三种典型Sn-Ag-Cu无铅钎料的组织和性能研究

对比研究了三种典型标称成分的Sn-Ag-Cu钎料(即日本JEIDA推荐的Sn-3.0Ag-0.5Cu、欧盟IDEALS推荐的Sn-3.8Ag-0.7Cu和美国NEMI推荐的Sn-3.9Ag-0.6Cu)的显微组织特征、熔化特性、润湿性以及钎焊接头微焊点的力学性能等。结果表明,三种钎料的组织和性能非常接近。然而从性价比等方面综合考虑,Sn-3.0Ag-0.5Cu为三种钎料中最具优势的替代传统Sn-Pb钎料(共晶和近共晶钎料)的无铅合金。     

Utilization of TXRF analytical technique in order to improve front-end semiconductor processing

In this paper, we summarize how the introduction of in-line TXRF monitoring provides detailed analytical information on aluminum, titanium and molybdenum contamination levels in order to improve several process steps from front-end processing, minimize product yield loss and make it possible to successfully manufacture multiple products and process geometries in the same fabrication platform.     

ESD的防护策略

通过对现行的一些ESD防护方案的分析,发现了它们的缺陷：对电气应力与静电放电区分不清,系统未能有效地识别：提出了确立防护方案的基本条件：明确系统的防护等级,遵从各类标准的性能指标要求,实施ESD管理.并结合生产的实际情况,从防护等级的确立、数据的获取、装置的监控、防护措施的确定以及防护方案的实施,讨论了工业生产中的ESD防护;从包装材料的筛选、包装的检查、包装标注和测试,分析了ESD防护包装的具体实现;从工作面、工作间的测试和接地的有效搭接,研究了ESD的防护与控制策略.     

Interface features of ultrasonic flip chip bonding and reflow soldering in microelectronic packaging

Ultrasonic features in the bonding area are of interest for researchers in the field of microelectronic packaging. In this study, the interface characteristics of bonding were examined using an XD7100 X‐ray instrument and a transmission electron microscope (TEM). It was seen that bubbles were usually detected at the interfaces of the reflow‐soldered flip chip (FC), but they were not found at the interfaces of ultrasonically formed FC, and so ultrasonic FC bonding is more reliable than reflow soldering. The strong mechanical effect of ultrasonic vibration activates the dislocations in the crystalline metal lattice. Dislocation diffusion is more prominent than crystal diffusion when the temperature is relatively low during ultrasonic bonding, and therefore the processes of ultrasonic bonding enhance by several orders of magnitude. This indicates that the mechanism of ultrasonic bonding is different from the melting mechanism of reflow soldering. Copyright © 2007 John Wiley & Sons, Ltd.     

Properties of nitrocellulose‐coated and polyethylene‐laminated chitosan and whey films

Chitosan (chitosan acetic acid salt) and whey (65% protein) films were coated with a nitrocellulose lacquer or laminated with polyethylene to enhance their water resistance and gas barrier properties in humid environments. The barrier properties were measured by the Cobb₆₀ test and water‐vapor (100% relative humidity) transmission and oxygen (90% relative humidity) permeability tests. Mechanical properties were obtained with tensile tests. Packaging properties were studied with crease and folding tests. The Cobb₆₀ test revealed that the coated films were resistant to liquid water, at least for a short exposure time, if the coating thickness was at least 10–17 μm. Water‐vapor transmission rates comparable to those of polyethylene‐laminated films were obtained for coated chitosan at a coating thickness of 5–7 μm. The coated films possessed low oxygen permeability despite the high humidity. Coated films dried for 3 weeks showed oxygen permeabilities at 90% relative humidity that were similar to values for dry ethylene‐co‐vinyl alcohol at 0% relative humidity. The lacquer partly penetrated the whey films, and this led to excellent adhesion but poor lacquer toughness. The lacquer coating on chitosan was tougher, and it was possible to fold these films 90° without the coating fracturing if the coating thickness was small. The coated whey films were readily creasable. © 2001 John Wiley & Sons, Inc. J Polym Sci B: Polym Phys 39: 985–992, 2001     

