数字集成电路的常见故障及原因

随着电子技术的迅速发展,电子电路中的一部分分立元件,已经被越来越多的集成电路所替代。文中指出了一些数字电路和数字集成电路的常见故障现象和形成原因。     

电子组装中的可制造性设计

制造业的竞争日益激烈,降低产品成本、提高产品质量和缩短产品开发周期已成为企业生产和发展的关键。在这种形势下,并行工程作为一种有效的解决方案正在逐步发展起来。在并行工程环境下,面向制造的设计(DFM)是一项重要的技术,它通过在产品设计阶段充分考虑与制造有关的约束,全面评价产品设计和工艺设计,并提供改进的反馈信息,从而保证产品设计、工艺设计和制造一次成功,并尽可能降低制造成本。本文就电子产品组装过程中需考虑的一些可制造性设计因素进行阐述,希望能对相关工程设计人员有所帮助。     

印刷纸电池及其在无线温度传感标签中应用

文章介绍了纸电池的基本结构和印刷制备方法，并讨论了印刷纸电池在无线温度传感标签中的应用。     

中国印刷电子产业现状与前景展望

介绍了印刷电子的基本定义，印刷电子所涉及的产业领域，以及国外对印刷电子技术的研发投入情况。重点介绍了国内自2009年以来印刷电子的发展情况，特别是产业技术开发情况。分析了中国发展印刷电子产业的优势，并对未来印刷电子对中国一些产业领域的影响做了预测。     

常系数乘法器的进化生成

文章提出了一种十分有效的基于图进化的优化技术，并成功地解决了16－比特常系数乘法器的设计问题。实验结果充分表明，在大部分情形下，通过进货技术自动生成的乘法器的性能胜过使用常规的计算算术算法设计的乘法器。这项研究同时也充分表明，我们提出的基于图的进化技术能够有效地简化和加速计算算术电路的设计过程。     

Cover Picture: Fabrication of Multicomponent Microsystems by Directed Three‐Dimensional Self‐Assembly (Adv. Funct. Mater. 5/2005)

Directed three‐dimensional self‐assembly to assemble and package integrated semiconductor devices is demonstrated by Jacobs and Zheng on p. 732. The self‐assembly process uses geometrical shape recognition to identify different components and surface‐tension between liquid solder and metal‐coated areas to form mechanical and electrical connections.The components (top left) self‐assemble in a turbulent flow (center) and form functional multi‐component microsystems (bottom right) by sequentially adding parts to the assembly solution. The technique provides, for the first time, a route to enable the realization of three‐dimensional heterogeneous microsystems that contain non‐identical parts, and connecting them electrically. We have developed a directed self‐assembly process for the fabrication of three‐dimensional (3D) microsystems that contain non‐identical parts and a statistical model that relates the process yield to the process parameters. The self‐assembly process uses geometric‐shape recognition to identify different components, and surface tension between liquid solder and metal‐coated areas to form mechanical and electrical connections. The concept is used to realize self‐packaging microsystems that contain non‐identical subunits. To enable the realization of microsystems that contain more than two non‐identical subunits, sequential self‐assembly is introduced, a process that is similar to the formation of heterodimers, heterotrimers, and higher aggregates found in nature, chemistry, and chemical biology. The self‐assembly of three‐component assemblies is demonstrated by sequentially adding device segments to the assembly solution including two hundred micrometer‐sized light‐emitting diodes (LEDs) and complementary metal oxide semiconductor (CMOS) integrated circuits. Six hundred AlGaInP/GaAs LED segments self‐assembled onto device carriers in two minutes, without defects, and encapsulation units self‐assembled onto the LED‐carrier assemblies to form a 3D circuit path to operate the final device. The self‐assembly process is a well‐defined statistical process. The process follows a first‐order, non‐linear differential equation. The presented model relates the progression of the self‐assembly and yield with the process parameters—component population and capture probability—that are defined by the agitation and the component design.     

改进液晶显示屏以适应电视

将液晶显示屏从桌面移到起居室不仅需要大的面板，而且需要增加对比度、改进色彩管理及响应时间等新的电子特性。     

Electrical Switching and Bistability in Organic/Polymeric Thin Films and Memory Devices

Recently, films created by incorporating metallic nanoparticles into organic or polymeric materials have demonstrated electrical bistability, as well as the memory effect, when subjected to an electrical bias. Organic and polymeric digital memory devices based on this bistable electronic behavior have emerged as a viable technology in the field of organic electronics. These devices exhibit fast response speeds and can form multiple‐layer stacking structures, demonstrating that organic memory devices possess a high potential to become flexible, ultrafast, and ultrahigh‐density memory devices. This behavior is believed to be related to charge storage in the organic or polymer film, where devices are able to exhibit two different states of conductivity often separated by several orders of magnitude. By defining the two states as “1” and “0”, it is now possible to create digital memory devices with this technology. This article reviews electrically bistable devices developed in our laboratory. Our research has stimulated strong interest in this area worldwide. The research by other laboratories is reviewed as well.     

Structure and Electrical Properties of Ni Nanowire/Multiwalled‐Carbon Nanotube/Amorphous Carbon Nanotube Heterojunctions

A one‐dimensional heterojunction is fabricated and characterized. This heterojunction comprises a Ni nanowire, a multiwalled carbon nanotube (MWCNT), and an amorphous carbon nanotube (a‐CNT). The three components are in an end‐to‐end configuration, and form two MWCNT contacts, namely a Ni/MWCNT and an MWCNT/a‐CNT contact. The interfacial structures of the two contacts show that multiple outer walls in the MWCNT simultaneously contact the Ni nanowire and the a‐CNT, and can simultaneously participate in electrical transport. By investigating the electrical‐transport properties of the heterojunctions, the two contacts to the MWCNT in every heterojunction are found to behave as two diodes connected in series face‐to‐face, at least one of which exhibits the characteristics of a nearly ideal Schottky diode and obeys thermionic‐emission theory, wherein only the image force lowers the Schottky barrier. The appearance of this type of nearly ideal diode is attributed to the good contacts to the multiple outer walls of the MWCNTs realized by the heterojunctions' structures.     

显示电子学和软件

在显示屏上和屏外，就显示器件和显示系统的性能而言，电子学和软件至少与显示屏本身一样重要，而且它们能够降低成本。