Comparison of the copper and gold wire bonding processes for LED packaging

Wire bonding is one of the main processes of the LED packaging which provides electrical interconnection between the LED chip and lead frame.The gold wire bonding process has been widely used in LED packaging industry currently.However,due to the high cost of gold wire,copper wire bonding is a good substitute for the gold wire bonding which can lead to significant cost saving.In this paper,the copper and gold wire bonding processes on the high power LED chip are compared and analyzed with finite element simulation.This modeling work may provide guidelines for the parameter optimization of copper wire bonding process on the high power LED packaging.     

微系统三维(3D)封装技术

文章论述塑料三维(3D)结构微系统封装技术相关问题,描述了把微电机硅膜泵与3D塑料密封垂直多芯片模块封装(MCM-V)相结合的微系统集成化。采用有限元技术分析封装结构中的封装应力,根据有限元设计研究结果,改变芯片载体结构,降低其发生裂纹的危险。计划采用板上芯片和塑料无引线芯片载体的替代低应力和低成本的3D封装技术方案。     

框架有效成本与内引线长度技术能力的关系

引线框架封装和基板封装是集成电路封装两个基本结构类别,在当前的半导体封装产业中,引线框架封装依然占据了主导地位。近年来随着有色金属价格的飞涨,对框架类产品造成了严峻的成本挑战,而通过技术手段来降低产品有效成本才是最安全、可行的方向。文章通过对框架内引线长度技术能力的差异比较,在金丝价格飞涨的情况下,发现其对框架有效成本...     

Package‐Platformed Linear/Circular Polarization Reconfigurable Antenna Using an Integrated Silicon RF MEMS Switch

This letter presents a K‐band polarization reconfigurable antenna integrated with a silicon radio frequency MEMS switch into the form of a compact package. The proposed antenna can change its state from linear polarization (LP) to circular polarization (CP) by actuating the MEMS switch, which controls the configuration of the coupling ring slot. Low‐loss quartz is used for a radiating patch substrate and at the same time for a packaging lid by stacking it onto the MEMS substrate, which can increase the system integrity. The fabricated antenna shows broadband impedance matching and exhibits high axial ratios better than 15 dB in the LP and small axial ratios in the CP, with a minimum value of 0.002 dB at 20.8 GHz in the K‐band.     

影视类院校毕业生视频包装带制作系统研究

随着电视传媒产业化的快速发展,视频包装也被日渐重视。影视艺术类高校作为电视等媒体人才的培养基地,自然得顺应视频包装的发展,在视频包装制作的硬软件开发应用上进行教学和科研的探索,结合工作实际,对影视类院校毕业生视频包装带制作系统进行探讨。     

大功率LED低热阻封装技术进展

散热是大功率LED封装的关键技术之一,散热不良将严重影响LED器件的出光效率、亮度和可靠性。影响LED器件散热的因素很多,包括芯片结构、封装材料（热界面材料和散热基板）、封装结构与工艺等。文章具体分析了影响大功率LED热阻的各个因素,指出LED散热是一个系统概念,需要综合考虑各个环节的热阻,单纯降低某一热阻无法有效解决LED的散热难题。文中还对国内外降低LED热阻的最新技术进行了介绍。     

锡基钎料与铜界面IMC的研究进展

对国内外电子封装"锡基钎料/铜基板"焊点体系界面IMC形成与生长机理的研究进展进行了回顾、评述,重点阐述了界面IMC的形成与生长行为、形成热力学和生长动力学,简要评述了相关因素对界面IMC生长行为的影响。最后,对无铅化电子封装互连焊点界面IMC研究的发展趋势进行了展望。     

High‐Frequency Modeling and Optimization of E/O Response and Reflection Characteristics of 40 Gb/s EML Module for Optical Transmitters

A complete high‐frequency small‐signal circuit model of a 40 Gb/s butterfly electroabsorption modulator integrated laser module is presented for the first time to analyze and optimize its electro‐optic (E/O) response and reflection characteristics. An agreement between measured and simulated results demonstrates the accuracy and validity of the procedures. By optimizing the bonding wire length and the impedance of the coplanar waveguide transmission lines, the E/O response increases approximately 5% to 15% from 20 GHz to 33 GHz, while the signal injection efficiency increases from approximately 15% to 25% over 18 GHz to 35 GHz.     

堆叠封装技术进展

目前电子产品正朝着高集成化、多功能及微型化方向不断发展。堆叠封装(PoP)作为一种新型3D封装技术,在兼容现有的标准表面贴装技术(SMT)的基础上能够实现不同集成电路在垂直方向上堆叠,从而能够提升封装密度,节省PCB板组装空间,缩短互连线路长度。该技术已从初期的低密度双层堆叠发展至当前的高密度多层堆叠,并在互连方式与塑封形式等封装结构及工艺上不断改进,以适应高性能电子产品的发展需求。通过对PoP上层与下层封装体结构及其封装工艺的近期研究成果进行综述,对比分析它们的各自特点与优势,并展望PoP未来发展趋势。     

在线等离子清洗设备控制系统设计

作为一种精密干法清洗设备,等离子清洗机可以有效去除IC封装工艺过程中的污染物,改善材料表面性能,增加材料表面能量。与传统独立式的等离子清洗设备相比,在线式等离子清洗设备具有自动化程度高、清洗效率高、设备洁净度高、适应范围广等优点,适用于大规模全自动化生产。