ICF靶用泡沫铜的制备与表征

 以次磷酸钠为还原剂的化学镀进行导电化处理,研究了ICF靶用泡沫铜的电沉积工艺。采用扫描电子显微境和X射线衍射仪对制备过程中各阶段泡沫铜的微观结构进行了表征。结果表明：经化学镀后可获得晶粒尺寸小、分布均匀的铜沉积层。电沉积后铜沉积层主要由0.55 μm的小颗粒组成,并且出现突出大颗粒的形貌特征。在氢气氛围下,经700 ℃热处理后,铜颗粒进一步长大,沉积层结晶致密。制备的泡沫铜呈3维网络状结构,分布均匀,密度为0.19 g/cm³,孔径分布为400～600 μm,孔隙率达97.9％。     

电镀铜实验中镀层性质及其影响因素的探究*

电镀实验是电解原理应用的重要案例,通过实验不仅要获得定性的感性认知,还应该获得定量的理性数据。针对电镀铜实验,通过改变铜离子浓度、pH、电解时间、电解电压和电解温度等因素,探究其对镀层厚度、均匀性和致密性等性质的影响,在电解原理的基础上分析其形成机制,从而确定了电镀铜较适宜的操作条件,以此为学生开展电镀实验提供参考案例与研究思路。     

Nip the Sodium Dendrites in the Bud on Planar Doped Graphene in Liquid/Gel Electrolytes

Sodium (Na) metal is the most promising alternative anode to metallic lithium for high‐energy batteries due to the low cost and high abundance of Na resources, but it suffers from severe dendritic/mossy growth at high current densities. Understanding Na nucleation/growth mechanism in different electrolyte systems is the key to tackling this issue but is complicated by the structural complexities of existing substrates for Na plating/stripping. Herein, well‐defined planar doped graphene substrates are synthesized as model plating platforms to unravel a binding energy dominant Na nucleation‐growth mode. The dopants (e.g., boron) in doped graphene and the regions close to the dopants possess high binding energies with Na atoms, providing abundant preferential nucleation sites and contributing to uniform Na plating/stripping. Accordingly, the boron‐doped graphene regulated Na anode exhibits long‐term stability at high current densities in both liquid and polymer electrolytes. The results enhance the understanding of Na nucleation/growth for stabilizing Na metal batteries.     

微波印制电路板加工工艺探索

本文主要结合当下微波通讯技术的迅猛发展——微波通讯设备日趋模块化、小型化、高密度化,简要阐述了微波印制电路板及其制作优势和缺点,如基材选用多样化、设计与制造的高精度化等.就微波印制电路板加工工艺,分别从选材、对生产环境适应性的要求、合理选用工艺流程、工程材料的处理和下料、钻孔和导通孔接地、图形转移、蚀刻与涂镀以及成型等方面进行了详细探讨.     

超高导热金刚石铜复合材料在GaN器件中的应用

金刚石铜具有高导热率和低膨胀系数,可用于大功率芯片的散热热沉.未做处理的金刚石表面非常光滑,不易附着其他金属,由于金刚石性质非常稳定,不容易被强酸和强碱进行表面处理.采用JG-01金刚石铜粗化处理液对金刚石进行粗化处理,而对铜无损伤,提升了金刚石表面结合力.金刚石铜镀层对金锡(AuSn)和锡铅(PbSn)焊料的润湿性满足GJB548B-2005要求.GaN功率放大器芯片采用金刚石铜热沉比铜钼铜热沉结温可以降低12℃.金刚石铜载板镀层润湿性良好,焊接后芯片底部的空洞率不大于3％,热沉焊接后空洞率不大于5％,满足高功率芯片散热要求.按照产品环境适应要求,对GaN功率放大器做了高低温冲击和机械振动两种环境筛选实验,最终满足可靠性考核要求.     

EMI shielding performance of electroless coated iron nanoparticles on graphite in low-density polyethylene composite for X-band applications

In the proposed work, an investigation of shielding effectiveness (SE) for varying compositions of Graphene, Multiwall carbon nanotubes (MWCNT), and Iron nanoparticles coated on Graphite (Fe@Graphite) was conducted in X-band (8.2 GHz–12.4 GHz). All these are mixed in an LDPE matrix. The nanomaterial was subjected to chemical characterization, i.e., Scanning electron microscopy (SEM), X-ray diffraction (XRD), and vibrating sample magnetometry (VSM). The shielding observed is dominantly due to absorption. The lattice structure which facilitates the shielding due to absorption was the hexagonal graphite structure on whose surface iron nanoparticles were embedded and used as the magnetic filler. At the same time, Graphene and MWCNT act as electrically conducting fillers. The Total shielding effectiveness(SE_T) was maximum for LDPE, MWCNT, Graphene, and Fe@Graphite, in the ratio of 50: 5: 25: 20 by weight %, and is 49 dB at 9.65 GHz for a sample thickness of 3 mm.     

添加剂对焦磷酸盐镀铜性能的影响

铜镀层的外观呈铜红色、柔软、孔隙少,常用作钢铁件多层镀铬的中间层和钢铁件镀锡和镀银的底层,以提高基体金属和表面镀层之间的结合力.     

Influence of pulse plating conditions on the structure and properties of pure and composite nickel nanocrystalline coatings

An additive-free Watts type bath containing micron- and nano-SiC particles (1 μm and 20 nm respectively), as well as ultrafine-WC particles (200 nm), was used for the production of pure Ni and nickel matrix composite electrocoatings under both direct and pulse current conditions. Moreover, nickel nanocrystalline deposits were obtained from a Watts type bath containing small amounts of 2-butyne-1,4-diol, in order to investigate the combined advantages of additives and pulse technique on the properties of the deposits. The influence of the variable electrolysis parameters, the particle size and the organic additive concentration on the surface morphology, the structure and properties of the deposits were discussed. It has been proved that the application of pulse electrodeposition affects drastically the structural characteristics and properties of the deposits and under well-defined conditions could lead to the preparation of nanostructured materials with improved mechanical properties. Published in Russian in Elektrokhimiya, 2008, Vol. 44, No. 6, pp. 802–811. The text was submitted by the authors in English.     

电子接插件的快速连续电镀方法

介绍了适于电子接插件的快速连续电镀金、钯及Ｓｎ－Ｐｂ合金工艺的流程、操作要领等,对镀层的性能进行了分析比较,提出了快速电镀应解决的问题。     

钢铁表面Ni-Sn-P合金镀层组成及其耐蚀性

化学镀;钢铁表面Ni-Sn-P合金镀层组成及其耐蚀性