0.5 mm间距CSP焊接工艺研究

随着对各种电子产品，尤其是消费类电子产品的便携性和多功能的追求，CSP等新型封装器件(封装尺寸约为芯片本身尺寸的1．2倍)便应用到这些产品的设计中去。CSP器件的引脚间距有0．8mm、0．75mm、0．65mm、0．5mm等。为了便于以后产品设计和生产的需要，就CSP器件在PWB设计和焊接两方面进行研究，侧重于焊接方面。     

芯片尺寸封装（CSP）技术

芯片尺寸封装技术是一种新兴的芯片封装技术，日本等国对该技术的研究相当重视，发展速度很快。介绍ＣＳＰ技术的主要内容和发展动态。     

1034探针台平面电机功放部件的维修

在1034探针台中，驱动承片台在X－Y方向运动的平面电机功率放大部件是该设备的核心部件，其性能的好坏直接关系到探针台的性能。本文拟从简述平面电机的原理入手，对该功放部件的性能、测试方法和维修作一讨论。     

CCGA封装特性及其在航天产品中的应用

介绍了CCGA封装的基本组成及焊柱的3种连接技术,对CCGA如何实现高互联密度、高性能、高可靠性的大尺寸封装进行了详细描述。CCGA板级装配的热循环试验结果表明CCGA封装技术达到甚至超过了典型卫星对航天电子设备可靠性的要求;CCGA散热时施加在器件顶部的压力超过极限值后将对可靠性产生严重影响。板级装配设计的关键要素和板级组装的关键工艺在文中也进行了概括性的叙述。     

局部增强压焊块铝层厚度的工艺方法

针对目前铜线封装对芯片压焊块的铝层厚度要求较高的问题,通过改进芯片制造工艺流程,对芯片内部压焊块的铝层进行单独地加厚。以便同时满足芯片封装厂采用铜线打线和芯片制造厂金属刻蚀工艺难易的要求。做法为,在钝化层刻蚀完成后,再生长一层足够厚的金属层,进行钝化层反版的光刻以及湿法刻蚀,只保留下压焊块区域的金属层,此时压焊块区域就...     

TAB OLB工艺在LCM制造中的应用

本文介绍了TAB器件及其制造工艺，通过讲述ACF特性，细致地阐述了TABOLB的工艺原理及参数设定方法，并对工艺中容易出现的不良现象进行了分析。     

KamiWaAI – interactive 3D sketching with Java based on Cl(4, 1) conformal model of Euclidean space

This paper introduces the new interactive Java sketching software KamiWaAi, recently developed at the University of Fukui. Its graphical user interface enables the user without any knowledge of both mathematics or computer science, to do full three dimensional “drawings” on the screen. The resulting constructions can be reshaped interactively by dragging its points over the screen. The programming approach is new. KamiWaAi implements geometric objects like points, lines, circles, spheres, etc. directly as software objects (Java classes) of the same name. These software objects are geometric entities mathematically defined and manipulated in a conformal geometric algebra, combining the five dimensions of origin, three space and infinity. Simple geometric products in this algebra represent geometric unions, intersections, arbitrary rotations and translations, projections, distance, etc. To ease the coordinate free and matrix free implementation of this fundamental geometric product, a new algebraic three level approach is presented. Finally details about the Java classes of the new GeometricAlgebra software package and their associated methods are given. KamiWaAi is available for free internet download.     

Binary phase gratings for star couplers with high splitting ratio

Binary phase transmission gratings exhibiting a certain number N of central diffraction orders of equal intensity can be used to construct star couplers of the 1-to-N and N-to-N type. The calculation of the grating's groove structure is described, and first experimental results are presented.     

First-Principles Investigations of Precursor Molecules for Microclusters

Details of the reactive processes by which TiC and TiN microclusters are formed from precursor molecules in the gas phase are not clearly understood. We have performed ab initio calculations based on density functional theory methods in order to get some insight into the chemical reactions of precursor molecules. Using microcanonical molecular-dynamics we have simulated scattering processes between molecules consisting of the elements Ti, Cl, N and H. The simulations show that fluctuations of the kinetic energy can be large enough to break up bonds at moderate temperatures.     

先进芯片封装技术

微电子技术的飞速发展推动了新型芯片封装技术的研究和开发。本文主要介绍了几种新型芯片封装技术的特点,并对未来的发展趋势及方向进行了初步分析。