PCB孔金属化几种制作工艺的分析

本文主要阐述了PCB孔金属化过程中化学沉薄铜、化学沉中铜、化学沉厚铜及直接电镀等几种工艺的使用及其优劣性。     

扬长避短

通过这故事说明,在许多创新过程中,正是沿着“顺应特点、利用特点”这条路子走出来的。     

XRF在外壳镀层厚度测试中的正确应用

介绍了在外壳检验中,应用X射线荧光光谱法(XRF),对外壳的镀涂层厚度进行测试;探讨了金属外壳镀镍涂层厚度的测试方法;论述了应用X射线荧光光谱法正确测量外壳镀层的方法。     

The effects of bath composition on the morphologies of electroless nickel under-bump metallurgy on Al input/output pad

The electroless nickel plating on an aluminum input/output (I/O) pad was investigated. The aluminum pad was pretreated in a zincate solution prior to electroless nickel plating. Zinc particles on the aluminum pad gave a good adherent nickel layer. The adhesion and uniformity of zinc on the aluminum is the key factor in under-bump metallurgy (UBM). The electrode potential changes with and without zinc ions in the bath were measured to analyze the sequence of two competing reactions: zinc deposit and hydrogen evolution. The relationship between aluminum dissolution and the ratio of zinc and NaOH was investigated. The electroless nickel deposition rate was dependent on bath composition. The effects of complexing ligand and additive on the nickel deposit were analyzed. Electrode potential changes were measured with time to confirm nucleation and grain growth. Adhesion of the UBM was related to zinc-particle dissolution and nickel nucleation. The uniform nickel UBM was fabricated on a real Al I/O pad.     

Investigation of electroless cobalt-phosphorous layer and its diffusion barrier properties of Pb-Sn solder

The capability of a cobalt-phosphorous [Co(P)] layer, which was grown via the electroless plating process, to serve as the diffusion barrier of lead-tin (PbSn) solder was investigated in this work. The Auger electron spectroscopy (AES) and energy dispersive spectrometry (EDX) indicated that the phosphorous contents in Co(P) films decrease with increasing film thickness and that the average contents are no less than 8.7 at.% for the specimens prepared in this work. X-ray diffraction in conjunction with composition analyses revealed that the electroless Co(P) layer was a mixture of amorphous and nanocrystalline structures; however, the AES depth profile and subsequent analyses indicated that the first-formed Co(P) layer should be amorphous because it contains as much as 18 at.% P. This implied a good barrier capability for electroless Co(P) because, as revealed by EDX line scan, the Sn and Cu atoms could not penetrate the Co(P) layer after the PbSn/Cu/Co(P)/Cu/Ti/Si sample was subjected to annealing at 250°C in a forming gas ambient for 24 h. The fact that Sn and Cu underlayers could not penetrate the Co layer after such a liquid-state annealing step was evidence that the Co(P) layer may simultaneously serve as a diffusion-barrier interlayer dielectric and as an under-bump metallization for flip-chip copper (Cu) ICs.     

谈电子产品中铝制件预处理工艺配方

随着电子技术的发展，电子产品中铝制件电镀愈来愈多。铝制件电镀质量的好坏，预处理是关键。就浸锌酸盐和浸锌镍合金两种预处理工艺配方在本厂生产中的实际应用情况作以比较。     

电刷镀镍纳米镀层的结构和磨损性能

应用电刷镀技术,以快速镍镀液制备了镍纳米镀层;用X射线衍射仪和原子力显微镜分析了经不同温度下热处理后的镍刷镀层的结构和晶粒尺寸,并测定了刷镀层的显微硬度和耐磨性能.结果表明:镀层的晶粒大小随热处理温度的升高先降低而后增大,经300 ℃热处理后的镍纳米镀层的晶粒尺寸小于30 nm;镍镀层在300 ℃左右热处理时表现出较明显的强化趋势,相应镀层的晶粒尺寸最小、硬度最大;而镀层的耐磨性随热处理温度的变化与镀层的硬度略有不同,经200 ℃热处理后的镍镀层的耐磨性能最好.     

搅拌速率对β-PbO_2-CeO_2-ZrO_2复合电极材料电化学性能的影响

为了提高三价铬镀铬工艺中阳极材料的性能,采用阳极氧化法制备了掺杂纳米颗粒的β-Pb O2-Ce O2-Zr O2复合电极材料。通过扫描电化学显微镜和析氧极化曲线的测量,考察了不同搅拌速率条件下制备的复合电极材料在硫酸盐体系三价铬镀液中的电催化活性,利用塔菲尔曲线考察了复合电极材料的耐蚀性,并辅以扫描电镜表征了电极材料的微观形貌。结果表明:当施镀搅拌速率为350 r·min-1时,所制备的复合电极材料具有结构致密、电催化活性高、耐蚀性强等特点。     

氮化钛微粉增强镍磷化学复合镀层的组织及其摩擦磨损性能研究

利用自蔓延高温合成法得到的氮化钛微粉制备了Ｎｉ－Ｐ－ＴｉＮ化学复合镀层，采用Ｘ射线衍射仪，扫描电子显微镜和电子探针分析了镀层的组织和结构，并在球－块摩擦磨损试验机上对镀层的摩擦学特性进行了研究，结果表明，ＴｉＮ微粉可使Ｎｉ－Ｐ化学镀层的组织明显细化，且能提高镀层的最佳时效硬化温度随着Ｎｉ－Ｐ－ＴｉＮ化学复合镀层中ＴｉＮ共析量的增摩擦系数逐渐降低并趋于稳定，耐磨性则存在的一个最佳ＴｉＮ含量；ＴｉＮ微     

激光预处理基体细化铬层晶粒的电镀机理研究

为了揭示激光淬火预处理钢基体细化镀铬层界面晶粒的电镀机理,采用理论和试验相结合的方法进行了理论分析和试验验证。用化学腐蚀法制备了铬层/激光离散预处理基体界面的两侧（铬层界面与基体界面）,利用扫描电镜研究了铬层界面晶粒形貌,利用激光粗糙度仪测量了基体界面粗糙度;借助电镀理论构建了以过电位为中间变量的铬层界面晶粒尺寸和基体界面粗糙度关系分析模型;取得了粗糙度与晶粒尺寸呈正比的试验结果和粗糙度与晶粒尺寸呈正比的理论关系,得到了淬火预处理钢基体细化镀铬层界面晶粒的电镀机理。结果表明,激光淬火预处理钢基体得到的较小粗糙度可以提高过电位,过电位的提高减小了铬层界面晶粒尺寸。这一结果对进一步解释激光淬火预处理可以提高基体/铬层界面结合强度是有帮助的。