用UV激光加工高密度印制板

在本文中,讨论激光技术的几个基本概念和激光加工材料的机理及其加工实例。     

Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder

Eutectic Sn-3.5wt.%Ag alloy is one of the most promising lead-free solders in low temperature processes for wafer bumping. Near eutectic composition of deposited alloy films could be readily acquired by pulse electroplating with a proper combination of active ingredients including K₄P₂O₇, KI, Sn₂P₂O₇, and AgI, as well as polyethylene glycol (PEG), with molecular weights of 200, 600, 2,000, and 4,000, as an inhibitive agent. Pulse electroplating was carried out with current in alternating polarity to conduct electroplating and electropolishing sequentially. As a result, alloy films with grains of less than 1 μm and uniform surface morphology can be obtained. The addition of PEG was necessary for the stabilization of the plating baths to promote a wider process window for the desirable eutectic composition. Electrochemical characterization established that PEG with molecular weight of 4,000 exhibited the strongest inhibition behavior. In contrast, PEG with molecular weight of 200 demonstrated the least interference. Energy dispersive X-ray and differential scanning calorimeter data confirmed the formation of eutectic alloy as a function of deposition current density. X-ray diffraction results indicated that a biphasic structures of β-Sn and ε-Ag₃Sn was present in the as-deposited film.     

纸质包装材料中甲醛、乙醛向食品模拟物改性聚苯醚的迁移行为

为了解纸质包装材料中甲醛、乙醛向食品模拟物改性聚苯醚( Tenax)中的迁移行为,建立了一步提取衍生化、超高效液相色谱测定纸质包装材料和Tenax中的甲醛和乙醛的方法。本方法在甲醛和乙醛的测定范围内,线性相关系数R2>0.9999,甲醛检出限为0.03 mg/m2,乙醛检出限为0.04 mg/m2,测定纸样和Tenax的加标回收率为90.1%~108.6%。采用本方法研究不同温度和时间下两种纸质包装材料中甲醛、乙醛向Tenax中的迁移规律。研究表明,甲醛、乙醛迁移行为随时间变化趋势大致相同,均呈现迁移率随迁移时间延长先迅速增大,后又减小达到一个常数;甲醛和乙醛迁移率受温度的影响不同,达到平衡后,甲醛在30℃下迁移率最高,乙醛在70℃和50℃下迁移率高;甲醛和乙醛向Tenax中的迁移率差异较大,达到平衡后,乙醛的迁移率远高于甲醛。     

基于聚合物添加剂谱库的缓冲盐中塑料药品包装材料难挥发可溶出物的快速分析方法研究

采用超高效液相色谱-四极杆飞行时间质谱(UPLC-QTOF-MS),结合基于UNIFI软件建立的174种聚合物添加剂的谱库,实现了塑料药品包装材料中难挥发可溶出物(Extractables)的快速筛查和准确定量。样品经氯仿萃取后,以甲醇和0.1%甲酸水溶液为流动相在CORTECS C18(2.1 mm×100 mm,1.6μm)色谱柱上进行分离,在质谱电喷雾正离子模式下,UPLC-QTOF-MS进行筛查和定量分析。结果表明,浸泡60 d缓冲盐(25℃)中检出4种物质,利用谱库筛查确定其中1种物质是邻苯二甲酸二异癸酯(DIDP),采用外标法定量,测得其溶出量为1.98μg/L;其余3种物质可通过精确质量数、MSE谱图等进行推断定性,利用结构与质量数相近的邻苯二甲酸二环己酯(DCHP)为内标进行定量,3种提取物的总含量为10.80μg/L。利用DIDP进行回收率实验,5,10,20μg/L 3个加标水平的回收率为90.1%~97.1%,相对标准偏差(RSD,n=6)不大于3.7%。该方法快速、准确、灵敏,适用于药品包装材料的安全性考察。     

丹磺酰肼衍生-高效液相色谱-荧光检测法测定包装纸中的甲醛和乙醛

建立了丹磺酰肼(DNSH)衍生-高效液相色谱-荧光检测测定包装纸中甲醛和乙醛的分析方法,并与2,4-二硝基苯肼(DNPH)衍生法进行了比较。纸张样品经衍生化试剂振荡萃取30 min,衍生化反应24 h,萃取液经PSA/C18净化管净化处理后,以Diamonsil~ C18(2)色谱柱(150 mm×4.6 mm,5μm)为固定相,用醋酸水溶液(pH2.55)-乙腈为流动相进行梯度洗脱。采用荧光检测器检测,激发波长为330 nm,发射波长为484 nm。结果表明,衍生剂、甲醛-DNSH和乙醛-DNSH在20 min内可完全分离,方法的加标回收率为81.64%~106.78%,相对标准偏差(RSD)为2.02%~5.53%(n=5),甲醛和乙醛的检出限分别为19.2μg/kg和20.7μg/kg,定量限分别为63.9μg/kg和69.1μg/kg。该法操作简单,灵敏度高,比常规方法具有更低的检出限,能很好地应用到实际样品检测中,为低含量醛类化合物的检测提供了一种新思路。     

激光散斑干涉法测量金属复合引线热膨胀系数的实验研究

本文采用激光散斑干涉法测量微电子金属封装用金属复合引线的热膨胀系数。该方法有很高的测量精度和灵敏度,并对试件形状、尺寸和表面无特殊要求。同时利用光学方法全场测量的优点,使用已知热膨胀系数的金属材料作为标准试件,可减少温度场不均匀分布及微小变化对测试精度的影响,消除了测量光路几何参数导致的系统误差。在相对简单的实验设备下,得到较高精度金属复合引线的热膨胀系数值。该方法可广泛用于各种新材料的热膨胀系数的测定。     

