MBE growth of HgCdTe on silicon substrates for large-area infrared focal plane arrays: A review of recent progress

We review the rapid progress that has been made during the past three years in the heteroepitaxial growth of HgCdTe infrared detector device structures on Si substrates by molecular-beam epitaxy. The evolution of this technology has enabled the fabrication of high performance, large-area HgCdTe infrared focal-plane arrays on Si substrates. A key element of this heteroepitaxial approach has been development of high quality CdTe buffer layers deposited on Si(112) substrates. We review the solutions developed by several groups to address the difficulties associated with the CdTe/Si(112) heteroepitaxial system, including control of crystallographic orientation and minimization of defects such as twins and threading dislocations. The material quality of HgCdTe/Si and the performance of HgCdTe detector structures grown on CdTe/Si(112) composite substrates is reviewed. Finally, we discuss some of the challenges related to composition uniformity and defect generation encountered with scaling the MBE growth process for HgCdTe to large-area Si substrates.     

Integration of 256×256 Element Si Microlens Arrays with PtSi IR Detector Array Devices

Diffractive 11-phase-level Si microlens arrays are fabricated by a special method, i.e. part-etching. The method can increase focal length of diffractive microlens arrays. By using this method, the microlens arrays on the back side of the Si substrate and PtSi IR focal plane arrays(FPAs) on the front side of the same wafer are monolithically integrated together. The IR response characteristics of the integrated devices are improved greatly.     

64×64元GaAs／AlGaAs多量子阱长波红外焦平面研制

报道了64×64 元GaAs/AlGaAs 多量子阱凝视型红外焦平面的研制,器件的平均响应率为RP= 7.24×105V/W,器件的平均黑体探测率为Db = 5.40×108cm ·Hz1/2/W ,峰值波长为λP= 8.2μm ,不均匀性小于20% ,并应用研制成的器件获得了室温物体的热像图     

320 × 256 Short-/Mid-Wavelength dual-color infrared focal plane arrays based on Type-II InAs/GaSb superlattice

Short-/Mid-Wavelength dual-color infrared focal plane arrays based on Type-II InAs/GaSb superlattice are demonstrated on GaSb substrate. The material is grown with 50% cut-off wavelength of 2.9 μm and 5.1 μm for the blue channel and red channel, separately at 77 K. 320 × 256 focal plane arrays fabricated in this wafer is characterized. The peak quantum efficiency without antireflective coating is 37% at 1.7 μm under no bias voltage and 28% at 3.2 μm under bias voltage of 130 mV. The peak specific detectivity are 1.51 × 10¹² cm·Hz^1/2/W at 2.5 μm and 6.11x10¹¹ cm·Hz^1/2/W at 3.2 μm. At 77 K, the noise equivalent difference temperature presents average values of 107 mK and 487 mK for the blue channel and red channel separately.     

4×288 readouts and FPAs properties

Analysis of four types 4×288 designed and manufactured readouts is presented. All the readouts have the direct injection input circuit with the circuits incorporated that allows testing procedure of readouts without the photodiodes attached to readout circuits. TDI registers have three delay elements between neighbouring inputs. Some characteristics of 4×288 FPAs with mercury-cadmium-telluride (MCT) arrays are presented too. Analysis have shown that in spite of different constructions of four readout types, different numbers of outputs and external service, rather similar parameters of FPAs have been obtained. Detectivity values measured for all 4×288 FPAs at operation temperature T ≈ 78 K with skimming mode included and background temperature T_b ≈295 K were in the range D*_λ ≅ (1.2−1.7)×10¹¹ cmHz^1/2/W.     

MBE HgCdTe on Alternative Substrates for FPA Applications

Results of first-principles calculations and experiments focusing on molecular beam epitaxy (MBE) growth of HgCdTe on the alternative substrates of GaAs and Si are described. The As passivation on (2 × 1) reconstructed (211) Si and its effects on the surface polarity of ZnTe or CdTe were clarified by examining the bonding configurations of As. The quality of HgCdTe grown on Si was confirmed to be similar to that grown on GaAs. Typical surface defects in HgCdTe and CdTe were classified. Good results for uniformities of full width at half maximum (FWHM) values of x-ray rocking curves, surface defects, and x values of Hg_1−x Cd _x Te were obtained by refining the demanding parameters and possible tradeoffs. The sticking coefficient of As₄ for MBE HgCdTe was determined. The effects of Hg-assisted annealing for As activation were investigated experimentally and theoretically by examining the difference of the formation energy of As_Hg and As_Te. Results of focal-plane arrays (FPAs) fabricated with HgCdTe grown on Si and on GaAs are discussed.     

金属硅化物及其在肖特基势垒IRCCD焦平面阵列中的应用

叙述了金属硅化物的形成、组分、性质和金属硅化物形成过程中的问题。简述了金属硅化物的形成机理、分析技术及其在金属硅化物(Pd_2Si,PtSi 和IrSi)肖特基势垒红外电荷耦合器件焦平面阵列中的应用。     

InAs/GaSb II类超晶格红外焦平面台面的 ICP 刻蚀研究

本文报道了采用Cl2/N2电感耦合等离子（ICP）组合体刻蚀工艺在InAs/GaSb II类超晶格红外焦平面台面加工过程中的研究结果,实验采用分子束外延技术在GaSb衬底上生长的PIN型超晶格材料。结果表明,气体流量比例直接对刻蚀速率和刻蚀形貌产生影响,氯气含量越高,刻蚀速率越大,当氮气含量增加,刻蚀速率降低并趋于一定值。当氯气和氮气的流量比例和等离子腔体内压力等参数一定时,随着温度升高,刻蚀速率和选择比在有限范围内同时线性增大,台面的倾角趋于直角,台面轮廓层状纹理逐渐消失,但沟道内变得粗糙不平,并出现坑点。在实验研究范围内,电感耦合等离子源的ICP功率和RF功率对刻蚀结果产生的影响较小。     

高质量HgCdTe薄膜的液相外延生长

用固态HgTe作为Hg补偿源，采用开管、水平滑块推舟的富Te液相外延(LPE)方法在碲锌镉(Cd1-yZnyTe，y=0．04)衬底上外延生长大面积Hg1-xCdxTe(x=0．2)薄膜材料，通过适当的生长条件得到组分均匀、结构完整、表面形貌良好的长波碲镉汞薄膜。测试结果表明本方法生长的HgCdTe薄膜能满足目前研制红外焦平面器件的要求。     

128×1元GaAs／AlGaAs多量子阱扫描红外焦平面的红外成像

研制成功了１２８×１元ＧａＡｓ／ＡｌＧａＡｓ多量子阱扫描型红外焦平面（ＦＰＡｓ），器件的响应率达到ＲＰ＝２．０２×１０＾６Ｖ／Ｗ，截止波长为λ＝８．６μｍ，根据常规的黑体探测率定义，得到器件的黑体探测率为Ｄｂ＝２．３７×１０＾６ｃｍ．Ｈｚ／Ｗ，并最终获得了清晰的曙物体残留热像图。