基于CH365型接口和MCX314As型运动控制器的PCI总线运动控制卡设计

以CH365型PCI总线接口和MCX314As型运动控制器为核心硬件,自主研发了基于运动控制器的PCI总线运动控制卡,该控制卡能够实现4轴位置、速度和S曲线的加减速控制,具有直线、圆弧、位模式插补功能及自动原位搜寻功能,同时具有4路信号输入和8路通用输出.     

Towards advanced circuit board materials: adhesion of copper foil to ultra‐high molecular weight polyethylene composite

Polyethylene based composites are attractive materials for advanced circuit board applications because of their unique combination of properties: low dielectric constant and loss factor, light weight, high flexural modulus and low thermal expansion coefficient controlled in all spatial directions. This investigation describes a process to consolidate chopped fibers of ultra‐high molecular weight polyethylene concurrently with its bonding to a copper foil. Bonding is affected by a thin sheet of low‐density polyethylene, incorporating a crosslinking agent with a concentration gradient across the sheets thickness. In this single step process, the composite material is formed and bonded to the metal foil, achieving good adhesion without the use of extraneous glue. Copyright © 2002 John Wiley & Sons, Ltd.     

Economic modeling of board test strategies

A long and deep recession, coupled with continuous competitive pressure to reduce costs, is forcing many companies to review their test strategies. Testing costs have become a more significant proportion of the overall manufacturing cost even though manufacturing yields have increased dramatically over the past ten or twelve years. This causes attention to be focused on testing costs as a key source of cost reduction. The increased use of DFT and the integration of design and test are very positive moves towards controlling testing costs but other methods employed can often backfire. The increased use of low priced testers is one such method. The pressure to reduce costs, higher process yields and exhortations that testing adds no value can lead the test engineering manager to take the cheap route. In reality this can often turn out to be an expensive decision. The only way to avoid expensive mistakes is to perform an economic analysis of the alternative courses of action. In most cases this is done, but not always in the right manner or with the necessary amount of detail to make the comparisons meaningful. This article discusses the need for effective cost analysis of test strategies and highlights some of the pitfalls.     

废弃线路板化学分析采样、制样及检测方法

介绍废弃线路板中有回收价值元素和有害物质分析的采样、制样及检测技术。样品经过分类采样、剪切破碎和高温灰化制样,采用样品全分析或副批混合样分析。通过提高称样量、多次测定求平均值的办法,火试金富集-重量法测定贵金属金、银。湿法王水溶解样品,碘量法测定主体元素铜。电感耦合等离子体发射光谱(ICP-AES)法测定其它杂质元素,被测元素质量浓度在0~10μg/mL范围内与光谱强度呈良好线性关系,相关系数均大于0.9998。测定结果的相对标准偏差小于10%(n=5),加标回收率为97.0%~102.5%。该方法简单、快速,有效地解决了线路板样品不均匀而难采样,以及硬度、韧性强制样难,金属易包裹难分解的技术瓶颈,测定结果准确,具有代表性。该方法适用于废弃线路板化学成分分析,其它废弃电子产品检测可参考此方法。     

Printed Circuit Board-Based Electrolyte Regulator for Laminar Microfluidics

The trench on a printed circuit board was reconstructed to fabricate a microfluidic framework that allows low-cost production for small quantities and integration with multifunctional elements. An on-chip electrolyte regulator was thus proposed on this platform to analyze diffusion properties in laminar flow. A numerical model was developed, highlighting the interplay between the electrolyte migration and hydrodynamic properties. Solutions with dissolved sodium chloride were simulated and experimentally tested for the regulation of electrical conductivity under the guidance of the normalized Nernst-Planck equation. The diffusion mechanism and the resulting concentration field were demonstrated in detail. This approach provides a satisfactory manufacturing method and a useful tool for integrated microfluidic systems.     

单板计算机的故障模式与机理及影响分析

故障模式、机理及影响分析((FMMEA）是研究产品的每个组成部分可能存在的故障模式、故障机理并确定各个故障模式对产品组成部分和功能的影响的一种可靠性分析方法。详细介绍了对单板计算机进行FM-MEA的实施过程,包括系统定义,确定潜在的故障模式,分析故障原因、故障机理、故障影响等一系列的过程。对单板计算机进行了有限元建模,并通过热应力分析和振动应力分析,得到了其在不同环境下的温度分布、振动模态等信息,为故障物理模型提供输入。利用各种故障物理模型对单板计算机各单点的故障进行了定量的计算。分析结果表明：由温度循环引起的小外形封装(SOP）的随机存储器芯片的焊点疲劳故障的故障前时间最短,是整个电路板的薄弱环节;焊点热疲劳故障为单板计算机主故障机理,在实施PHM过程中要重点监测该部位的故障状况。     

YAM机、T特性设备视放板回路的调整和对彩管色平衡的影响

本文主要讲述了视放回路的原理、调整及其对彩管会聚、色平衡的影响.为解决视放回路过长而引起的视频延迟现象,专门设计了一套视频放大板,其中包括了预视放回路、视频延迟回路、视频放大输出部分及EK恒压源回路等.     

高速高精度贴片机的贴装效率优化方法

贴片机贴装时间的优化对于工业应用有着重要的意义.贴片机贴装效率的优化问题不仅与贴片机的机械特征有关,而且受贴片机贴装方式的影响.首先根据贴片机的机械特征和贴装方式将贴片机重新分成五类;然后,对不同类型的贴片机的优化算法进行分析,找出所建立的数学模型、贴片机类型和最优化算法之间的关系;最后,对未来贴片机贴装效率的优化方向提出展望.     

高速印制电路板设计中的串扰问题和抑制

本文剖析了在高速PCB板级设计中信号完整性分析领域信号串扰的产生机制,并利用HyperLynx软件包仿真,结合工作中的实践,提出了相应的解决方案.     

基于聚酰亚胺基底的细胞电融合芯片的研制

基于柔性印刷电路板(flexible printed circuits board, FPCB)技术,通过在聚酰亚胺基底薄膜表面层压的铜箔上刻蚀微电极阵列结构制备了一种细胞电融合芯片.在低电压(≤40 V)条件下实现了细胞电融合,融合效率达37%,远高于聚乙二醇(polyethylene glycol, PEG)法及传统细胞电融合方法.与传统细胞电融合系统相比,此芯片可在低电压条件下工作,具有结构简单、成本低廉、实验过程可观察、融合通量高等优点.另外,聚酰亚胺薄膜基底良好的柔软度可保证此芯片与其它分析模块(如细胞筛选分离模块)的有效集成,具备构造微全分析系统(micro total analytical system, μ-TAS)的巨大潜力.