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41.
42.
Chip Scale Package (CSP) solder joint reliability and modeling 总被引:1,自引:0,他引:1
A viscoplastic constitutive model was used to analyze the thermally induced plastic and creep deformation and low cycle fatigue behavior of the solder joints in Chip Scale Packages (CSP) mounted on Printed Circuit Boards (PCB). The time-dependent and time-independent viscoplastic strain rate and plastic hardening work factors of solder material were used in 2-D plane strain finite element models. The viscoplastic strain rate data was fitted to the viscoplastic flow equation. The plastic hardening factors were considered in the evolution equation. A viscoelastic constitutive model was used for molding compound. Finite element models, incorporating the viscoplastic flow and evolution equations for solder and the viscoelastic equations for molding compound, were verified by temperature cycling tests on assembled CSPs. The effect of the cyclic frequency, dwell time, and temperature ramp rate on the response of the viscoplastic deformation was studied for a tapeless Lead-on-Chip (LOC) CSP and a flexible substrate CSP. The ramp rate significantly affects the equivalent stress range in solder joints while a dwell time in excess of 10 min per half cycle does not result in increased strain range. The failure data from the experiments was fitted to the Weibull failure distribution and the Weibull parameters were extracted. After satisfactory correlation between the experiment and the model was observed, the effect of material properties and package design variables on the fatigue life of solder joints in CSPs was investigated and the primary factors affecting solder fatique life were subsequently presented. Furthermore, a simplified model was proposed to predict the solder fatigue life in CSPs. 相似文献
43.
本文通过对蓬安县三元水库大坝外坡裂缝产生的原因分析,进而运用岩、土力学的理论与方法反算推论出了裂缝的产生不是深层坝体土滑动引起的,而是局部浅层坝体土在水的诱发作用下作蠕滑-拉裂变形所产生的。在明确了大坝裂缝产生的原因后,提出了一系列相应整治工程措施,以达到彻底根治裂缝和稳固大坝的目的。 相似文献
44.
To avoid the dependency on origin of time, an improved damage law for creep rupture of clays is proposed considering the accumulated inelastic deviatoric strain as a measure of damage, instead of incorporating time directly. This law is incorporated into an existing anisotropic elastoplastic-viscoplastic bounding surface model for clays. The performance of the damage law was demonstrated via the simulations of creep rupture tests on undisturbed clays, and generally a good agreement between model simulations and test data was obtained. Discussions on the creep rupture parameters were followed and further improvement was suggested. At present when high quality test data for creep rupture is very limited, the proposed damage law could serve as a practical way to model creep rupture of clays. 相似文献
45.
46.
In this paper, we make the first attempt to apply the fractal derivative to modeling viscoelastic behavior. The methodology of scaling transformation is utilized to obtain the creep modulus and relaxation compliance for the proposed fractal Maxwell and Kelvin models. Comparing with the fractional derivatives reported in the literature, the fractal derivative as a local operator has lower calculation costs and memory storage requirements. Moreover, numerical results show that the proposed fractal models require fewer parameters, have simpler mathematical expression and result in higher accuracy than the classical integer-order derivative models. Results further confirm that the proposed fractal models can characterize the creep behavior of viscoelastic materials. 相似文献
47.
In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 °C (RT), 40 °C, 50 °C, 60 °C, and 70 °C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinning could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. 相似文献
48.
《International Journal of Solids and Structures》2014,51(19-20):3372-3381
The aim of the paper is to derive the exact analytical expressions for torsion and bending creep of rods that obey the Norton–Bailey, Prandtl–Garofalo and Naumenko–Altenbach–Gorash constitutive models. The common secondary creep constitutive model is the Norton–Bailey law which gives a power law relationship between creep rate and stress. The closed form solutions for fractional Norton–Bailey creep law are derived. The analytical formulas express the torque and bending moment as functions of the time for the period of relaxation. Other formulas express the twist rate and curvature as functions of the time for the duration of engineering creep experiment. The derived formulas are suitable for the practically important problems of machinery. Namely, the formulas are relevant for calculation of hereditary effects for helical, leaf and disk springs and twisted shafts. 相似文献
49.
D.G. Morris I. Gutierrez-Urrutia M.A. Muoz-Morris 《International Journal of Plasticity》2008,24(7):1205-1223
The creep behaviour of an FeAl intermetallic strengthened by nanosized oxide particles has been examined at temperatures of 700–825 °C. For all temperatures the strain rate shows a power law dependence on the applied stress. At the lowest temperature and with the highest stresses there is evidence of a threshold stress produced by the difficulty of overcoming the particle barriers, while for higher temperatures as well as at low stresses there is no threshold stress and creep appears to be controlled by general climb. The fine oxide particles produce good strengthening at low temperatures but are more readily overcome at high temperatures due to their very small size and limited attractive relaxation force. Despite such fall in creep strength, this material remains one of the strongest iron aluminides to the temperature range evaluated. 相似文献
50.
Correlation of Cooperatively Localized Rearrangement on the “Fluidized Domain”of Polymers to Their Nonexponentially Viscoelastic Behavior and Lifetime at Double Aging Processes II: Estimation of Long-term Mechanical Behavior and Lifetime of Polymeric Mate 下载免费PDF全文
Three kinds of polymeric materials are taken as example for the verification of linear ex-trapolation method from unified master lines with reduced universal equations on creep and stress relaxation tests. The theoretical values of long-term mechanical behavior and lifetime for a cured epoxide, polypropylene, poly(methyl-methacrylate), and SBR rubber are directly evaluated with the universal equations on reduced creep compliance and reduced stress relax-ation modulus and are compared with their predicted values by the linear extrapolation from the unified master lines of creep and stress relaxation. The results show that the theoretical values of dimensional stability, bearing ability and lifetime are in an excellent agreement with the predicted values, it shows that the linear extrapolation method is more simple and reliable. The dependences of long-term mechanical behaviors and lifetime on the different aging times are discussed. 相似文献