几种新的封装工艺

文章介绍了几种新的封装工艺,如新型圆片级封装工艺——OSmium圆片级封装工艺,它能够把裸片面积减少一半;新型SiP封装工艺——Smafti封装工艺,它改进了传统SiP封装工艺,把传输速度提高了10倍;超薄型封装工艺,超薄型变容二极管和Wi-Fi系统功率放大器;CDFN封装工艺和RCP封装工艺等。     

Improvement of Impact Strength of Polylactide Blends with a Thermoplastic Elastomer Compatibilized with Biobased Maleinized Linseed Oil for Applications in Rigid Packaging

This research work reports the potential of maleinized linseed oil (MLO) as biobased compatibilizer in polylactide (PLA) and a thermoplastic elastomer, namely, polystyrene-b-(ethylene-ran-butylene)-b-styrene (SEBS) blends (PLA/SEBS), with improved impact strength for the packaging industry. The effects of MLO are compared with a conventional polystyrene-b-poly(ethylene-ran-butylene)-b-polystyrene-graft-maleic anhydride terpolymer (SEBS-g-MA) since it is widely used in these blends. Uncompatibilized and compatibilized PLA/SEBS blends can be manufactured by extrusion and then shaped into standard samples for further characterization by mechanical, thermal, morphological, dynamical-mechanical, wetting and colour standard tests. The obtained results indicate that the uncompatibilized PLA/SEBS blend containing 20 wt.% SEBS gives improved toughness (4.8 kJ/m²) compared to neat PLA (1.3 kJ/m²). Nevertheless, the same blend compatibilized with MLO leads to an increase in impact strength up to 6.1 kJ/m², thus giving evidence of the potential of MLO to compete with other petroleum-derived compatibilizers to obtain tough PLA formulations. MLO also provides increased ductile properties, since neat PLA is a brittle polymer with an elongation at break of 7.4%, while its blend with 20 wt.% SEBS and MLO as compatibilizer offers an elongation at break of 50.2%, much higher than that provided by typical SEBS-g-MA compatibilizer (10.1%). MLO provides a slight decrease (about 3 °C lower) in the glass transition temperature (T_g) of the PLA-rich phase, thus showing some plasticization effects. Although MLO addition leads to some yellowing due to its intrinsic yellow colour, this can contribute to serving as a UV light barrier with interesting applications in the packaging industry. Therefore, MLO represents a cost-effective and sustainable solution to the use of conventional petroleum-derived compatibilizers.     

基于弹性薄片封装的高灵敏度光纤光栅压力传感器

为满足水深高精度测量,基于弹性薄片封装,研制了一种新型光纤Bragg光栅(FBG)压力增敏传感器,分析了其工作机理,并进行了水压测试.结果表明,封装后的FBG静水压灵敏度为33.6 nm/MPa,是封装前压力灵敏度的10700倍,其液位测量的灵敏度为3.36 pm/cm.研究表明:对探头的材料和尺寸进行适当的调整,可实...     

超声显微检测技术在电子封装中的应用与发展

超声显微检测技术应用于电子封装领域始于20世纪80年代,如今已是检测电子封装可靠性和完整性的重要手段,被广泛应用到了电子封装的缺陷检测和精密测量等方面.针对电子封装的超声显微检测存在回波重叠、信噪比低等问题,近年来,发展了许多时频分析方法,用于获得优于常规方法的纵向分辨率,即实现超分辨率.该文首先介绍了超声显微检测的发...     

半导体激光器不同封装下的封装应力

为研究正装和倒装封装下高功率半导体激光器有源区的应力问题,利用有限元软件ANSYS分析得到了两种封装方式下应力场分布图及有源区平行于x轴路径上的应力变化曲线。模拟结果表明,与正装封装相比,倒装封装下有源区应力变化剧烈,平均值高出正装一个数量级。并通过荧光光谱实验对比了封装前后激光器芯片的波长变化,根据半导体禁带宽度与应变关系算出两种封装下的应力大小,与模拟值相符。通过模拟和实验结果可见,芯片封装形式对芯片引入的应力有显著的差别,倒装封装下芯片有源区应力远高于正装封装。