Intermetallic compounds formed at the interface between liquid indium and copper substrates

The interfacial reactions between liquid In and Cu substrates at temperatures ranging from 175°C to 400°C are investigated for the applications in bonding recycled sputtering targets to their backing plates. Experimental results show that a scallop-shaped Cu₁₆In₉ intermetallic compound is found at the Cu/In interface after solder reactions at temperatures above 300°C. A double-layer structure of intermetallic compounds containing scallop-shaped Cu₁₁In₉ and continuous CuIn is observed after the Cu/In interfacial reaction at temperatures below 300°C. The growth of all these intermetallic compounds follows the parabolic law, which implies that the growth is diffusion-controlled. The activation energies for the growth of Cu₁₆In₉, Cu₁₁In₉, and CuIn intermetallic compounds calculated from the Arrhenius plot of growth reaction constants are 59.5, 16.9, and 23.5 kJ/mole, respectively.     

基于FAX／40E电话语音／传真卡的通信技术研究

以一个基于 FAX/ 40 E电话语音 /传真卡技术的传真系统为例 ,重点研究 FAX/ 40 E电话语音 /传真卡技术与计算机之间的通信技术 ,并讨论有关多线程技术问题。     

CAS-BUS: A Test Access Mechanism and a Toolbox Environment for Core-Based System Chip Testing

As System on a Chip (SoC) testing faces new challenges, some new test architectures must be developed. This paper describes a Test Access Mechanism (TAM) named CAS-BUS that solves some of the new problems the test industry has to deal with. This TAM is scalable, flexible and dynamically reconfigurable. The CAS-BUS architecture is compatible with the IEEE P1500 standard proposal in its current state of development, and is controlled by Boundary Scan features.This basic CAS-BUS architecture has been extended with two independent variants. The first extension has been designed in order to manage SoC made up with both wrapped cores and non wrapped cores with Boundray Scan features. The second deals with a test pin expansion method in order to solve the I/O bandwidth problem. The proposed solution is based on a new compression/decompression mechanism which provides significant results in case of non correlated test patterns processing. This solution avoids TAM performance degradation.These test architectures are based on the CAS-BUS TAM and allow trade-offs to optimize both test time and area overhead. A tool-box environment is provided, in order to automatically generate the needed component to build the chosen SoC test architecture.     

用TMS320C6201实现H.263编译码系统

介绍了用TMS320C6201实现视频压缩编码标准H.263的编译码系统,并以编码系统为例,给出其硬件设计及软件的优化处理方法.     

非线性编辑系统中常见的外部数字接口

非线性编辑系统的接口包括计算机内部接口和外部接口。在外部接口中，数字接口由于其自身的特点和优势被用得越来越多。非线性系统的外部数字接口一般包括数字视音频接口和遥控接口，下面对常用的SDI，IEEE1394，SDTI，AES／EBU，RS232C，RS422A等接口进行择要介绍，并对一些接口的特点作了分析和比较。     

ROBUST GLOBAL EXPONENTIAL STABILITY OF UNCERTAIN IMPULSIVE SYSTEMS

By using the quasi-Lyapunov function, some sufficient conditions of global exponential stability for impulsive systems are established, which is the basis for the following discussion. Then, by employing Riccati inequality and Hamilton-Jacobi inequality approach, some sufficient conditions of robust exponential stability for uncertain linear/nonlinear impulsive systems are derived, respectively. Finally, some examples are given to illustrate the applications of the theory.     

AUTOCAM简介及其初步使用的心得

一般来说,新闻直播中镜头是固定的,不需要太多的操作。如今,使用可远程遥控的摄像设备已成为一个热点。本文主要以东方卫视为例,从选型、使用及日常维护等方面,对对AUTOCAM的进行简单介绍。     

单片机破解的常用方法及应对策略

介绍了单片机内部密码破解的常用方法，重点说明了侵入型攻击／物理攻击方法的详细步骤，最后，从应用角度出发，提出了对付破解的几点建议。     

IPv6过渡机制讨论

本文在简要地介绍Ngtrans工作组提出的大多数过渡机制的基础上，尝试对它们进行区分、分类，并对每一种过渡机制的优缺点进行分析。另外．还对这些机制的布置以及一部分支持这些机制的产品平台进行讨论。     

MATLAB/SIMULINK在电力系统仿真中的应用

介绍了Matlab／Simulink仿真工具在电力系统仿真中的应用方法．