倒装片可修复底部填充材料的研究现状及发展

有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性.有缺陷的芯片在倒装后难以进行返工替换,使得倒装芯片技术成本提高,限制了此技术的应用.提出新型可修复底部填充材料的开发成为解决这一问题的有效途径.介绍了倒装芯片的可修复底部填充技术和可应用于可修复底部填充材料的技术要求,并综述了国内外对于可修复底部填充材料的研究现状.     

基于近似模型的电子封装散热结构优化设计

针对封装散热结构优化问题中存在的难点,提出了一种基于近似模型和随机模拟的快速全局优化方法.利用Kriging方法建立封装散热结构的近似模型,重构原始的优化问题,采用随机模拟对重构出的目标函数进行寻优,从而得到最优解.采用CVT试验设计,使Kriging模型的泛化预测能力达到最大程度的发挥;在随机模拟中采用Quasi-Monte Carlo法,有效地提高了寻优的效率.以方形扁平封装器件为例,应用该方法实现了封装散热结构的优化,结果表明所提出的方法有效地解决了设计变量中含有离散变量的问题,并且大大提高了随机模拟优化的计算效率.     

OLED柔性衬底封装材料研究进展

有机电致发光器件在柔性衬底上的制备是下一代显示技术发展的重要方向。根据柔性显示对封装材料的要求,综述了柔性衬底材料的种类及研究应用现状,重点介绍了聚合物柔性衬底材料的研究进展。     

Cracking energy estimation of ultra low-k package using novel prediction approach combined with global-local modeling technique

Interfacial crack/delamination, due to the presence of dissimilar material systems, is one of the major concerns of thermo-mechanical reliability for the development of next node technology in integrated circuits (IC) devices. The cracking energy results from many back end of line (BEOL) and packaging processes at various temperature differences is prone to drive the crack advance. To investigate the sensitivity of crack propagation in low-k dielectric materials, a robust estimation of J-integral approach combined with a rectangular path of integral contour is performed using finite element analysis (FEA). By means of the verification of 4-point bending test (4-PBT), excellent agreements are obtained as compared with the experimental data. Moreover, a multiscale modeling technique is proposed to resolve the difficulty of model construction as from bridge device level to packaging level. The sub-modeling procedures developed specifically for the impact prediction of interfacial crack in complicated Cu/low-k interconnects. The analytic results indicate the foregoing methodology is valuable to forecast the physical behavior and reliability of advanced IC devices in the nano scaled size. On the basis of the presented results in this research, an approximated criterion for determining the dimensions of sub-model is suggested and demonstrated as well.     

SnAgCu体钎料及BGA焊球焊点纳米级力学性能

为了研究低银Sn-0.3Ag-0.7Cu无铅体钎料、BGA焊料小球和BGA焊点的力学行为,基于物理反分析的方法采用纳米压痕仪对其进行实验。从压痕载荷–深度曲线提取出弹性模量、硬度和蠕变速率敏感指数。结果表明:体钎料的杨氏模量和蠕变速率敏感指数大约是BGA焊料小球和BGA焊点的2.5倍,验证了尺寸效应理论。采用纳米压痕仪测出的体钎料维氏硬度(15.101HV)小于显微硬度计的测量结果(20.660HV)。     

Simulations and experiments of three-dimensional paddle shift for IC packaging

Paddle shift is one of the most serious defects which may arise during the IC encapsulation of leadframe-type packages. The term “paddle shift” means the deflection of the leadframe-pad and die as a result of the pressure difference between the top and bottom mold cavities. In extreme cases, paddle shift could lead to a substantial reduction in the reliability of package.This paper employed a computational approach to predict the paddle shift quantity during the IC packaging process. The approach was based on precise finite element (FE) models and flow-structure decoupled analyses. Two kinds of FE models were needed for the decoupled analyses, namely a 3D FE model for the mold filling analysis (i.e. fluid-flow mesh) and a 3D FE model for the structural analysis (i.e. paddle mesh). The aim of the mold filling analysis was to identify the pressure distribution acting on the paddle structure during the encapsulation process, while the objective of the structural analysis was to determine the amount of paddle shift which was caused by pressure distribution.To investigate the relationship between the package geometry and the amount of paddle shift, the present simulations considered six TQFP (Thin quad flat package) models with different geometrical parameters. The simulation results for the paddle shift were compared with the experimental results to demonstrate the accuracy of the proposed numerical approach. It was found that a good agreement exists between the two sets of results.     

环氧-玻纤布基板材料的薄型化技术

近年,薄型环氧-破纤布基板材料的开发、应用成为一个热门课题。文章对薄型化CCL的产生背景、三大主要应用领域开拓和对它的性能要求,以及对原材料技术新发展的驱动做一讨论。     

Migration of perfluorinated compounds from paperbag to Tenax® and lyophilised milk at different temperatures

ABSTRACT

Migration tests of perfluoroalkyl substances (PFASs) from a grease-proof paperbag used for packaging of pet food have been carried out. No migration of perfluorocaboxylic acids (PFCAs), from PFBA to PFTeDA, to the simulant Tenax® was found after 10 days at 40°C. However, the increase of temperature in the range 80–160°C gave rise to the migration of the PFCAs. Finally, the migration to real foods such as lyophilised whole and low-fat milk samples at 80 and 120°C was studied. The results indicate that the migration percentages of the PFCASs into food samples are much higher than those obtained into Tenax®.     

Fluorine-based plasmas: Main features and application in micro-and nanotechnology and in surface treatment

Fluorine cold plasmas produced by an electrical discharge in SF₆, CF₄, CHF₃ or C₄F₈ gases, principally, have two main fields of application. The first and historical application is etching of materials for microelectronics and later for micro- and nanotechnology. The second concerns the modification of surface properties, mostly in terms of reflectance and wettability. After an introduction to cold plasmas and plasma–surface interaction principles, the article aims at presenting successively the evolution of fluorine plasma etching processes since the origin with respect to other halogen-based routes in microelectronics, the important and raising application in deep etching and microtechnology, and finally some examples in surface treatment.     

一种基于WLP封装的声表面波滤波器

以41°Y X切型铌酸锂作为基底材料,选择双T型阻抗元结构,采用晶圆级封装（WLP）技术,制作了一款相对带宽5.8%,最小插入损耗为-2.8 dB,体积为1.1 mm×0.9 mm×0.5 mm的小型化WLP封装声表面波滤波器。并研制了专用探卡,对封装后晶圆完成在线测试。测试结果表明,探卡测试结果与装配到实际电路的测试结果进行对比,两者吻合较好,解决了WLP封装声表面波滤波器测试难题。