热分解法制备钛酸铅镧薄膜及其电性能研究

本文研究了用金属有机物热发解法制备ＰＬＴ８薄膜的工艺过程和基片对薄膜结构的影响，并且给出了铁电性能的测量结果。     

LB技术制备大面积超薄PMMA抗蚀层的研究

采用自行研制的ＬＢ自动提膜装置，制备出大面积（１０×８ｃｍ２）、高质量的ＰＭＭＡ超薄抗蚀剂膜，并将其用于高分辨率铬掩模版的研制。通过电子束曝光，湿法蚀刻，制作了分辨率优于０．５μｍ，特征线宽０．３８μｍ的４（１００ｍｍ）铬掩模版。     

碲镉汞外延晶膜的不稳定性

利用变温和变磁场霍尔测试对在空气室温环境长期存放的碲镉汞液相处延晶膜作了定期的检测，结果表明，晶膜的电学性质随时间有明显的改变，本文采用非均匀晶膜的层状模型对晶膜的不稳定性作了详细的分析。     

酞菁钴薄膜的折射率及吸收特性

通过真空镀法在单晶硅片上制备了酞菁钴薄膜，在波长扫描和入射角可变全自动椭圆偏振光谱仪上研究了ＣｏＰｃ薄膜的椭偏光谱并分析了其电子结构。     

厚膜导体的金属迁移研究

金属迁移能导致混合微电路发生灾难性失效。本文介绍一种简单易行的测试方法－水滴试验法，来测量厚膜电路的实际金属迁移率。用引方法测量时，发现Ｐｄ－Ａｇ导体的迁移率最大，Ｐｔ－Ａｕ导体的金属迁移率最小。     

Structural and electrical properties of crystalline (1−x)Ta2O5−xTiO2 thin films fabricated by metalorganic decomposition

Polycrystalline (1−x)Ta₂O₅−xTiO₂ thin films were formed on Si by metalorganic decomposition (MOD) and annealed at various temperatures. As-deposited films were in the amorphous state and were completely transformed to crystalline after annealing above 600 °C. During crystallization, a thin interfacial SiO₂ layer was formed at the (1−x)Ta₂O₅−xTiO₂/Si interface. Thin films with 0.92Ta₂O₅–0.08TiO₂ composition exhibited superior insulating properties. The measured dielectric constant and dissipation factor at 1 MHz were 9 and 0.015, respectively, for films annealed at 900 °C. The interface trap density was 2.5×10¹¹ cm⁻² eV⁻¹, and flatband voltage was −0.38 V. A charge storage density of 22.8 fC/μm² was obtained at an applied electric field of 3 MV/cm. The leakage current density was lower than 4×10⁻⁹ A/cm² up to an applied electric field of 6 MV/cm.     

基于金刚石薄膜的微间隙室制备

采用金刚石薄膜作为阴-阳极间绝缘介质层是一种新型的微间隙室(MGC)结构。该文详细介绍和讨论了采用常规的微细加工工艺制备基于金刚石薄膜介质层的MGC的制备技术,其典型结构为阳极微条宽20μm,微条间隔180μm,器件探测区面积为38 mm×34 mm。采用热丝CVD法制备的金刚石薄膜作为阴-阳极间绝缘介质层,厚7~8μm,具有(100)晶面结构。金刚石的刻蚀采用反应离子刻蚀,Cr作掩膜,O2和SF6为刻蚀气体,刻蚀速率为79 nm/min,与Cr的刻蚀比约为20:1。实验结果表明,采用的微加工结合自套准工艺可很好地解决金刚石薄膜的制备、图形化及金属阳极电极与金刚石薄膜的相互套准等金刚石薄膜的可加工性及兼容性问题,并制备出采用金刚石薄膜作为电极间绝缘介质层的新型MGC结构。     

Film morphology and reaction rate for the CVD of tungsten by the WF6—SiH4 reaction

Journal of Electronic Materials - Low pressure chemical vapor deposition (LPCVD) of tungsten (W) by SiH4 reduction of WF6 on Si(100) surfaces was studied in a single-wafer, cold-wall reactor over a...     

VHF-PECVD制备微晶硅材料的均匀性及其结构特性的分析

采用VHF-PECVD技术在多功能系统(cluster tool)中制备了系列硅薄膜，研究薄膜的均匀性及电学特性和结构特性。结果表明：气压和功率的合理匹配对薄膜的均匀性有很大的影响；材料的喇曼测试和电学测试结果表明微晶硅薄膜存在着纵向的结构不均匀，在将材料应用于器件上时，必须要考虑优化合适的工艺条件；硅烷浓度大，相应制备薄膜的晶化程度减弱，即薄膜中非晶成分增多。     

Morphological and chemical study of the initial growth of CdS thin films deposited using an ammonia-free chemical process

We study the initial growth stages of CdS thin films deposited by an ammonia-free chemical bath deposition process. This ammonia-free process is more environmentally benign because it reduces potential ammonia release to the environment due to its high volatility. Instead of ammonia, sodium citrate was used as the complexing agent. We used atomic force microscopy (AFM), Rutherford backscattering (RBS) and X-ray photoelectron spectroscopy (XPS) to investigate the morphological and chemical modifications at the substrate surface during the first initial stages of the CdS deposition process. Additionally, X-ray diffraction (XRD) and optical transmission spectroscopy measurements were carried out to compliment the study. XPS results show that the first nucleation centers are composed by Cd(OH)₂ which agglomerate in patterns of bands, as demonstrated by AFM results. It is also observed that the conversion to CdS (by anionic exchange) of the first nucleus begins before the substrate surface is completely covered by a homogenous film.