和相对合理的成本,在特殊用途集成电路(ASI Cs)的倒装封装中使用叠积层式(bui l d-up)有机基板非常受欢迎。典型的叠积层式基板包括核层和其双侧的高密度布线层(叠积层)。核层为封装提供所需刚度,其厚度可以是400μm,600μm,或800μm。新兴的无核基板技术去除了核层,可以提高布线密度,减薄封装,和获得更好的电气性能。本文比较了8层有核与无核基板在31mm和900锡球封装中的核心供电网络(PDN)的性能。在50MHz到2GHz频域内,我们用矢量网络分析仪测得两路高频S参数以分析相应的PDN。测量与模拟结果十分吻合。另外,我们还在时域内模拟计算了PDN对瞬变电流的响应。     

单模光纤全金属化耦合封装1.3μm侧面发光二极管

阐述了１．３μｍ侧面发光二极管（ＥＬＥＤ）到单模光纤的耦合和实验结果。获得了在１００ｍＡ的驱动电流下，对于芯径为８～１０μｍ的标准单模光纤，最大尾纤输出功率大于５０μＷ，典型值２０μＷ的同轴式、扁平式、１４针双列直插式的全金属化耦合封装器件具有较高的可靠性和温度稳定性。     

双电流限制结构的1.55μm单模全金属化耦合封装激光二极管

叙述了具有双电流限制结构的1.55μm InGaAsP/InP 隐埋新月形激光器的制造工艺和主要特性。在室温 CW 工作条件下,该激光二极管的最低阈值电流为20mA,典型值为30mA。可在2～3倍阈值电流下获得稳定的基横模输出。在室温 CW 工作下,管芯的最大光输出功率大于10mW。激光器组件由半导体致冷器,热敏电阻和 PIN 探测器组成,采用了标准的14针双列直插式管壳,实现了激光器组件的全金属化耦合封装,漏气率小于5×10~(-3)Pa·cm~2/s,尾纤输出功率典型值为1mW。     

超薄叠层芯片尺寸封装(UT-SCSP)

本文介绍了最新的超薄叠层芯片尺寸封装(UT-SCSP),它是CSP封装与叠层封装相结合的产物。 它特别适用于高密度内存产品。     

CSP芯片热应力分析

对CSP芯片热可靠性进行了研究。运用数值分析方法,采用有限元软件ANSYS8.0,模拟分析在循环热载荷条件下芯片的热应力,以及芯片可能的失效形式。     

系统级封装(SiP)技术研究现状与发展趋势

系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来电子产品小型化和多功能化的重要技术路线,在微电子和电子制造领域具有广阔的应用市场和发展前景,发展也极为迅速。对目前SiP技术的研究现状和发展趋势进行了综述,重点关注了国际上半导体产业和重要的研究机构在SiP技术领域的研究和开发,对我国SiP技术的发展做了简单的回顾和展望。     

Prediction of the epoxy moulding compound aging effect on package reliability

Most semi-conductor devices are encapsulated by epoxy moulding compound (EMC) material. Even after curing at the prescribed temperature and time in accordance with the supplier’s curing specifications often the product is not yet 100% fully cured. As a consequence, the curing process of a product continues much longer, leading to curing effects of the EMC during the lifetime of the package. In this paper, the effect of EMC curing during lifetime on package reliability is investigated. The visco-elastic mechanical properties of two commercial EMC materials are measured as a function of aging time. The resulting data is used to construct material models that are used in FE calculations. Aging effects on critical semi-conductor failure modes die cracking, compound cracking, wedge break, and delamination are addressed. Die and compound crack risks are predicted by common stress analysis. The risk of wedge break occurrence is investigated by detailed 3D modeling of the actual wires in the package using a global-local approach. Conclusions on delamination risks are made based on a parameter sensitivity analysis using a 3D cohesive zones approach to predict transient delamination. The package reliability study shows that the effect of EMC aging affects relevant failure modes in different ways.     

红外探测器封装技术

探讨了目前红外探测器的封装工艺,对红外探测器的机械连接、电连接、窗口气密性焊接、引线盘工艺、表面处理工艺这几个关键工艺技术进行了比较深入细致的分析,总结了影响探测器正常工作的主要因素。     

Computational studies on magnetism and ferroelectricity

Magnetics, ferroelectrics, and multiferroics have attracted great attentions because they are not only extremely important for investigating fundamental physics, but also have important applications in information technology. Here, recent computational studies on magnetism and ferroelectricity are reviewed. We first give a brief introduction to magnets, ferroelectrics, and multiferroics. Then, theoretical models and corresponding computational methods for investigating these materials are presented. In particular, a new method for computing the linear magnetoelectric coupling tensor without applying an external field in the first principle calculations is proposed for the first time. The functionalities of our home-made Property Analysis and Simulation Package for materials (PASP) and its applications in the field of magnetism and ferroelectricity are discussed. Finally, we summarize this review and give a perspective on possible directions of future computational studies on magnetism and ferroelectricity.