等离子体横向刻蚀硅的特性研究

研究了用SiO2 +Al作掩模 ,SF6 +O2 混合气体等离子体对Si的横向刻蚀 ,其结果表明 ,在SF6 +O2 等离子体气氛中 ,Al是很好的保护膜 ,可以在待悬浮器件下形成大的开孔。因此 ,预计用这种技术 ,可以在Si片上集成横向尺寸为数百微米 ,具有优良高频性能的MEMSRF/MW无源器件 ,如开关、传输线、电感和电容等。     

一种奇特型阴极的分析研究与改进

本文主要叙述对Jc-300磁控管奇特型阴极的分析研究、改进过程及其投入生产使用的效果     

用于二聚物三能级蒸气激光系统的环形谐振腔设计

针对二聚物三能级蒸气激光系统增益相对于泵浦光方向显著的不对称特性,本文设计了一种稳定的能够充分利用介质增益特性的环形谐振腔,给出了象散和慧差补偿及泵浦激光与谐振腔匹配的条件。文中还给出了Na_2B~1Ⅱ_u-X~1∑_g~+跃迁激光谐振腔设计数据。     

双电极对双脉冲激光器结构分析

本文对双电极对双脉冲激光器的谐振腔结构进行了分析,结果表明采用双非稳腔和增大反射镜的曲率半径可分别获得单纵模和基横模输出。为使输出能量稳定,则双电极对的间距有一最小值的限制。     

高功率板条固体激光器研究的进展

本文对高功率板条固体激光器研究的进展和应用前景作了综合评述。结合作者部分工作,对板条激光器的热效应、聚光器和光学谐振腔等关键问题和技术进行了物理分析。     

Coupling Losses for Resonators with Unequal Apertures for Extended Fresnel Numbers

Coupling losses have been calculated for laser resonators with unequal apertures and extended Fresnel Numbers. This was done using both, diffraction theory and a simple linear model.A close form expression was derived to calculate coupling losses with reasonable accuracies for a limited range of paramters. This should help in the preliminary design of hole coupling laser resonators.     

Rare-earth-enabled universal solders for microelectromechanical systems and optical packaging

In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers, diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed, which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal, or electrical issues in MEMS are also discussed.     

分析非轴对称腔的复光线数值迭代法

将像散光束的复光线表示法用于分析非轴对称腔，并对有复杂像散的折迭腔作了数值迭代计算以说明方法的应用．     

高功率固体激光器

本文详细讨论了设计高平均功率固体激光器的有关问题,包括激光材料性质、棒状和板条状几何结构,聚光器和光学谐振腔等。分析表明,板条状几何结构固体激光器提供了达到千瓦级功率水平同时又保持良好光束质量的可能性。     

MEMS技术对火控系统的影响

结合火控系统的发展趋势 ,说明了MEMS技术在火控系统中的应用 ,分析了MEMS技术在机械结构、系统性能以及体系结构等方面对火控系统的影响