Electron microscope studies of InxGav1−xAs/GaAs/Si grown by metalorganic chemical vapor deposition

The microstructure of In_xGa_1−xAs/GaAs (5 nm/5 nm, x < 0 to 1.0), as grown by a metalorganic chemical vapor deposition two-step growth technique on Si(100) at 450‡C, and subsequently annealed at 750‡C, is investigated using plan-view and cross-sectional transmission electron microscopy. The variations in resultant island morphology and strain as a function of the In content were examined through the comparison of the misfit dislocation arrays and moirés observed. The results are discussed in relation to the ways in which the island relaxation process changes for high In content.     

Analysis of issues in gate recess etching in the InAlAs/InGaAs HEMT manufacturing process

We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13 μm–0.16 μm to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.     

Structural characterization techniques for the analysis of semiconductor strained heterostructures

A combined method for structural characterization of strained epitaxial heterostructures involving different techniques such as Rutherford backscattering spectrometry (RBS), multiple crystal X-ray diffractometry (MCD) and transmission electron microscopy (TEM) is presented. In order to obtain a complete characterization of the analysed structure, three different quantities are measured independently: the epilayer thickness, the density of misfit dislocations which may appear at the interface, and the significant components of the strain tensor, mainly the tetragonal distortion, affecting the epilayer lattice. In this way the thermodynamic state and the mechanisms of plastic deformation of the structures can be fully investigated. In this contribution we present and discuss the experimental results concerning a set of InP/GaAs samples having different layer thicknesses ranging from 5 to 500 nm. The thickness of the samples has been determined by RBS. Measurements of in-plane strain and tetragonal distortion have been performed by MCD and RBS-channelling respectively, finally TEM has been used for determining the defects densities and distribution.     

Avalanche photodiode with sectional InGaAsP/InP charge layer

An InGaAs/InP avalanche photodiode (APD) with a sectional InGaAsP/InP charge layer at the heterointerface between the InGaAs absorption and InP multiplication region has been designed, fabricated and tested. We demonstrate a new APD structure that utilizes the sectional 140 nm thin charge layer and a 500 nm thin multiplication layer. The band diagram, electrical field distribution and current-voltage (I-V) characteristics up to punch-through voltage have been simulated. The fabricated mesa structure photodiode shows responsivity 0.9 A/W at 1310 nm at 20 V and avalanche gain up to 10 near breakdown voltage 36 V. The measured results revealed that the sectional charge layer could be used for control of the electric field profile in the APD structure.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

俄歇复合对同质结InGaAs探测器探测率的影响

通过对InGaAs材料的俄歇(Auger)复合机制的理论分析,给出了少子寿命与材料组分、温度和载流子浓度的关系,从而得到材料参数等对InGaAs探测器的探测率影响的结果,优化材料参数和器件结构可抑制Auger复合机制,提高InGaAs探测器的探测率.     

Pressure induced phase transitions in Ga1 − x In x P

We have theoretically investigated the effect of pressure on the structural stability of GaP?:?InP mixed system. The three-body-potential (TBP) model has been used. The TBP model consists of long-range as well as short-range interactions; the long-range part includes the modified Coulomb force as well as a three-body term; the short-range part in TBP defines the van der Waals and overlap repulsive interactions. We observe a pressure-induced structural phase transformation from ZnS (B3) to NaCl (B1) type phase in Ga _1?x In _x P. Our calculated transition pressures for the initial GaP and final InP compound semiconductors are in good agreement with other reported data.     

基于InGaAs/InP雪崩光电二极管的高速单光子探测器雪崩特性研究

报道了一种基于InGaAs/InP雪崩光电二极管、1.25 GHz正弦波门控及贝塞尔低通滤波器的1.25 GHz高速短波红外单光子探测器.通过调整比较电路的鉴别电平, 实验研究了单光子探测器雪崩信号幅度随反向直流偏压的变化.随着鉴别电平的提高, 单光子探测器的探测效率及暗计数率均呈指数衰减, 而后脉冲概率先增大到一个峰值, 然后减小.研究表明, 为获得更高的性能, 需要尽量降低单光子探测器的鉴别电平.     

非对称In0.53Ga0.47As/In0.52Al0.48As量子阱的零场自旋分裂能与高场g因子

我们研究了非对称In_0.53Ga_0.47As/In_0.52Al_0.48As量子阱中二维电子气的磁输运性质,所测量的样品的径向磁阻Rxx的Shubinikov-de Haas振荡没有呈现出拍频的特征。通过测量样品的弱局域效应提取了其零场自旋分裂能并通过对自旋分裂的Rxx双峰间距随倾斜角度theta的依赖关系的拟合提取了高场下的有效g因子。样品的Dingle plot图呈现非线性和特征,这可以归因于来自样品衬底附近的掺杂Be原子的长程势散射效应。     

图案化GaAs衬底外延InP局域表面成核层生长

使用光学显微镜、原子力显微镜和微区喇曼光谱对在纳球光刻图案化GaAs衬底的孔洞区进行金属有机化学气相沉积(MOCVD)进而对InP成核层进行了研究.实验结果表明,该局域表面InP的成核层生长和孔洞的大小、方向、位置关系不大,与MOCVD的生长条件相关.与渐变缓冲层生长相比,在InP的成核层中没有出现穿透位错,其结晶质量随着温度的升高而提高,但其表面粗糙度会随着温度的升高而增加,这个现象可能和它的3D岛状生长有关.AFM测试结果表明,提高Ⅴ/Ⅲ比可以在较低的温度下抑制其表面粗糙度降至纳米量级.微区喇曼光谱测试表明,在适当条件生长下可获得InP成核层的二维生长方式.该研究为进一步基于ART机理在二维图案化GaAs衬底开展InP异质外延研究奠定基础.