Lattice-point examples for a question of Erdős

Here we establish a set of eight points in general position in the plane, i.e. no three on a line, no four on a circle, and they determine 7 distinct distances, so that, thei-th distance occursi times,i = 1, 2, , 7. The points are embedded in a triangular net, and the distances are not ordered by size or in any other way. We shall show that some known and unknown examples forn < 8 with the above properties may also be lattice points of a similar net.Research (partially) supported by the Hungarian National Foundation for Scientific Research (OTKA) grant, no. 1808.     

On Super-KMS functionals and entire cyclic cohomology

We formulate the super-KMS condition suggested by Connes and Kastler, in the context of entire cyclic cohomology of quantum algebras. We show that the Chern character of Jaffe, Lesniewski, and Osterwalder — associated by Kastler to a super-KMS functional — satisfies the entire growth condition. Hence, a super-KMS functional defines a cocycle for the entire cyclic cohomology of quantum algebras.Supported in part by the National Science Foundation.     

A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

On theR-order of coupled sequences arising in single-step type methods

Summary As shown in preceding papers of the authors, the verification of anR-convergence order for sequences coupled by a system (1.1) of basic inequalities can be reduced to the positive solvability of system (3.3) of linear inequalities. Further, the bestR-order implied by (1.1) is equal to the minimal spectral radius of certain matrices composed from the exponents occuring in (1.1). Now, these results are proven in a unified and essentially simpler way. Moreover, they are somewhat extended in order to facilitate applications to concrete methods.     

Adaptive boundary element methods for strongly elliptic integral equations

Summary Integral operators are nonlocal operators. The operators defined in boundary integral equations to elliptic boundary value problems, however, are pseudo-differential operators on the boundary and, therefore, provide additional pseudolocal properties. These allow the successful application of adaptive procedures to some boundary element methods. In this paper we analyze these methods for general strongly elliptic integral equations and obtain a-posteriori error estimates for boundary element solutions. We also apply these methods to nodal collocation with odd degree splines. Some numerical examples show that these adaptive procedures are reliable and effective.This work was carried out while Dr. De-hao Yu was an Alexander-von-Humboldt-Stiftung research fellow at the University of Stuttgart in 1987, 1988     

The many limits of mixed means

The sequences introduced by Carlson (1971) are variants of the Gauss arithmetic geometric sequences (which have been elegantly discussed by D. A. Cox (1984, 1985)). Given (complex)a ₀,b ₀ we define

Convolution quadrature and discretized operational calculus. I

Numerical methods are derived for problems in integral equations (Volterra, Wiener-Hopf equations) and numerical integration (singular integrands, multiple time-scale convolution). The basic tool of this theory is the numerical approximation of convolution integrals

Methods of integral geometry and recovering a function with compact support from its projections in unknown directions

A method for recovering a function with compact support on a plane from its Radon transform is suggested. In particular, from the given projections of a function in unknown directions, these directions may be recovered (up to a rotation or a reflection), if there are 7 of them. This result may be applied in tomography.     

Interpolatory properties of best rationalL 1-approximations

In this paper the distribution of the zeros of the error function for bestL ₁-approximation by rational functions fromR _n,m is considered. It is shown that the maximal distance between such zeros isO(1/(n–m)), ifn > m.Communicated by Edward B. Saff.     

A proof of Freud's conjecture for exponential weights

LetW (x) be a function nonnegative inR, positive on a set of positive measure, and such that all power moments ofW ²(x) are finite. Let {p _n (W ²;x)} ₀ denote the sequence of orthonormal polynomials with respect to the weightW ²(x), and let {A _n } ₁ and {B _n } ₁ denote the coefficients in the recurrence relation