塑封硅器件中介电薄膜的温湿效应分析(英文)

随着铜互连以及low-k电介质在超大规模集成电路中地广泛使用,low-k电介质的机械完整性及其对互连可靠性变得更加重要。影响介电膜的机械完整性和互连可靠性的因素包括介电膜的工艺制程,芯片与封装材料的相互影响,以及环境温度和湿度的影响。本文研究集中于了解环境温度和湿度对塑封硅器件中介电薄膜的可靠性影响。采用快速温度和湿度实验条件,对塑封硅器件中介电薄膜受水分和温度损伤的敏感性进行了分析。运用商业有限元(FEA)分析软件,对水分在塑封材料和硅器件中的扩散过程进行了建模及仔细分析。并对硅器件周边密封圈的防水分扩散效力进行了研究。通过这一系列实验与分析,对塑封硅器件中介电薄膜的温湿效应有了完整地了解,并提出和建立了相关的物理模型和经验公式。运用这物理模型和经验公式可对在各种使用环境温度和湿度条件下,塑封硅器件中介电薄膜的可靠性进行评估及分析。     

Independent components analysis coupled with 3D-front-face fluorescence spectroscopy to study the interaction between plastic food packaging and olive oil

Olive oil is one of the most valued sources of fats in the Mediterranean diet. Its storage was generally done using glass or metallic packaging materials. Nowadays, plastic packaging has gained worldwide spread for the storage of olive oil. However, plastics are not inert and interaction phenomena may occur between packaging materials and olive oil. In this study, extra virgin olive oil samples were submitted to accelerated interaction conditions, in contact with polypropylene (PP) and polylactide (PLA) plastic packaging materials. 3D-front-face fluorescence spectroscopy, being a simple, fast and non destructive analytical technique, was used to study this interaction. Independent components analysis (ICA) was used to analyze raw 3D-front-face fluorescence spectra of olive oil. ICA was able to highlight a probable effect of a migration of substances with antioxidant activity. The signals extracted by ICA corresponded to natural olive oil fluorophores (tocopherols and polyphenols) as well as newly formed ones which were tentatively identified as fluorescent oxidation products. Based on the extracted fluorescent signals, olive oil in contact with plastics had slower aging rates in comparison with reference oils. Peroxide and free acidity values validated the results obtained by ICA, related to olive oil oxidation rates. Sorbed olive oil in plastic was also quantified given that this sorption could induce a swelling of the polymer thus promoting migration.     

Three-step concept (TSC) in modeling microelectronics reliability (MR): Boltzmann–Arrhenius–Zhurkov (BAZ) probabilistic physics-of-failure equation sandwiched between two statistical models

When encountering a particular reliability problem at the design, fabrication, testing, or an operation stage of a product’s life, and considering the use of predictive modeling to assess the seriousness and the likely consequences of the a detected failure, one has to choose whether a statistical, or a physics-of-failure-based, or a suitable combination of these two major modeling tools should be employed to address the problem of interest and to decide on how to proceed. A three-step concept (TSC) is suggested as a possible way to go in such a situation. The classical statistical Bayes’ formula can be used at the first step in this concept as a technical diagnostics tool. Its objective is to identify, on the probabilistic basis, the faulty (malfunctioning) device(s) from the obtained signals (“symptoms of faults”). The recently suggested physics-of-failure-based Boltzmann–Arrhenius–Zhurkov’s (BAZ) model and particularly the multi-parametric BAZ model can be employed at the second step to assess the remaining useful life (RUL) of the faulty device(s). If the RUL is still long enough, no action might be needed; if it is not, corrective restoration action becomes necessary. In any event, after the first two steps are carried out, the device is put back into operation (testing), provided that the assessed probability of its continuing failure-free operation is found to be satisfactory. If the operational failure nonetheless occurs, the third, technical diagnostics step should be undertaken to update reliability. Statistical beta-distribution, in which the probability of failure is treated as a random variable, is suggested to be used at this step. While various statistical methods and approaches, including Bayes’ formula and beta-distribution, are well known and widely used in numerous applications for many decades, the BAZ model was introduced in the microelectronics reliability (MR) area only several years ago. Its attributes are addressed and discussed therefore in some detail. The suggested concept is illustrated by a numerical example geared to the use of the prognostics-and-health-monitoring (PHM) effort in actual operation, such as, e.g., en-route flight mission.     

On the crack and delamination risk optimization of a Si-interposer for LED packaging

3D-integration becomes more and more an important issue for advanced LED packaging solutions as it is a great challenge for the thermo-mechanical reliability to remove heat from LEDs to the environment by heat spreading or specialized cooling technologies. Thermal copper-TSVs provide an elegant solution to effectively transfer heat from LED to the heat spreading structures on the backside of a substrate. But, the use of copper-TSVs generates also novel challenges for reliability as well as also for reliability analysis and prediction, i.e. to manage multiple failure modes acting combined – interface delamination, cracking and fatigue, in particular. In this case, the thermal expansion mismatch between copper and silicon yields to risky stress situations.To overcome cracking and delamination risks in the vicinity of thermal copper-TSVs the authors performed extensive simulative work by means of fracture mechanics approaches – an interaction integral approach within a simulative DoE and the X-FEM methodology to help clarifying crack propagation paths in silicon. The results provided a good insight into the role of model parameters for further optimizations of the intended thermal TSV-approaches in LED packaging applications.