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Cas van der AvoortRein van der Hout Joost Hulshof 《Physica D: Nonlinear Phenomena》2011,240(11):913-919
We study the response of a MEMS resonator, driven in an in-plane length-extensional mode of excitation. It is observed that the amplitude of the resulting vibration has an upper bound, i.e., the response shows saturation. We present a model for this phenomenon, incorporating interaction with a bending mode. We show that this model accurately describes the observed phenomena. The in-plane (“trivial”) mode is shown to be stable up to a critical value of the amplitude of the excitation. At this value, a new “bending” branch of solutions bifurcates. For appropriate values of the parameters, a subsequent Hopf bifurcation causes a beating phenomenon, in accordance with experimental observations. 相似文献
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Hong Wang Rui LiuWei Qiao Jiang Jun ZhuJian Zhi Feng Gui Fu DingXiaolin Zhao 《Applied Surface Science》2011,257(6):2203-2207
Adhesion performance of MEMS materials is increasingly important with the widely use of miniaturized devices. This paper proposed a novel method for improving adhesion performance between electrodeposited Ni multi-layers. The new method is to treat the Ni substrate in nickel chloride plating solution by pulse reverse current technique before electrodeposition. The dense oxide film of Ni substrate can be removed effectively by this electrochemical method, meanwhile, the proper roughness of Ni substrate is in favor of epitaxial growth during electrodeposition. Moreover, the Ni film is electrodeposited by the new method with low stress and coarse crystal grain. Consequently, the adhesion performance of Ni films is improved dramatically. The experimental results show that the adhesion performance of Ni film electrodeposited by the new method is about 3 times that of by traditional method. 相似文献
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A numerical investigation is performed into the nonlinear dynamic behavior of a clamped–clamped micro-beam actuated by a combined DC/AC voltage and subject to a squeeze-film damping effect. An analytical model based on a nonlinear deflection equation and a linearized Reynolds equation is proposed to describe the deflection of the micro-beam under the effects of the electrostatic actuating force. The deflection of the micro-beam is investigated under various actuating conditions by solving the analytical model using a hybrid numerical scheme comprising the differential transformation method and the finite difference approximation method. It is shown that the numerical results for the dynamic pull-in voltage of the clamped–clamped micro-beam deviate by no more than 2.04% from those presented in the literature based on the conventional finite difference scheme. The effects of the AC voltage amplitude, excitation frequency, residual stress, and ambient pressure on the center-point displacement of the micro-beam are systematically explored. Moreover, the actuation conditions which ensure the stability of the micro-beam are identified by means of phase portraits. Overall, the results presented in this study confirm that the hybrid numerical method provides an accurate means of analyzing the complex nonlinear behavior of common electrostatically-actuated microstructures. 相似文献
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Embedded benzocyclobutene in silicon: An integrated fabrication process for electrical and thermal isolation in MEMS 总被引:1,自引:0,他引:1
Alireza Modafe 《Microelectronic Engineering》2005,82(2):154-167
This paper reports a novel fabrication process to develop planarized isolated islands of benzocyclobutene (BCB) polymer embedded in a silicon substrate. Embedded BCB in silicon (EBiS) can be used as an alternative to silicon dioxide in fabrication of electrostatic micromotors, microgenerators, and other microelectromechanical devices. EBiS takes advantage of the low dielectric constant and thermal conductivity of BCB polymers to develop electrical and thermal isolation integrated in silicon. The process involves conventional microfabrication techniques such as photolithography, deep reactive ion etching, and chemical mechanical planarization (CMP). We have characterized CMP of BCB polymers in detail since CMP is a key step in EBiS process. Atomic force microscopy (AFM) and elipsometry of blanket BCB films before and after CMP show that higher polishing down force pressure and speed lead to higher removal rate at the expense of higher surface roughness, non-uniformity, and scratch density. This is expected since BCB is a softer material compared to inorganic films such as silicon dioxide. We have observed that as the cure temperature of BCB increases beyond 200 °C, the CMP removal rate decreases drastically. The results from optical microscopy, scanning electron microscopy, and optical profilometry show excellent planarized surfaces on the EBiS islands. An average step height reduction of more than 95% was achieved after two BCB deposition and three CMP steps. 相似文献
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