高帧速摄像器

本文介绍了高帧速摄像器的设计、制造、工作和性能。该高帧速有３６０×３６０像素、摄像速度高达５×１０５帧／秒，该摄像器读出电路类似于帧转移ＣＣＤ，由四部分组成     

Pd (II)‐catalyzed vinyl addition polymerization of novel functionalized norbornene bearing dimethyl carboxylate groups

Three novel functionalized polynorbornenes (PNB) with pendant dimethyl carboxylate group (carboxylates—acetate, propionate, and butyrate) are synthesized as a vinyl‐type with a palladium (II) catalyst in high yield. The effects of size of substitutents, molar ratio of monomer to catalyst, solvent polarity, reaction time, and temperature on the polymerization of exo‐norbornene dimethyl propionate were systematically investigated. The low molar ratio and temperature, as well as high polarity of solvent, and long reaction time, are favorable for the enhancement of the monomer conversion, especially, the solvent have an obvious effect on the catalyst activity. The resulting poly(cis‐norbornene‐exo‐2,3‐dimethyl carboxylates) (PNB‐dimethyl carboxylates) show good solubility in common organic solvent and high thermal stability up to 360 °C. The glass transition temperature was detected by DMA at 331, 324, and 318 °C for acetate, propionate, and butyrate, respectively. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 3391–3399, 2007     

Synthesis of poly(p‐phenylene sulfide) from bis(4‐bromophenyl) disulfide

Improved reaction conditions for the preparation of poly(p‐phenylene sulfide) (PPS) directly from bis(4‐bromophenyl) disulfide (BBD) have been established. Heating BBD with magnesium metal afforded only a low molecular weight polymer. PPS with a melting temperature around 280 °C was obtained from BBD in the presence of sodium carbonate or zinc metal. The best results were obtained with the addition of a catalytic amount of KI to the zinc–BBD mixture. Polymers prepared by the above methods are semicrystalline and dissolve in 1‐chloronaphthalene and have properties comparable to commercial PPS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 900–904, 2006     

Lithographic design of photosensitive polyarylates based on reaction development patterning

The factors affecting pattern‐forming properties in reaction development patterning were examined with polyarylates with various bisphenol moieties. The developability of the photosensitive polyarylates was dependent on the properties of the subtituent (R) in the bisphenol moieties. The development time decreased in the following order: R?C(CH₃)₂ > fluorenyl unit ? phenolphthalein unit > C(CF₃)₂ > SO₂. This order agreed with that of the reactivity between the polyarylates and ethanolamine, and these orders can be explained by pK_a of the bisphenol used to prepare the polyarylates. The development with NH₂? R′? OH resulted in successful positive‐tone pattern formation. However, pattern formation with the developers containing NH₂? R′? OCH₃ was unsuccessful. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2694–2706, 2006     

电子碰撞诱导原子从低激态向高激态弛豫

本文根据空心阴极放电中电子能量分布的物理图象,分析了原子从低激态向高激态弛豫的可能途径。建立高低激态集居数密度增量的关系。讨论高激态集居数密度增量获得可观量的条件。根据此条件分别选取钠原子的基态3s~2S_(1/2)和铜原子的亚稳态4s~2D_(3/2)为与激光共振的下能级,并激发具有较大自发发射几率的3s~2S_(1/2)→3p~2P°_(1/2)(和3p~2P°_(3/2))和4s~2D_(3/2)→4p~2P°_(1/2)跃迁,在远离上能级的高激态上观测到敏化荧光,并精确测得这些态的自发发射系数比值,而在更高激态上没有观测到敏化荧光,表明讨论中提出的条件是合理的。     

测量高功率激光的体吸收能量计

叙述了体吸收激光能量计的特点，介绍了其标定方法，给出了其技术参数。体吸收激光地的推广应用取得了广泛的社会效益。     

神光装置放大自发辐射输出特性测量

讨论了大型激光装置放大自发辐射输出的一般特性，给出了神光装置放大自发辐射特性的测量结果。     

Image segmentation towards new image representation methods

Very low bit-rate video coding has recently become one of the most important areas of image communication and a large variety of applications have already been identified. Since conventional approaches are reaching a saturation point, in terms of coding efficiency, a new generation of video coding techniques, aiming at a deeper “understanding” of the image, is being studied. In this context, image analysis, particularly the identification of objects or regions in images (segmentation), is a very important step. This paper describes a segmentation algorithm based on split and merge. Images are first simplified using mathematical morphology operators, which eliminate perceptually less relevant details. The simplified image is then split according to a quad tree structure and the resulting regions are finally merged in three steps: merge, elimination of small regions and control of the number of regions.     

A fixed-point equation for the high-temperature phase of discrete lattice spin systems

A fixed-point equation on an infinite-dimensional space is proposed as an alternative to the usual definition of the infinite-volume limit in discrete lattice spin systems in the high-temperature phase. It is argued heuristically that the free energy and correlation functions one obtains by solving this equation agree with the usual definitions of these quantities. A theorem is then proved that says that if a certain finite-volume condition is satisfied, then this fixed-point equation has a solution and the resulting free energy is analytic in the parameters in the Hamiltonian. For particular values of the temperature this finite-volume condition may be checked with the help of a computer. The two-dimensional Ising model is considered as a test case, and it is shown that the finite-volume condition is satisfied for0.77 _critical.     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.