超细铜粉的化学镀锡及其抗氧化性能研究

以水合肼还原法制备出平均粒径约1μm的超细铜粉,并对其进行化学镀锡。研究了镀锡层对复合粉末微观形貌及抗氧化性能的影响。结果表明:镀覆质量分数50%的锡后,复合粉末平均粒径有所减小,但在空气中的氧化起始温度从120℃提高到220℃,与镀银层相比,镀锡层在较低温度区间对铜粉抗氧化具有优势。     

电磁型微电机定子绕组的研制

本文主要阐述应用微细加工技术研究和开发电磁型微电机定子绕组的制备工艺，重点介绍制备定子绕组所涉及到的各种材料及其用途。采用掩模电镀技术解决了平面工艺难以解决的线圈绕组。本研究结果为双层十七圈三对六组绕组系统。最小线宽为３μｍ，微电机直径为２ｍ，最大工作电流１２０ｍＡ，电阻值在２４－２５Ω之间。输出力矩为１．５μＮＭ，转子转速每分钟可达５００转。     

微马达转子电镀导磁层的研究

本文推荐一种镀液，用于制作电磁型微电机转子坡莫合金导磁层，研究了该镀液的组成和工作条件对镀层成份和内应力的影响，表明该镀液具有可供选用的电流密度范围宽，允许较高Ｆｅ２－浓度和镀层内应力低等优点。     

脉冲偏压电弧离子镀TiO2薄膜的力学与光学性能

用脉冲偏压电弧离子镀技术在玻璃基片上制备均匀透明的TiO₂薄膜.利用X射线衍射仪、原子力显微镜、扫描电子显微镜、紫外-可见透射光谱仪和纳米压痕仪等手段,对不同脉冲负偏压下合成薄膜的相结构、微观结构、表面形貌、力学和光学性能进行表征.结果表明，沉积态薄膜为非晶态.脉冲负偏压对薄膜性能有明显的影响.随偏压的增加，薄膜厚度、硬度和弹性模量均先增大后减小，前者峰值出现在100—200 V负偏压范围，后两者则在250—350V范围.300 V负偏压时薄膜硬度最高，薄膜达到原子级表面光滑度，均方 关键词： 2薄膜')" href="#">TiO₂薄膜 脉冲偏压电弧离子镀 硬度 折射率     

Microstructure of External Stress Whiskers and Mechanical Indentation Test Method

Lead-free commercial products have been dramatically increasing in the world markets as the restriction of certain hazardous substances (RoHS) directive in the European Union has been enacted. At the same time, the problem of “tin whiskers” has become one of the most serious problems in the industry. Growth of tin whiskers is believed to be related to residual stress inside the tin plating film and external compressive stress. Whiskers in fine-pitch connectors have affected the practical production of advanced digital equipment. The Japan Electronics and Information Technology Industries Association (JEITA) has proposed a new testing method to evaluate tin whiskers, especially for the fine-pitch connectors. This paper describes the microstructures of external stress whiskers and the mechanical indentation test method.     

A Novel Electroless Process for Embedding a Thin Film Resistor on the Benzocyclobutene Dielectric

To realize embedded resistors on multilayer benzocyclobutene (BCB) either on-chip or on-board, a low-cost large format electroless process for deposition of NiP and NiWP thin-film resistors using both low-temperature (25°C) and high-temperature (90°C) baths has been developed. The electroless process exhibits uniform resistor thickness in the submicron range and offers low profile and excellent adhesion to the BCB dielectric layer. The resistor films also act as a seed layer for direct electroplating of copper traces. The NiP alloys can also be tailored to a variable temperature coefficient of resistance (TCR) with different alloy compositions. The electroless process can be adopted in the PCB manufacturing industries with no additional investment. This article is the first report on electroless plated thin film resistors on low loss BCB dielectric.     

PCB技术的革新与进步

文章概述了近几年来在PCB工业中生产技术的革新与进步情况,特别是直流电镀(镀层均匀性、填孔镀等)、表面涂(镀)覆(化学镀镍/钯浸金和直接浸金等)技术的革新与进步,推动了PCB工艺技术的发展。     

Comparison of Bottom-up Filling in Electroless Plating with an Addition of PEG,PPG and EPE

The bottom‐up filling capabilities of electroless copper plating bath with an addition of additives, such as polyethylene glycol (PEG), polypropylene glycol (PPG) and triblock copolymers of PEG and PPG with ethylene oxide terminal blocks termed EPE, were investigated by the cross‐sectional scanning electron microscopy (SEM) observation of sub‐micrometer trenches. Though three additives had inhibition for electroless copper deposition, the suppression degrees of three additives were different. EPE‐2000 had the strongest suppression for electroless copper deposition, and the suppression of PEG‐2000 was the weakest. The bottom‐up filling capability of electroless copper was investigated in a plating bath containing different additives with the concentration of 2.0 mg/L. The cross‐sectional SEM observation indicated the trenches with the width of 280 nm and the depth of 475 nm were all completely filled by the plating bath with an addition of EPE‐2000, but the trenches were not completely filled by the plating bath with an addition of PEG‐2000 or PPG‐2000, and some voids appeared. Linear sweep voltammetry measurement indicated that three additives all inhibited the cathodic reduction reaction and the anodic oxidation reaction, and the inhibition of EPE‐2000 was the strongest among three additives, which agreed with that of the deposition rate of electroless copper. Significant differences in surface roughness of deposited copper film were observed by UV‐visible near‐infrared for different suppressors, and the bright and smooth of deposited copper film were in accordance with the inhibition of three additives.     

络合滴定法测定低压流体输送用镀锌焊接钢管镀锌层重量

介绍了利用络合滴定法测定低压流体输送用镀锌焊风管镀锌层重量的方法，试样用稀硫酸溶解，在ＰＨ１．５￣２．０的弱酸性介质中，以磺基水杨酸钠为指标剂，用ＥＤＴＡ滴定铁，调ＰＨ为５．５，以ＰＡＮ为指示剂，用ＥＤＴＡ滴定锌，由ＥＤＴＡ用量求出锌的重量，用ＧＢ／Ｔ３０９１－９３方法比较，试验结果满意。     

Effect of oxygen addition on the hydrogen production from ethanol steam reforming in a Pd–Ag membrane reactor

In this communication, a porous stainless steel (PSS) tube was electrolessly plated into Pd–Ag membrane reactor which was used for separating hydrogen produced in an ethanol steam reforming reaction with the addition of oxygen, which has not been reported before. Palladium and silver were deposited on porous stainless steel tube via the sequential electroless plating procedure with an overall film thickness of 20 μm and Pd/Ag weight ratio of 78/22. Ethanol–water mixture (n_water/n_ethanol = 1 or 3) and oxygen (n_oxygen/n_ethanol = 0.2 or 0.7) were fed concurrently into the membrane reactor packed with MDC-3. The reaction temperatures were set at 593–723 K and the pressures 3–10 atm. The effect of oxygen addition plays a vital role on the ethanol steam reforming reaction, especially for the Pd–Ag membrane reactor in which a higher flux of hydrogen is required. If oxygen in the feed is not sufficient, it would be possible that steam reforming reaction prevails. Inversely, high O₂ addition will shift the reaction scenario to be partial oxidation dominating, and selectivity of CO₂ increases with increasing oxygen feed. At high pressure, autothermal reaction of ethanol would be easily reached.